STMicroelectronics STM32MP257DAK3
- Part No.:
- STM32MP257DAK3
- Manufacturer:
- STMicroelectronics
- Category:
- Microprocessors
- Package:
- 424-VFBGA
- Datasheet:
-
STM32MP257DAK3.pdf
- Description:
- MPU WITH DUAL ARM CORTEX-A35 1.5
- Quantity:
- Payment:

- Shipping:

Inventory:140
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STM32MP257DAK3 from STMicroelectronics is a dual-core 64-bit Arm® Cortex®-A35 (1.5 GHz) + Cortex®-M33 (400 MHz) MPU with TrustZone®, 808-Kbyte internal SRAM, DDR4/LPDDR4/DDR3L support up to 4 Gbytes, and integrated PCIe® 5 Gbit/s PHY shared with USB 3.0 SuperSpeed. It targets high-performance industrial HMI, edge AI gateways, and secure multimedia terminals requiring concurrent Linux and real-time RTOS execution.
For engineers reviewing the STM32MP257DAK3 datasheet, STM32MP257DAK3 pinout, STM32MP257DAK3 application, or STM32MP257DAK3 equivalent, key selection criteria include dual-A35 cache hierarchy (32-Kbyte I/D per core + 512-Kbyte L2), optional VeriSilicon GC8000UL GPU (900 MHz, Vulkan 1.3), NPU (1.35 TOPS), and hardware TSN/Ethernet switch support for deterministic networking.
Technical Context
The STM32MP257DAK3 implements a heterogeneous multi-domain architecture: dual Cortex-A35 cores run Linux with full MMU, NEON, and TrustZone isolation; the Cortex-M33 handles secure firmware services and real-time tasks with FPU and MPU; the Cortex-M0+ operates in SmartRun domain at 200 MHz (16 MHz in autonomous mode) for ultra-low-power peripheral management. All domains share a 128/64-bit STNoC interconnect running up to 600 MHz.
Security is enforced via hardware resource isolation framework (RIF), active tamper detection (8 inputs/8 outputs), BSEC with 12288-bit fuses, ECDSA PKA, SHA-256/HMAC accelerators, and tamper-protected 128-Kbyte BKPSRAM. Video processing uses dedicated VDEC/VENC blocks sharing 128-Kbyte video RAM, supporting H.264/VP8 1080p60 decode/encode and JPEG at 500 Mpixel/s.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual 64-bit Arm® Cortex®-A35 @ 1.5 GHz + single 32-bit Cortex®-M33 @ 400 MHz + single Cortex®-M0+ @ 200 MHz (16 MHz in backup) |
| Memory Interface | DDR4-2400 / LPDDR4-2400 / DDR3L-2133, 16/32-bit, up to 4 Gbytes external SDRAM capacity |
| Internal SRAM | 808 Kbytes total: 256-Kbyte AXI SYSRAM + 128-Kbyte AXI video RAM + 256-Kbyte AHB SRAM + 128-Kbyte ECC AHB SRAM (backup) + 8-Kbyte ECC SRAM (backup) + 32-Kbyte SmartRun SRAM |
| Graphics & AI | Optional VeriSilicon GC8000UL GPU: OpenGL ES 3.1, Vulkan 1.3, 900 Mpixel/s; Optional NPU: TensorFlowLite/ONNX, 1.35 TOPS @ 900 MHz |
| Connectivity | PCIe® Gen2 (5 Gbit/s PHY shared with USB 3.0), 3× FDCAN (1× TTCAN), 3× Gigabit Ethernet (TSN/PTP), USB 2.0 Host + USB 2.0/3.0 Dual Role (Hi-Speed + SuperSpeed) |
| Display & Camera | MIPI DSI® (4-lane, 2.5 Gbit/s/lane), LVDS (dual-link, 1.1 Gbit/s/lane), MIPI CSI-2® (2-lane, 2.5 Gbit/s/lane), LCD-TFT up to FHD@60fps |
| Security | Arm® TrustZone® on all cores, BSEC with 12288-bit OTP, ECDSA PKA, SHA-256/HMAC accelerators, active tamper monitoring (8 inputs/8 outputs) |
Pinout & Package
VFBGA424 package (14 × 14 mm, 0.5 mm pitch, 424-ball array) with ball-out optimized for DDR4/LPDDR4 routing, PCIe® differential pairs, and MIPI DSI/LVDS display interfaces. Thermal pad exposed on underside for enhanced power dissipation in high-clock operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDCPU | CPU Core Supply | 1.71–1.95 V supply for dual Cortex-A35 cores and L1/L2 caches; requires low-noise regulation |
| VDDGPU | GPU/NPU Supply | Dedicated 0.75–0.95 V rail for optional VeriSilicon GC8000UL GPU/NPU block |
| DDR_VREF | DDR Reference Voltage | 0.5 × VDDQ reference for DDR4/LPDDR4 I/O termination; critical for signal integrity at 2400 MT/s |
| PCIE_TXP/N | PCIe® Differential Output | Embedded 5 Gbit/s PCIe® Gen2 transmitter pair; requires controlled 100 Ω differential impedance |
| USB3_SSP/N | USB 3.0 SuperSpeed Pair | Shared PHY with PCIe®; bidirectional 5 Gbit/s lane used for USB 3.0 DRD or PCIe® endpoint |
| DSI_D0P/N to D3P/N | MIPI DSI Data Lanes | Four high-speed differential lanes (2.5 Gbit/s each) supporting QXGA@60fps display output |
