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STMicroelectronics STM32MP257FAK3

Part No.:
STM32MP257FAK3
Manufacturer:
STMicroelectronics
Category:
Microprocessors
Package:
424-VFBGA
Datasheet:
AetrixSTM32MP257FAK3.pdf
Description:
MPU WITH DUAL ARM CORTEX-A35 1.5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:145

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Product details

Overview

STM32MP257FAK3 from STMicroelectronics is a dual-core 64-bit Arm® Cortex®-A35 + Cortex®-M33 microprocessor unit (MPU) operating at up to 1.5 GHz, featuring 512-Kbyte L2 cache, TrustZone® security, and integrated hardware video encoder/decoder supporting H.264/VP8 up to 1080p60. It targets high-performance embedded applications requiring AI acceleration, rich graphics, and multi-interface connectivity - such as industrial HMIs, smart medical displays, and edge gateway controllers.

For engineers reviewing the STM32MP257FAK3 datasheet, STM32MP257FAK3 pinout, STM32MP257FAK3 application, or STM32MP257FAK3 equivalent, key selection criteria include DDR4/LPDDR4 memory interface support (up to 4 Gbytes), PCIe® 5 Gbit/s PHY sharing with USB 3.0 SuperSpeed, triple Gigabit Ethernet with TSN, and optional VeriSilicon® NPU delivering 1.35 TOPS at 900 MHz.

Technical Context

The STM32MP257FAK3 implements a heterogeneous multi-core architecture: two Cortex®-A35 cores (1.5 GHz, 32-Kbyte L1 I/D cache each, 512-Kbyte unified L2 cache) handle Linux-based application workloads, while the Cortex®-M33 (400 MHz, FPU/MPU/TrustZone®) manages real-time control and secure firmware services. A dedicated Cortex®-M0+ core (200 MHz / 16 MHz in autonomous mode) resides in the SmartRun domain for ultra-low-power peripheral management during system standby.

Its interconnect fabric includes a 128-bit STNoC AXI matrix (600 MHz), dual 32-bit AHB buses, and four DMA controllers (48+4 physical channels), enabling concurrent high-bandwidth data movement between DDR, GPU/NPU, video engines, and peripherals including three SDMMC, eight SPI, four SAI, and three FDCAN interfaces - one supporting time-triggered CAN (TTCAN).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual 64-bit Arm® Cortex®-A35 @ 1.5 GHz + single 32-bit Cortex®-M33 @ 400 MHz + Cortex®-M0+ @ 200 MHz (16 MHz in backup mode)
Memory Interface External DDR4-2400 / LPDDR4-2400 / DDR3L-2133 (16/32-bit, up to 4 Gbytes); on-the-fly AES-128 DDR encryption
Video Acceleration Hardware H.264/VP8 encoder & decoder up to 1080p60; JPEG processing up to 500 Mpixel/s; 128-Kbyte dedicated video RAM
Security Features Secure boot, TrustZone®-enabled peripherals, active tamper detection, 12288-bit OTP fuses, SAES/AES-256, PKA, HASH (SHA-256/SHA3), true RNG
High-Speed Interfaces PCIe® Gen1 (5 Gbit/s PHY shared with USB 3.0), USB 2.0/3.0 dual-role (Hi-Speed + SuperSpeed), 3× FDCAN (1× TTCAN), 3× Gigabit Ethernet with TSN/IEEE 1588v2
Graphics & Display Optional VeriSilicon® GC8000UL GPU (OpenGL ES 3.1/Vulkan 1.3, 150 Mtriangle/s), MIPI DSI® (4-lane, 2.5 Gbit/s), LVDS (dual-link, 1.1 Gbit/s per lane)
Package VFBGA424 (14 × 14 mm, 0.5 mm pitch, 424-ball)

Pinout & Package

VFBGA424 package (14 × 14 mm, 0.5 mm pitch) with 424 solder balls. Ball mapping follows STMicroelectronics' standardized STM32MP25x footprint for mechanical compatibility across the MP25 family.

