Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

STMicroelectronics STM32MP157CAD3T

Part No.:
STM32MP157CAD3T
Manufacturer:
STMicroelectronics
Category:
Microprocessors
Package:
257-TFBGA
Datasheet:
AetrixSTM32MP157CAD3T.pdf
Description:
IC MPU STM32MP1 650MHZ 257TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,857

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

STM32MP157CAD3T from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit with 3D GPU, TFT/DSI display support, 37 communication interfaces including dual CAN FD and Gigabit Ethernet, and advanced analog peripherals including dual 16-bit ADCs. It targets Linux-capable industrial HMI, edge gateway, and multimedia-rich embedded systems requiring secure boot, TrustZone®, and DDR3/LPDDR3 memory expansion.

For engineers reviewing the STM32MP157CAD3T datasheet, STM32MP157CAD3T pinout, STM32MP157CAD3T application, or STM32MP157CAD3T equivalent, key selection considerations include dual-core asymmetric processing capability, 37 peripheral count with time-triggered CAN FD support, 708 KB on-chip SRAM split across AXI/AHB domains, TFBGA361 package compatibility, and hardware crypto acceleration (AES-256, SHA-256, TRNG).

Technical Context

The device implements an asymmetric multiprocessing architecture: two Cortex-A7 cores run Linux in secure/non-secure worlds via TrustZone®, while the Cortex-M4 handles real-time tasks, sensor fusion, or safety-critical firmware. The interconnect matrix includes a 64-bit AXI bus (266 MHz) and 32-bit AHB bus (209 MHz), enabling concurrent high-bandwidth data paths for GPU, display, and Ethernet.

Security is enforced at silicon level via BSEC OTP fuses, ETZPC memory protection, TZC DDR address filtering, active tamper detection, and isolated M4 resources. Clocking uses six fractional PLLs supporting precise audio (SAI), video (DSI), and network (GMAC IEEE 1588v2) timing requirements.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual Arm® Cortex®-A7 @ 800 MHz + single Cortex®-M4 @ 209 MHz - enables Linux + RTOS coexistence with hardware-isolated execution environments
GPUVivante® 3D GPU (OpenGL ES 2.0) - delivers 26 Mtriangle/s for UI rendering and basic graphics acceleration
Memory InterfaceLPDDR2/LPDDR3-1066 or DDR3/DDR3L-1066 up to 1 Gbyte - supports low-power mobile DRAM or cost-effective industrial SDRAM
On-chip SRAM708 KB total: 256 KB AXI SYSRAM + 384 KB AHB SRAM + 64 KB Backup SRAM + 4 KB Backup domain SRAM - enables fast code/data access with retention in Standby mode
Communication Peripherals6 × I²C, 8 × UART/USART, 6 × SPI, 4 × SAI, 2 × CAN FD (1 with TTCAN), 3 × SDMMC, 1 × GMAC - full connectivity stack for industrial fieldbus, audio, storage, and time-sensitive networking
Analog Peripherals2 × 16-bit ADCs (up to 3.6 Msps), 2 × 12-bit DACs (1 MHz), DFSDM with 8 channels - supports precision sensor acquisition and audio output without external converters
Crypto AccelerationAES-128/192/256, TDES, SHA-1/224/256, HMAC, 2 × TRNG - offloads cryptographic operations from CPU for secure boot, OTA updates, and TLS handshake acceleration

Pinout & Package

STM32MP157CAD3T is housed in a 12 mm × 12 mm TFBGA361 package with 0.5 mm pitch, RoHS-compliant and ECOPACK2 certified. Pinout conforms to B031 mechanical variant per ST's DS12505 Rev 9 (Section 7.4), featuring 361 solder balls arranged in 21 × 21 array with corner missing.

