STMicroelectronics STM32WB09TEF7TR
- Part No.:
- STM32WB09TEF7TR
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 36-XFBGA, WLCSP
- Datasheet:
-
STM32WB09TEF7TR.pdf
- Description:
- ULTRA-LOW-POWER, ARM CORTEX-M0+
- Quantity:
- Payment:

- Shipping:

Inventory:5,372
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STM32WB09TEF7TR from STMicroelectronics is an ultra-low-power dual-core wireless SoC integrating an Arm® Cortex®-M0+ MCU (64 MHz) and a dedicated BlueNRG radio coprocessor for Bluetooth® LE 5.4 and 2.4 GHz proprietary protocols. It delivers -104 dBm RX sensitivity at 125 Kbit/s, +8 dBm programmable TX output, 512 KB flash, 64 KB RAM, and hardware security including AES-128, PKA, and TRNG compliant with NIST SP 800-90B - deployed in asset tracking and industrial sensor nodes requiring long battery life and BLE Mesh connectivity.
For engineers reviewing the STM32WB09TEF7TR datasheet, STM32WB09TEF7TR pinout, STM32WB09TEF7TR application, or STM32WB09TEF7TR equivalent, key selection criteria include verified Bluetooth® LE 5.4 compliance, integrated SMPS power management, WLCSP36 package footprint (2.83 mm × 2.99 mm), 20 I/Os with 5 V tolerance and wakeup capability, and support for standalone or network-processor configurations.
Technical Context
The device implements a partitioned Bluetooth® LE stack: time-critical Link Layer operations run on the DMA-based BlueNRG coprocessor, while host stack and application logic execute on the Cortex®-M0+. Its RF subsystem uses a low-IF receiver architecture with integrated balun and supports simultaneous roles (e.g., peripheral + central) with up to 128 physical connections.
Power architecture includes three domains (VDD33, VDD12i, VDD12o), an embedded SMPS (1.2–1.9 V output), and Deepstop mode consuming just 0.9 µA with external LSE and RAM retention - enabling multi-year operation on coin-cell batteries. Security is enforced via MPU, flash read/write protection, SWD disable, and hardware-accelerated ECC/RSA operations up to 3136-bit modulus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm® Cortex®-M0+, 64 MHz max - enables real-time BLE host stack execution and concurrent application processing. |
| Radio Standard | Bluetooth® LE 5.4 qualified - supports Direction Finding, Periodic Advertising with Responses, and Isochronous Channels for precise location and synchronized audio. |
| RX Sensitivity | -104 dBm @ 125 Kbit/s (long range) - extends operational range in low-data-rate sensor networks without external LNA. |
| TX Output Power | +8 dBm (programmable at antenna connector) - allows flexible RF link budget tuning for regulatory compliance and coverage optimization. |
| Memory | 512 KB flash + 64 KB SRAM (4 banks) - supports secure OTA updates, dual-bank firmware swapping, and retained context across Deepstop wakeups. |
| Security Hardware | AES-128 co-processor, PKA (3136-bit modular arithmetic), TRNG (NIST SP 800-90B) - enables FIPS-aligned key generation and encrypted BLE pairing. |
| Package | WLCSP36 (2.83 mm × 2.99 mm) - provides ultra-compact footprint for space-constrained wearables and IoT tags. |
Pinout & Package
STM32WB09TEF7TR is housed in a 36-ball Wafer-Level Chip-Scale Package (WLCSP) with 0.4 mm pitch, optimized for minimal PCB area and high-frequency RF performance. The package requires VSSRF balls connected directly to ground plane per ST layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO / VDD | Digital I/O supply | 1.7–3.6 V input powering GPIOs, peripherals, and core logic; 5 V tolerant I/Os simplify level-shifting with legacy sensors. |
| VSSRF | RF ground reference | Dedicated RF ground pins must be tied to solid ground plane to ensure stable 2.4 GHz operation and meet ETSI/FCC emission limits. |
| ANT | RF antenna interface | Single-ended 50 Ω output with integrated balun - eliminates external matching components for basic PCB trace antennas. |
| PA_EN / LNA_EN | External PA/LNA control | GPIO-controlled enable signals for optional external power amplifier or low-noise amplifier to extend range beyond +8 dBm or improve sensitivity. |
| BOOT0 | Boot mode selection | Pulled low during reset to boot from main flash; pulled high to enter system memory bootloader via UART. |