| CSI_D0P/N, D1P/N | MIPI CSI-2 Data Lanes | Two-lane CSI-2 interface for 5-Mpixel@30fps camera input; shares physical path with DCMIPP parallel interface |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Multi-Core Isolation | Hardware-enforced resource partitioning between Cortex-A35 (Linux), Cortex-M33 (secure firmware), and Cortex-M0+ (ultra-low-power peripherals) via RIF and TrustZone® |
| Shared PCIe®/USB3.0 PHY | Single embedded 5 Gbit/s SerDes PHY supports either PCIe® Gen2 endpoint or USB 3.0 SuperSpeed DRD, reducing BOM cost and PCB layer count |
| Video RAM Flexibility | 128-Kbyte dedicated video RAM serves VDEC/VENC; when unused, it becomes general-purpose AXI SRAM, increasing CPU system memory to 384 Kbytes |
| TSN-Enabled Ethernet | Three Gigabit Ethernet MACs with IEEE 1588v2 hardware timestamping, TSN traffic shaping, and optional integrated switch supporting two external PHYs |
| SmartRun Domain Power Control | Cortex-M0+ operates independently in SmartRun domain at 200 MHz or 16 MHz (backup regulator), enabling wake-on-tamper or sensor-triggered resume without waking A35/M33 |
Applications
| Industrial HMI Terminal | Edge AI Gateway |
|---|---|
Use Scenario: Factory-floor human-machine interface with touch display, real-time PLC communication, and local AI inference for predictive maintenance alerts. IC Role / Device Role / Timing Role: STM32MP257DAK3 runs Linux on dual A35 for GUI rendering (via LTDC + DSI), executes deterministic control on Cortex-M33, and performs vision-based anomaly detection using NPU-accelerated ONNX models. Use Value: Concurrent Linux + RTOS execution eliminates dual-processor architecture; TSN Ethernet ensures sub-100 µs cycle time for synchronized motion control over standard cabling. | Use Scenario: Smart building gateway aggregating data from LoRaWAN/Zigbee sensors, performing local AI inference, and forwarding filtered results to cloud via secure TLS tunnel. IC Role / Device Role / Timing Role: Cortex-A35 hosts Linux network stack and MQTT broker; Cortex-M33 manages secure boot, crypto offload, and sensor HAL; NPU runs TensorFlowLite models for occupancy detection. Use Value: On-device AI reduces cloud bandwidth by >70%; hardware TrustZone® isolates secure keys from Linux OS; dual-band Wi-Fi coexistence enabled by PCIe®-connected radio module. |
| Medical Imaging Workstation | Secure Digital Signage |
Use Scenario: Portable ultrasound or endoscopy display unit requiring real-time video decode, low-latency touch response, and HIPAA-compliant data encryption. IC Role / Device Role / Timing Role: VDEC block decodes H.264 1080p60 video stream; LTDC drives 1080p display; BSEC + PKA enforces secure boot and AES-256 encryption of captured images. Use Value: Hardware-accelerated video processing achieves <5 ms decode latency; tamper-protected 128-Kbyte BKPSRAM stores cryptographic keys immune to physical probing. | Use Scenario: Retail kiosk displaying dynamic ads with secure content updates, remote diagnostics, and anti-tampering monitoring. IC Role / Device Role / Timing Role: Cortex-A35 renders HTML5 ads via GPU-accelerated WebGL; Cortex-M33 validates signed firmware updates; active tamper pins detect enclosure breach. Use Value: Secure OTA updates prevent unauthorized ad injection; LVDS interface drives 4K signage with EMI resilience; 172 GPIOs enable custom I/O expansion for payment terminals or sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP i.MX 8M Plus | Quad Cortex-A53 + Cortex-M7; includes NPU (2.3 TOPS); no PCIe®; dual USB 3.0 host-only; LPDDR4 only | Stronger AI throughput but lacks PCIe® expansion and TSN Ethernet; limited display flexibility (no LVDS) | Select when AI inference dominates and PCIe®/TSN are unnecessary |
| Renesas RZ/G2L | Dual Cortex-A55 + Cortex-M33; no NPU; PCIe® Gen2; single USB 3.0 DRD; DDR4/LPDDR4 support | Lower AI capability but identical PCIe®/USB3.0 PHY sharing; stronger industrial temp grade (-40°C to +125°C) | Select for extended temperature operation where NPU is not required |
Compared with i.MX 8M Plus and RZ/G2L, STM32MP257DAK3 uniquely combines PCIe®/USB3.0 PHY sharing, triple TSN Ethernet, LVDS+DSI display support, and flexible video RAM allocation-enabling single-chip solutions for high-integration industrial gateways without compromise on AI, connectivity, or display fidelity.