Pin/TerminalCircuit RoleDesign Meaning
VDDCORECore power supply1.1 V ±5% regulated input for CPU/GPU logic; requires local decoupling and PMIC coordination
VDDIO_3V3I/O power supply3.3 V supply for all 5 V-tolerant GPIOs; supports mixed-voltage system interfacing
NRSTSystem reset inputActive-low asynchronous reset controlling both A7 and M4 subsystems; monitored by internal PVD/BOR
BOOT0 / BOOT1Boot mode selectionTwo-pin strap configuration determining boot source (FSMC, QSPI, SDMMC, USB, etc.) during power-up
OSC_IN / OSC_OUTExternal crystal interface8–48 MHz HSE input for main system clock; supports crystal or external oscillator with load capacitance tuning
PA0–PA176General-purpose I/OUp to 176 configurable pins with interrupt, wakeup, tamper, and alternate function mapping (AF0–AF15)

Key Features

FeatureDesign Value
TrustZone®-enabled dual-core isolationHardware-enforced separation between Linux (A7) and real-time firmware (M4), preventing privilege escalation across security domains
DDR memory retention in StandbyEnables instant resume from ultra-low-power state (2 µA) without reloading OS image from flash or eMMC
MIPI DSI 2-lane interfaceSupports up to 1 Gbps per lane for direct connection to high-resolution displays (WXGA@60fps or Full HD@30fps)
Hardware semaphore (HSEM)Provides atomic resource locking across A7/M4 cores for safe inter-processor communication without software overhead
Flexible memory controller (FMC)Enables parallel interface to NOR/NAND/PSRAM with up to 8-bit ECC - eliminates need for external memory controllers in legacy designs

Applications

Industrial HMI PanelEdge Gateway Device

Use Scenario: Touch-enabled factory floor display with real-time PLC data visualization and local alarm logging.

IC Role / Device Role / Timing Role: MPU executes Linux-based Qt application, drives 7-inch TFT via LTDC+DSI, acquires analog sensor inputs via dual ADCs, and communicates with Modbus RTU over UART.

Use Value: On-chip GPU renders smooth UI animations; 708 KB SRAM buffers display frame buffers and sensor history; TrustZone isolates critical control logic from GUI stack.

Use Scenario: Smart building node aggregating BACnet MS/TP, KNX, and LoRaWAN traffic before forwarding to cloud via Ethernet or USB host-connected cellular modem.

IC Role / Device Role / Timing Role: Cortex-A7 runs Yocto Linux with protocol stacks; Cortex-M4 handles deterministic serial bus arbitration and packet timestamping using RTC sub-second accuracy.

Use Value: Dual CAN FD and 37 peripheral count eliminate external bridge ICs; IEEE 1588v2 hardware support enables sub-microsecond time synchronization across distributed nodes.

Medical Imaging TerminalAutomotive Infotainment Prototype

Use Scenario: Portable ultrasound preview station receiving DICOM frames over Wi-Fi and displaying grayscale images on integrated LCD-TFT panel.

IC Role / Device Role / Timing Role: GPU accelerates image scaling and contrast enhancement; DCMI interface captures diagnostic camera feed; SAI outputs audio alerts via stereo codec.

Use Value: Vivante GPU achieves >133 Mpixel/s throughput for real-time 1080p rendering; dual 16-bit ADCs digitize analog front-end signals with <1 LSB INL error.

Use Scenario: In-vehicle infotainment development platform supporting HDMI CEC remote control, Bluetooth audio streaming, and rear-view camera input.

IC Role / Device Role / Timing Role: HDMI-CEC interface manages TV/AVR control; SPDIF RX receives multi-channel digital audio; DCMI ingests 140 MB/s camera stream for parking assist.

Use Value: Integrated HDMI-CEC eliminates external transceiver; SPDIF RX with 4-input mux simplifies multi-source audio routing; DCMI bandwidth supports 1080p30 raw Bayer capture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core MPU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
i.MX 8M Mini (NXP)Quad Cortex-A53 + Cortex-M4, no integrated GPU, supports LPDDR4 but lacks DSI; uses different security model (CAAM vs TrustZone)Better suited for headless edge AI inference; less optimal for display-centric HMI due to missing DSI and lower graphics throughputSelect when prioritizing AI acceleration (NN engine) over display integration and when migrating from NXP ecosystem
RZ/G2L (Renesas)Dual Cortex-A55 + Cortex-M33, Mali-G31 GPU, supports LPDDR4X and MIPI CSI-2 but no CAN FD or TTCANStronger multimedia pipeline (4K decode), weaker industrial connectivity; lacks time-triggered CAN required for automotive diagnosticsSelect for video analytics gateways where camera input bandwidth and decode capability outweigh CAN FD needs

Compared with i.MX 8M Mini and RZ/G2L, STM32MP157CAD3T uniquely balances display integration (DSI + LTDC), industrial connectivity (dual CAN FD + TTCAN), and hardware security (TrustZone + BSEC) in a single TFBGA361 package - making it optimal for cost-constrained, Linux-based HMI and gateway designs requiring deterministic I/O and visual feedback.

