STMicroelectronics STM32MP157FAC1

Overview

STM32MP157FAC1 from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit with 3D GPU, MIPI DSI, TFT-LCD controller, and 37 communication interfaces including dual CAN FD and Gigabit Ethernet. It integrates 708 KB on-chip SRAM, TrustZone® security, hardware crypto accelerators (AES/SHA/HMAC/RNG), and supports LPDDR3/DDR3 up to 1 Gbyte for industrial HMI, edge gateway, and smart appliance applications.

For engineers reviewing the STM32MP157FAC1 datasheet, STM32MP157FAC1 pinout, STM32MP157FAC1 application, or STM32MP157FAC1 equivalent, key selection criteria include dual-core Linux-capable architecture, 29 timers with RTC and sub-second accuracy, 16-bit ADCs (4.5 Msps), HDMI-CEC and SPDIF Rx support, and TFBGA361 (12 × 12 mm, 0.5 mm pitch) package compatibility with industrial thermal and EMI requirements.

Technical Context

The device implements a heterogeneous dual-core architecture: two Cortex-A7 cores run Linux or Android in secure/non-secure worlds via TrustZone®, while the Cortex-M4 (209 MHz) handles real-time control, sensor fusion, or low-latency peripheral management. Memory coherency is maintained through a 256 KB unified L2 cache and AXI/AHB interconnect matrices operating at 266 MHz and 209 MHz respectively.

Communication subsystem includes six I²C (FM+), four UART/USART with LIN/IrDA/ISO7816, six SPI (50 Mbit/s) with I²S audio class accuracy, four SAI, dual SDMMC (eMMC/SDIO), two CAN FD controllers (one TTCAN), and GMAC with IEEE 1588v2 hardware timestamping - enabling deterministic networking in industrial automation.

Key Specifications

Pinout & Package

STM32MP157FAC1 uses a TFBGA361 package (12 × 12 mm, 0.5 mm pitch) with 361 balls arranged in 21 × 21 array. Ball pitch and layout comply with JEDEC MO-276AA standard and ECOPACK2 environmental compliance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core MPU applications.

Compared with i.MX 8M Mini and RZ/G2L, STM32MP157FAC1 uniquely combines MIPI DSI, dual CAN FD, SPDIF Rx, and TrustZone-secured dual-core Linux/RTOS execution in a single TFBGA361 package - making it optimal for cost-constrained, display-rich industrial gateways requiring fieldbus interoperability.

Availability

STM32MP157FAC1 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, medical imaging terminal, and automotive infotainment prototype applications requiring stable component supply across extended product lifecycles.

Supply support for STM32MP157FAC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog components for industrial, automotive, and consumer markets.

The STM32MP series targets Linux-capable embedded applications demanding real-time responsiveness, graphical UI, and industrial connectivity - bridging the gap between microcontrollers and application processors with scalable dual-core architecture.

FAQ

What boot media does STM32MP157FAC1 support natively?

STM32MP157FAC1 supports boot from eMMC, SD card, Quad-SPI NOR flash, parallel NAND flash, and USB mass storage devices. Boot mode is selected via BOOT0 pin state and optional BOOT1 strap; internal ROM bootloader validates signed images using embedded public keys before loading FSBL from configured medium.

Does STM32MP157FAC1 require an external PMIC?

No - STM32MP157FAC1 integrates multiple on-die LDOs (1.1 V core, 1.2 V DSI, 1.8 V USB, 0.9 V backup) and supports direct connection to single 3.3 V or 5 V input via external buck converters. However, ST recommends using STPMIC1 for full power sequencing, thermal monitoring, and dynamic voltage scaling in production systems.

How is TrustZone implemented across the dual-core architecture?

TrustZone is implemented at both hardware and firmware levels: the Cortex-A7 cores use TrustZone Address Space Controller (TZASC) to partition DDR memory, while the Cortex-M4 operates in secure world by default. Secure peripherals (CRYP, HASH, RNG, BSEC) are accessible only via secure monitor calls, and inter-processor communication uses IPCC with hardware semaphore protection.

What display interfaces are supported without external bridge ICs?

STM32MP157FAC1 supports MIPI DSI (2 lanes, 1 Gbps each) and parallel RGB888 (up to 1920×1080@30 fps) directly from its integrated LTDC and DSI controllers. HDMI output requires external SerDes (e.g., Parade PS8640), but HDMI-CEC control signals are generated natively for remote command handling.