Availability
STM32MP257DAK3 is available at Aetrix Electronics and suitable for industrial HMI terminals, edge AI gateways, medical imaging workstations, and secure digital signage requiring stable component supply across long product lifecycles.
Supply support for STM32MP257DAK3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog devices for industrial, automotive, and consumer markets.
The STM32MP series targets high-performance embedded applications requiring Linux-capable MPUs with real-time co-processors and hardware security-designed specifically for industrial automation, smart infrastructure, and AI-at-the-edge systems.
FAQ
What is the maximum DDR4 speed supported by STM32MP257DAK3?
The STM32MP257DAK3 supports DDR4-2400 (1200 MHz clock, 2400 MT/s data rate) in 16-bit or 32-bit configurations, with up to 4 Gbytes addressable capacity. This requires strict PCB layout adherence to JEDEC DDR4 specifications, including matched trace lengths and proper VREF routing.
Does STM32MP257DAK3 include a hardware video encoder and decoder?
Yes-STM32MP257DAK3 integrates optional hardware VDEC and VENC blocks supporting H.264/VP8 up to 1080p60 decode/encode and JPEG at 500 Mpixel/s. These share 128-Kbyte video RAM; when unused, this memory becomes general-purpose AXI SRAM.
How does the SmartRun domain operate during Standby mode?
In Standby mode, the Cortex-M0+ remains active in the SmartRun domain at up to 16 MHz (powered by backup regulator), managing wake-up events (e.g., tamper, GPIO, RTC alarm) while all other domains-including dual A35 and M33-are fully powered down, achieving ultra-low static current.
Can STM32MP257DAK3 support both PCIe® and USB 3.0 simultaneously?
No-the PCIe® Gen2 and USB 3.0 SuperSpeed functions share a single embedded 5 Gbit/s PHY. The device supports either PCIe® endpoint operation or USB 3.0 Dual Role Data (DRD), but not both concurrently; configuration is fixed at boot via BOOT pins.
STM32MP257DAK3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 424-VFBGA
- Series:
- STM32MP2
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33
- Number of Cores/Bus Width:
- 2, 1, 1 Core, 32-Bit
- Speed:
- 1.5GHz
- Co-Processors/DSP:
- GPU
- RAM Controllers:
- DDR3L, DDR4, LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, LVDS, MIPI-CSI2
- Ethernet:
- 10/100/1000Mbps (3)
- SATA:
- -
- USB:
- USB 2.0 (1), USB 3.0 (1), USB Type-C (1)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, TRNG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 424-VFBGA (14x14)
- Additional Interfaces:
- GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART
STM32MP257DAK3 FAQ
1.How can I place an order for STM32MP257DAK3 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32MP257DAK3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32MP257DAK3 reliable?
The price and inventory of STM32MP257DAK3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP257DAK3 is usually 5 days.
3.What payment methods are accepted for STM32MP257DAK3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP257DAK3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32MP257DAK3?
STM32MP257DAK3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32MP257DAK3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32MP257DAK3?
For technical support, including STM32MP257DAK3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP257DAK3 requirements.
6.How does Aetrix verify that STM32MP257DAK3 is sourced from the original manufacturer or authorized distributors?
All STM32MP257DAK3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP257DAK3 meets industry standards.
7.What is the process for return or replacement of STM32MP257DAK3?
All STM32MP257DAK3 units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP257DAK3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32MP257DAK3 part is unused and in its original packaging.
Return procedure for STM32MP257DAK3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STM32MP257DAK3 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