Availability

STM32MP157CAD3T is available at Aetrix Electronics and suitable for industrial HMI panels, edge gateways, medical imaging terminals, and automotive infotainment prototypes requiring stable component supply, long-term lifecycle assurance, and qualified production-grade silicon.

Supply support for STM32MP157CAD3T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.

The STM32MP series was developed specifically for Linux-capable embedded applications demanding heterogeneous processing, rich peripheral integration, and hardware-enforced security - bridging the gap between microcontrollers and application processors.

FAQ

What boot sources does STM32MP157CAD3T support?

STM32MP157CAD3T supports eight boot modes configured via BOOT0/BOOT1 pins: eMMC/SD card, Quad-SPI NOR/NAND flash, parallel NOR/PSRAM/NAND via FMC, USB device, and UART. Each mode maps to specific internal ROM loader behavior and supports signed image verification using embedded public keys stored in BSEC fuses.

Does STM32MP157CAD3T require an external PMIC?

No - STM32MP157CAD3T integrates multiple on-die LDOs (1.1 V core, 1.2 V DSI, 1.8 V USB, 3.3 V I/O) and a backup regulator (~0.9 V). However, external PMICs like STPMIC1 are recommended for complex power sequencing, dynamic voltage scaling, or multi-rail systems requiring higher current than internal regulators provide.

How is TrustZone® implemented on this MPU?

TrustZone is implemented through hardware blocks including the TrustZone Address Space Controller (TZC) for DDR memory filtering, Embedded TrustZone Protection Controller (ETZPC) for peripheral access control, and secure monitor call (SMC) handling in the Cortex-A7. All secure world accesses are validated before reaching memory or peripherals, and the Cortex-M4 operates in a physically isolated domain with dedicated SRAM and clocks.

What is the maximum resolution supported by the LTDC controller?

The LTDC controller supports up to WXGA (1366 × 768) at 60 fps or Full HD (1920 × 1080) at 30 fps, with pixel clock up to 90 MHz and dual-layer composition using programmable color LUTs. It outputs RGB888 (24-bit) parallel signals and can be paired with DSI bridge ICs for higher resolutions beyond native capability.

STM32MP157CAD3T Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
257-TFBGA
Series:
STM32MP1
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
SATA:
-
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Supplier Device Package:
257-TFBGA (10x10)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB

STM32MP157CAD3T FAQ

1.How can I place an order for STM32MP157CAD3T through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32MP157CAD3T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32MP157CAD3T reliable?

The price and inventory of STM32MP157CAD3T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP157CAD3T is usually 5 days.

3.What payment methods are accepted for STM32MP157CAD3T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP157CAD3T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32MP157CAD3T?

STM32MP157CAD3T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32MP157CAD3T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32MP157CAD3T?

For technical support, including STM32MP157CAD3T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP157CAD3T requirements.

6.How does Aetrix verify that STM32MP157CAD3T is sourced from the original manufacturer or authorized distributors?

All STM32MP157CAD3T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP157CAD3T meets industry standards.

7.What is the process for return or replacement of STM32MP157CAD3T?

All STM32MP157CAD3T units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP157CAD3T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32MP157CAD3T part is unused and in its original packaging.

Return procedure for STM32MP157CAD3T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32MP157CAD3T Tags

  • STM32MP157CAD3T
  • STM32MP157CAD3T PDF
  • STM32MP157CAD3T Datasheet
  • STM32MP157CAD3T Specifications
  • STM32MP157CAD3T Images
  • STMicroelectronics
  • STMicroelectronics STM32MP157CAD3T
  • Buy STM32MP157CAD3T
  • STM32MP157CAD3T Price
  • STM32MP157CAD3T Distributor
  • STM32MP157CAD3T Supplier
  • STM32MP157CAD3T Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER