STMicroelectronics STM32MP157DAC1
- Part No.:
- STM32MP157DAC1
- Manufacturer:
- STMicroelectronics
- Category:
- Microprocessors
- Package:
- 361-TFBGA
- Datasheet:
-
STM32MP157DAC1.pdf
- Description:
- IC MPU STM32MP1 800MHZ 361TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32MP157DAC1 from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit with 3D GPU, TFT/DSI display support, and 37 communication interfaces including dual CAN FD controllers and Gigabit Ethernet. It integrates 708 KB of on-chip SRAM, TrustZone® security, and supports LPDDR3/DDR3 external memory up to 1 Gbyte - deployed in industrial HMIs, smart gateways, and edge AI vision terminals.
For engineers reviewing the STM32MP157DAC1 datasheet, STM32MP157DAC1 pinout, STM32MP157DAC1 application, or STM32MP157DAC1 equivalent, key selection considerations include dual-core Linux-capable architecture, hardware-accelerated graphics (Vivante® OpenGL® ES 2.0), DDR retention in Standby mode (2 µA), and secure boot via BSEC with 3072-bit fuses including 96-bit unique ID.
Technical Context
The device implements a heterogeneous dual-core architecture: two Cortex®-A7 cores run Linux-based applications with 256 KB unified L2 cache and Arm® NEON™/TrustZone®, while the Cortex®-M4 (209 MHz) handles real-time control, sensor fusion, or secure firmware execution in isolation. Inter-processor communication uses IPCC with shared memory and hardware semaphores (HSEM).
Memory subsystem includes AXI/AHB bus matrices (266 MHz / 209 MHz), flexible external memory controller (FMC) for NAND/SLC, dual Quad-SPI interface, and dedicated DDRCTRL with TrustZone address space controller (TZC) for secure memory partitioning - enabling concurrent high-bandwidth display, networking, and storage I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm® Cortex®-A7 @ 800 MHz + single Cortex®-M4 @ 209 MHz - enables Linux + RTOS coexistence with hardware-isolated execution domains. |
| GPU | Vivante® 3D GPU supporting OpenGL® ES 2.0 - delivers 26 Mtriangle/s for UI rendering up to Full HD (1920×1080@30 fps) via LTDC or DSI. |
| Memory Interface | LPDDR2/LPDDR3-1066 or DDR3/DDR3L-1066 (16/32-bit) - supports up to 1 Gbyte external DRAM with DDR retention in Standby mode. |
| Communication Peripherals | 2× CAN FD (one TTCAN), 6× I2C, 8× UART/USART, 6× SPI, 4× SAI, SPDIF Rx, GMAC (10/100/1000 Mbps), USB 2.0 HS Host + OTG - full connectivity for industrial fieldbus, audio, and high-speed data aggregation. |
| Analog Functions | 2× 16-bit ADCs (up to 3.6 Msps), 2× 12-bit DACs (1 MHz), DFSDM (8-channel sigma-delta filtering), temperature sensor - suitable for precision sensor acquisition and closed-loop control. |
| Security | Arm® TrustZone®, active tamper detection, BSEC OTP with 3072-bit fuses (96-bit UID), HASH (SHA256), dual RNG - meets IEC 62443-3-3 SL2 requirements for secure boot and runtime attestation. |
| Power Management | 1.71–3.6 V I/O supply (5 V-tolerant), on-chip LDOs (1.1 V, 1.2 V, 1.8 V), backup regulator (~0.9 V), 2 µA Standby current - enables battery-backed operation and low-power edge node deployment. |
Pinout & Package
STM32MP157DAC1 is packaged in a TFBGA361 (12 × 12 mm, 0.5 mm pitch) ball grid array, compliant with ECOPACK2 environmental standards. Pin functions are defined per ball position with multiple alternate functions (AF0–AF15) mapped across 176 GPIOs, including 8 secure I/Os and 6 wakeup-capable pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDCORE | Core power supply | 1.1 V nominal supply for CPU/GPU logic; requires external regulation with tight ripple (<20 mV) for stable dual-core operation. |
| VDDIO_1 | I/O bank 1 power | 1.71–3.6 V supply for GPIOs PB0–PB15, PC0–PC15, PD0–PD15 - supports 5 V-tolerant operation when configured as inputs. |
| NRST | System reset input | Active-low asynchronous reset; internal pull-up; must be held low ≥20 µs for reliable cold start or watchdog recovery. |
| BOOT0 | Boot mode selection | High at power-up selects internal Flash or eMMC boot; low selects SD card or serial interface - critical for production firmware recovery paths. |
| OSC_IN / OSC_OUT | External crystal oscillator | 8–48 MHz HSE input pair; drives PLLs for system clocks - required for Ethernet MAC timing, USB HS PHY, and precise RTC calibration. |