| NRST | Active-low reset input | Asynchronous external reset pin - triggers PADRESETn, preserving RTC, debug registers, and power controller state. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power Deepstop mode | 0.9 µA (with external LSE, RAM retained, radio wakeup source) - enables >10-year battery life in periodic sensor reporting applications. |
| Integrated SMPS regulator | Configurable 1.2–1.9 V output with 4/8 MHz switching - reduces active current by ~30% vs. LDO-only supply in 3.3 V systems. |
| Hardware PKA accelerator | Supports ECDSA signature/verification (521-bit max) and RSA exponentiation (3136-bit max) - cuts public-key crypto latency from seconds to milliseconds. |
| 20 GPIOs with full retention | All pins retain state and wakeup capability in all low-power modes - eliminates external glue logic for button/switch interfaces in remote controls. |
| Bluetooth® LE 5.4 certified stack | Firmware pre-integrated and qualified - removes need for third-party BLE stack licensing and validation effort in medical and industrial designs. |
Applications
| Industrial Sensor Node | Smart Wearable Tracker |
|---|---|
|
Use Scenario: Wireless temperature/humidity monitor in factory automation with 10-second reporting interval and 10-year battery target. IC Role / Device Role / Timing Role: Standalone BLE peripheral node running sensor fusion, OTA-upgradable firmware, and secure connection to gateway. Use Value: Deepstop current of 0.9 µA and integrated SMPS enable coin-cell operation; hardware TRNG and AES ensure encrypted sensor data integrity. |
Use Scenario: Fitness tracker with motion sensing, heart rate monitoring, and BLE smartphone sync. IC Role / Device Role / Timing Role: Dual-role device acting as BLE Central (to collect sensor data) and Peripheral (to expose health services to phone). Use Value: Simultaneous 128 connections and Bluetooth® LE 5.4 Direction Finding allow indoor positioning accuracy <1 m; 20 5 V-tolerant I/Os interface diverse analog/digital sensors. |
| Medical Remote Monitor | BLE Mesh Lighting Controller |
|
Use Scenario: FDA-classified blood glucose meter transmitting encrypted readings to caregiver app via BLE. IC Role / Device Role / Timing Role: Secure network processor handling BLE pairing, encrypted attribute writes, and PKA-accelerated key exchange. Use Value: NIST-compliant TRNG and hardware AES-128 meet HIPAA encryption requirements; 64-bit unique ID enables device-level audit logging. |
Use Scenario: Self-healing smart lighting node in commercial building with group addressing and firmware broadcast. IC Role / Device Role / Timing Role: BLE Mesh node supporting Proxy, Relay, Friend, and Low Power features with periodic advertising synchronization. Use Value: Bluetooth® LE 5.4 Periodic Advertising with Responses enables efficient mesh provisioning; integrated balun reduces BOM cost for PCB antenna implementation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth® LE wireless SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 DK | ARM Cortex-M4F core, 1 MB flash, no integrated SMPS, higher active current (4.8 mA RX) | Better for compute-intensive edge AI preprocessing; less optimal for coin-cell lifetime-critical deployments | Select when floating-point math or larger firmware image size is required; verify external DC/DC needed for sub-1 µA Deepstop. |
| Texas Instruments CC2642R1 | ARM Cortex-M4F + dedicated RF core, 352 KB flash, -108 dBm RX sensitivity, no PKA accelerator | Superior RF link budget in noisy environments; lacks hardware ECC acceleration for fast BLE Secure Connections | Prefer for long-range industrial telemetry where sensitivity outweighs crypto throughput; add software PKA if ECDSA required. |
Compared with Nordic nRF52840 DK and TI CC2642R1, STM32WB09TEF7TR uniquely balances ultra-low Deepstop current (0.9 µA), integrated SMPS, and hardware PKA - making it optimal for battery-limited, security-sensitive BLE Mesh and medical devices where firmware size and RF efficiency are tightly constrained.
Availability
STM32WB09TEF7TR is available at Aetrix Electronics and suitable for industrial sensor nodes, smart wearables, medical remote monitors, and BLE Mesh lighting controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for STM32WB09TEF7TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering microcontrollers, analog ICs, power management, and MEMS solutions for industrial, automotive, and consumer markets.
This device belongs to the STM32WB ultra-low-power wireless MCU product line, engineered specifically for battery-operated IoT endpoints needing Bluetooth® LE 5.4, hardware security, and multi-year operation - not general-purpose computing or high-speed connectivity.
FAQ
What is the maximum certified Bluetooth® LE data rate supported by STM32WB09TEF7TR?
The device supports Bluetooth® LE 5.4 physical layer rates up to 2 Mbit/s (LE 2M PHY), plus long-range modes at 125 Kbit/s and 500 Kbit/s (LE Coded PHY). All rates are fully qualified per Bluetooth SIG test specifications and implemented in ROM-based firmware - no host CPU overhead is required to switch between them.
Does STM32WB09TEF7TR require external RF matching components?
No external balun or impedance-matching components are required when using the integrated ANT pin with a 50 Ω single-ended PCB trace antenna. ST provides validated reference layouts for WLCSP36; however, external PA/LNA integration requires PA_EN/LNA_EN control signals and matching per MLPF-NRG-01D3 IPD guidelines.
How is security enforced during firmware updates over BLE?
Firmware updates use the Secure Bootloader with AES-128 decryption and SHA-256 signature verification. The PKA accelerator performs ECDSA signature checks on update packages, while flash write protection prevents unauthorized modification. All keys are stored in OTP or protected SRAM - never exposed in plaintext during OTA transfer.
Can STM32WB09TEF7TR operate as both BLE Central and Peripheral simultaneously?
Yes - the BlueNRG coprocessor supports up to 128 concurrent physical connections and can manage multiple roles (e.g., Central scanning while acting as Peripheral for smartphone pairing) without host CPU intervention. This is enabled by hardware-accelerated Link Layer scheduling and dedicated DMA channels for packet buffering.
STM32WB09TEF7TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 36-XFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v5.4
- Modulation:
- GFSK
- Frequency:
- -
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 8dBm
- Sensitivity:
- -104dBm
- Memory Size:
- 512kB Flash, 64kB RAM
- Serial Interfaces:
- ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
- GPIO:
- 20
- Voltage - Supply:
- 1.7V ~ 3.6V
- Current - Receiving:
- 3.6mA ~ 9.1mA
- Current - Transmitting:
- 4.9mA ~ 9.7mA
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 36-WLCSP (2.83x2.99)
STM32WB09TEF7TR FAQ
1.How can I place an order for STM32WB09TEF7TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB09TEF7TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB09TEF7TR reliable?
The price and inventory of STM32WB09TEF7TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB09TEF7TR is usually 5 days.
3.What payment methods are accepted for STM32WB09TEF7TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB09TEF7TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB09TEF7TR?
STM32WB09TEF7TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB09TEF7TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB09TEF7TR?
For technical support, including STM32WB09TEF7TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB09TEF7TR requirements.
6.How does Aetrix verify that STM32WB09TEF7TR is sourced from the original manufacturer or authorized distributors?
All STM32WB09TEF7TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB09TEF7TR meets industry standards.
7.What is the process for return or replacement of STM32WB09TEF7TR?
All STM32WB09TEF7TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB09TEF7TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB09TEF7TR part is unused and in its original packaging.
Return procedure for STM32WB09TEF7TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STM32WB09TEF7TR Tags

-
ESP32-D0WD-V3
Espressif Systems

-
ESP8266EX
Espressif Systems

-
ESP32-S3
Espressif Systems

-
NRF24L01P-R7
Nordic Semiconductor ASA

-
NRF24L01P-R
Nordic Semiconductor ASA

-
ESP32-U4WDH
Espressif Systems

-
DA14531-00000OG2
Renesas

-
ESP32-C6FH4
Espressif Systems

-
DA14531-00000FX2
Renesas

-
NRF24L01P-T
Nordic Semiconductor ASA

-
NRF52810-QCAA-R
Nordic Semiconductor ASA

-
ESP32-S3FN8
Espressif Systems
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