Pin/Terminal Circuit Role Design Meaning
VDDCPU CPU Core Power Supply 1.71–1.95 V supply for Cortex-A35 cores and L2 cache; requires low-noise regulation and local decoupling
VDDGPU GPU/NPU Power Supply Dedicated 0.75–0.95 V rail for optional VeriSilicon® GPU/NPU; independent switching control enables dynamic power gating
VDDIO_1 I/O Bank 1 Supply 2.7–3.6 V supply for GPIOs, UART, SPI, I2C, and SDMMC interfaces in Bank 1; supports mixed-voltage signaling
DDR_VREF DDR Reference Voltage 0.5 × VDDQ reference for DDR4/LPDDR4 DQ/DQS termination; critical for signal integrity in high-speed memory interface
OSC_IN / OSC_OUT External Crystal Oscillator 16–48 MHz HSE input for system clock generation; paired with internal PLLs to derive CPU, DDR, and peripheral clocks
BOOT0 / BOOT1 Boot Mode Selection Two-pin strap configuration determining boot source (FSMC, Octo-SPI, SDMMC, USB, or UART); latched at power-on reset

Key Features

Feature Design Value
Heterogeneous Core Isolation Arm® TrustZone® enforces strict hardware separation between Cortex-A35 (Linux), Cortex-M33 (secure RTOS), and Cortex-M0+ (ultra-low-power domain), preventing cross-domain privilege escalation
On-the-Fly Memory Decryption AES-128 OTFDEC engine decrypts Octo-SPI flash content in real time during code execution, eliminating need for RAM-based decryption overhead
SmartRun Domain Control Cortex-M0+ operates independently in backup regulator mode (16 MHz) to manage wake-up timers, tamper inputs, and RTC while main domains are powered off - enabling sub-10 µA standby current
Shared PCIe®/USB 3.0 PHY Single 5 Gbit/s SerDes PHY serves both PCIe® root complex and USB 3.0 SuperSpeed functions, reducing silicon area and BOM cost without sacrificing bandwidth
Triple Gigabit Ethernet with TSN Three GMAC controllers support IEEE 802.1AS timing sync, 802.1Qbv time-aware shaping, and 802.1Qci ingress policing - enabling deterministic networking for industrial automation

Applications

Industrial HMI Edge AI Gateway

Use Scenario: Touch-enabled factory floor display with real-time PLC monitoring, video diagnostics, and over-the-air firmware updates.

IC Role / Device Role / Timing Role: Primary application processor running Linux with Qt-based UI, managing camera feed ingestion via MIPI CSI-2, driving TFT-LCD via LTDC, and executing secure OTA updates via encrypted eMMC.

Use Value: Dual Cortex-A35 cores ensure smooth UI rendering and background analytics; TrustZone® isolates secure update agent from user-space apps; DDR4-2400 enables fast frame buffering for 1080p60 video overlay.

Use Scenario: Smart building controller aggregating sensor data from BACnet/IP, Modbus, and BLE devices, performing local anomaly detection before cloud upload.

IC Role / Device Role / Timing Role: Central MPU hosting containerized inference engine (TensorFlow Lite via NPU), managing multiple protocol stacks, and coordinating time-synchronized data logging using TSN-capable Ethernet ports.

Use Value: VeriSilicon® NPU delivers 1.35 TOPS for real-time neural net inference; triple TSN Ethernet ensures deterministic latency for HVAC actuator feedback; LPDDR4-2400 provides high-bandwidth memory for concurrent protocol stacks.

Medical Imaging Terminal Automotive Infotainment Prototype

Use Scenario: Portable ultrasound preview station displaying real-time B-mode images with adjustable gain, depth, and color Doppler overlay.

IC Role / Device Role / Timing Role: Video processing hub receiving raw sensor data via parallel camera interface (DCMIPP), applying ISP pipeline (demosaic, scaling), encoding output to H.264, and rendering to LVDS-connected display.

Use Value: Dedicated video RAM (128 Kbytes) enables zero-copy frame processing; hardware VENC/VDEC offloads CPU; LVDS dual-link supports 1536p60 resolution for high-fidelity diagnostic viewing.

Use Scenario: In-vehicle infotainment development platform supporting Android Automotive OS, rear-seat entertainment streaming, and head-up display (HUD) compositing.

IC Role / Device Role / Timing Role: Application processor running Android with GPU-accelerated UI, decoding multiple video streams via hardware VDEC, and driving DSI-connected central display and HUD via separate display pipelines.

Use Value: OpenGL ES 3.1/Vulkan 1.3 GPU renders complex 3D navigation maps; MIPI DSI (4-lane, 2.5 Gbit/s) drives high-refresh-rate central display; PCIe® connects to external audio DSP or cellular modem.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance MPU applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP i.MX 8M Plus Quad Cortex-A53 + Cortex-M7; integrated NPU (2.3 TOPS); no PCIe; dual MIPI CSI-2; LPDDR4-4266 support Better AI throughput but lacks PCIe and TSN Ethernet; stronger multimedia codec support (AV1 decode) Select when AI inference dominates workload and PCIe connectivity is unnecessary; verify thermal envelope for sustained NPU use
Renesas RZ/G2L Dual Cortex-A55 + Cortex-M33; no NPU; single Gigabit Ethernet; LPDDR4-4266; no PCIe or MIPI DSI Lower cost, lower power; suitable for lightweight GUI and basic connectivity; no hardware video encode/decode Select for cost-sensitive industrial panels where AI and high-res video are not required; benefits from Renesas' long-term supply commitment

Compared with i.MX 8M Plus and RZ/G2L, the STM32MP257FAK3 uniquely combines PCIe®, TSN Ethernet, and shared USB3/PCIe PHY in a single die - enabling compact gateway designs with deterministic I/O expansion and high-bandwidth peripheral attachment, while maintaining ST's 10-year longevity guarantee.

Availability

STM32MP257FAK3 is available at Aetrix Electronics and suitable for industrial HMIs, edge AI gateways, and medical imaging terminals requiring stable component supply, long lifecycle support, and traceable sourcing through STMicroelectronics' authorized channel.

Supply support for STM32MP257FAK3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog/mixed-signal products for industrial, automotive, and consumer markets.

The STM32MP series targets high-performance embedded Linux applications demanding security, AI acceleration, and rich multimedia - bridging the gap between microcontrollers and application processors with Arm®-based heterogeneous compute and ST's ecosystem of tools and software.

FAQ

What boot sources does the STM32MP257FAK3 support?

The STM32MP257FAK3 supports boot from Octo-SPI flash (with on-the-fly AES decryption), eMMC/SD card, NAND flash via FMC, USB device mode, and UART. Boot mode is selected by BOOT0/BOOT1 pins at reset; the internal 128-Kbyte ROM contains first-stage bootloader (FSBL) with verified cryptographic signature checking.

Does the STM32MP257FAK3 require an external PMIC?

Yes - the STM32MP257FAK3 requires an external PMIC (e.g., STPMIC2 or compatible) to generate its multiple voltage rails: VDDCPU (1.71–1.95 V), VDDGPU (0.75–0.95 V), VDDIO (2.7–3.6 V), DDR_VDDQ (1.2 V), and analog supplies. The on-chip LDOs only support auxiliary domains like RETRAM and BKPSRAM.

How is TrustZone® implemented across the Cortex-A35, Cortex-M33, and Cortex-M0+ cores?

TrustZone® is implemented per-core: Cortex-A35 uses Arm TrustZone® for ARMv8-A (secure/non-secure world isolation), Cortex-M33 uses TrustZone® for Armv8-M (with secure MPU), and Cortex-M0+ runs exclusively in secure state within the SmartRun domain. Secure peripherals (RNG, PKA, SAES) are accessible only via secure bus transactions routed through the BSEC firewall.

Can the STM32MP257FAK3 operate without the optional GPU or NPU enabled?

Yes - the VeriSilicon® GPU and NPU are optional silicon blocks; the STM32MP257FAK3 functions fully with only Cortex-A35/M33/M0+ cores active. Disabling them reduces dynamic power consumption and eliminates associated thermal design requirements, while retaining all other peripherals including video encoder/decoder and display interfaces.

STM32MP257FAK3 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
424-VFBGA
Series:
STM32MP2
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1, 1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
GPU
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI2
Ethernet:
10/100/1000Mbps (3)
SATA:
-
USB:
USB 2.0 (1), USB 3.0 (1), USB Type-C (1)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Supplier Device Package:
424-VFBGA (14x14)
Additional Interfaces:
GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART

STM32MP257FAK3 FAQ

1.How can I place an order for STM32MP257FAK3 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32MP257FAK3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32MP257FAK3 reliable?

The price and inventory of STM32MP257FAK3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP257FAK3 is usually 5 days.

3.What payment methods are accepted for STM32MP257FAK3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP257FAK3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32MP257FAK3?

STM32MP257FAK3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32MP257FAK3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32MP257FAK3?

For technical support, including STM32MP257FAK3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP257FAK3 requirements.

6.How does Aetrix verify that STM32MP257FAK3 is sourced from the original manufacturer or authorized distributors?

All STM32MP257FAK3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP257FAK3 meets industry standards.

7.What is the process for return or replacement of STM32MP257FAK3?

All STM32MP257FAK3 units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP257FAK3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32MP257FAK3 part is unused and in its original packaging.

Return procedure for STM32MP257FAK3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32MP257FAK3 Tags

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