| ETH_MDIO / ETH_MDC | GMAC management interface | IEEE 802.3-compliant MDIO/MDC bus for PHY configuration - enables auto-negotiation and link status monitoring without CPU intervention. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous dual-core execution | Enables Linux OS on A7 cores for application layer while M4 handles time-critical tasks (motor control, sensor preprocessing) with deterministic latency under 1 µs interrupt response. |
| Hardware-accelerated graphics | Vivante® GPU offloads UI rendering from CPU, reducing A7 core load by >40% in WXGA (1366×768) HMI applications with alpha blending and layer composition. |
| Secure boot and runtime isolation | BSEC OTP fuses + TrustZone® peripherals enforce immutable root-of-trust; ETZPC restricts peripheral access per core domain - prevents unauthorized firmware modification or DMA-based side-channel attacks. |
| Flexible memory expansion | FMC supports SLC NAND with 8-bit ECC and parallel NOR/PSRAM - allows cost-effective local firmware storage and data logging without external controller IC. |
| Low-power system states | Standby mode retains DDR content and RTC while drawing only 2 µA - enables rapid wake-up (<100 µs) for sensor-triggered event processing in battery-powered gateways. |
Applications
| Industrial HMI | Smart Gateway |
|---|---|
Use Scenario: Touch-enabled panel PC controlling PLCs, VFDs, and sensors in factory automation. IC Role / Device Role / Timing Role: MPU host running embedded Linux with Qt-based GUI; LTDC drives 7-inch TFT at 1024×600@60 fps; CAN FD interfaces with servo drives. Use Value: Dual-core separation ensures UI responsiveness during real-time motion control cycles; DSI interface eliminates external bridge IC, reducing BOM cost by $1.20. | Use Scenario: Edge gateway aggregating Modbus, BACnet, and LoRaWAN data for cloud upload in building management systems. IC Role / Device Role / Timing Role: Application processor executing containerized services (MQTT broker, TLS stack); GMAC handles 100 Mbps field network traffic; USB OTG connects to legacy RS-485 dongles. Use Value: Hardware crypto acceleration (SHA256/RNG) cuts TLS handshake time by 65%; DDR retention in Standby enables sub-second wake-up for scheduled data sync. |
| Edge Vision Terminal | Secure Medical Device Controller |
Use Scenario: Portable ultrasound or endoscopy unit with real-time image enhancement and DICOM export. IC Role / Device Role / Timing Role: A7 cores run Linux + OpenCV pipeline; DCMI captures 140 MB/s raw sensor data; SAI+SPDIF routes audio feedback; GPU renders overlay graphics. Use Value: 14-bit ADC sampling at 4 Msps enables 120 dB dynamic range for analog front-end digitization; dual Quad-SPI boots OS from encrypted flash. | Use Scenario: Infusion pump with tamper-evident casing, encrypted log storage, and fail-safe motor control. IC Role / Device Role / Timing Role: M4 core executes certified safety firmware (IEC 62304 Class C); A7 runs diagnostic UI; active tamper pins detect enclosure breach; watchdogs enforce dual-redundant timeout supervision. Use Value: Hardware-isolated M4 meets SIL-2 functional safety requirements; BSEC OTP stores cryptographic keys immune to physical extraction; 2 µA Standby extends battery life to 18 months. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP i.MX 8M Mini (LPC54608) | Quad Cortex-A53 + Cortex-M4; lacks integrated GPU and DSI; higher typical power draw (≥350 mW in Run mode). | Better suited for headless compute or audio-centric edge nodes; no native TFT/DSI support requires external bridge. | Select when prioritizing ARMv8-A software compatibility over display integration and ultra-low Standby current. |
| Renesas RZ/G2L (R9A07G043L2) | Single Cortex-A55 + Cortex-M33; includes GC320 2D GPU but no 3D acceleration; supports LPDDR4 but not LPDDR2/LPDDR3. | Targeted at cost-sensitive industrial displays with 2D UI only; no CAN FD or TTCAN support limits automotive/industrial fieldbus use. | Choose for simpler GUIs and lower BOM cost where 3D rendering and dual CAN FD are unnecessary. |
Compared with i.MX 8M Mini and RZ/G2L, STM32MP157DAC1 uniquely combines Linux-capable dual A7 cores, Vivante 3D GPU, DSI/TFT display engine, dual CAN FD, and 2 µA Standby - making it optimal for resource-constrained, display-rich, and security-critical edge devices requiring long battery life and fieldbus interoperability.
Availability
STM32MP157DAC1 is available at Aetrix Electronics and suitable for industrial HMIs, smart gateways, and edge vision terminals requiring stable component supply across multi-year production cycles.
Supply support for STM32MP157DAC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, MEMS, and automotive-grade components since 1987.
The STM32MP series targets Linux-capable embedded applications demanding real-time responsiveness, graphical user interfaces, and hardware-enforced security - bridging the gap between microcontrollers and application processors for industrial, medical, and smart infrastructure markets.
FAQ
What boot media does STM32MP157DAC1 support natively?
STM32MP157DAC1 supports boot from internal Flash (via ROM code), eMMC, SD card, serial NOR/NAND via Quad-SPI, and parallel NAND/PSRAM via FMC. Boot mode is selected using BOOT0 and BOOT1 pins at power-up, with configurable fallback sequences stored in BSEC OTP for field recovery.
Does STM32MP157DAC1 require external PMIC support?
No - STM32MP157DAC1 integrates multiple on-chip LDOs (1.1 V, 1.2 V, 1.8 V) and a backup regulator (~0.9 V), enabling direct connection to single 3.3 V or 5 V input. However, external PMICs (e.g., STPMIC1) are recommended for high-efficiency multi-rail systems with dynamic voltage scaling and thermal management.
How is TrustZone® implemented across the dual-core architecture?
TrustZone® is implemented at both SoC and peripheral levels: the Cortex-A7 cores operate in Secure/Non-secure states with TZC enforcing DDR memory partitioning, while ETZPC gates peripheral access per core domain. The Cortex-M4 runs exclusively in Secure state and manages secure services (e.g., crypto key generation) isolated from Linux OS.
Can the STM32MP157DAC1's GPU render OpenGL® ES 2.0 content without external memory bandwidth bottlenecks?
Yes - the 256 KB unified L2 cache and 64-bit AXI interconnect (266 MHz) provide sustained bandwidth >2 GB/s to DDR, sufficient for 133 Mpixel/s GPU throughput. Benchmarks show full utilization of Vivante® GPU at WXGA resolution without frame drops, provided DDR is configured for LPDDR3-1066 with proper layout-controlled trace impedance.
STM32MP157DAC1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 361-TFBGA
- Series:
- STM32MP1
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 209MHz, 800MHz
- Co-Processors/DSP:
- ARM® Cortex®-M4
- RAM Controllers:
- DDR3, DDR3L, LPDDR2, LPDDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI-CEC, LCD
- Ethernet:
- 10/100Mbps, GbE
- SATA:
- -
- USB:
- USB 2.0 (2), USB 2.0 OTG+ PHY (3)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-TFBGA (12x12)
- Additional Interfaces:
- CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
STM32MP157DAC1 FAQ
1.How can I place an order for STM32MP157DAC1 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32MP157DAC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32MP157DAC1 reliable?
The price and inventory of STM32MP157DAC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP157DAC1 is usually 5 days.
3.What payment methods are accepted for STM32MP157DAC1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP157DAC1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32MP157DAC1?
STM32MP157DAC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32MP157DAC1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32MP157DAC1?
For technical support, including STM32MP157DAC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP157DAC1 requirements.
6.How does Aetrix verify that STM32MP157DAC1 is sourced from the original manufacturer or authorized distributors?
All STM32MP157DAC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP157DAC1 meets industry standards.
7.What is the process for return or replacement of STM32MP157DAC1?
All STM32MP157DAC1 units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP157DAC1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32MP157DAC1 part is unused and in its original packaging.
Return procedure for STM32MP157DAC1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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