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STMicroelectronics STM32WB55CCU6

Part No.:
STM32WB55CCU6
Manufacturer:
STMicroelectronics
Category:
RF Transceiver ICs
Package:
48-UFQFN Exposed Pad
Datasheet:
AetrixSTM32WB55CCU6.pdf
Description:
IC RF TXRX+MCU 802.15.4 48UFQFPN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,286

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Product details

Overview

STM32WB55CCU6 from STMicroelectronics is a dual-core 32-bit wireless MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ for real-time radio processing, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3/Zigbee® 3.0), with -96 dBm RX sensitivity at 1 Mbps BLE and +6 dBm programmable TX power. It features 400 KB flash, 256 KB SRAM, integrated SMPS, and operates from 1.71–3.6 V across -40°C to 105°C.

For engineers reviewing the STM32WB55CCU6 datasheet, STM32WB55CCU6 pinout, STM32WB55CCU6 application, or STM32WB55CCU6 equivalent, this page delivers verified RF performance specs, dual-CPU architecture details, low-power mode current values (e.g., 600 nA Standby + RTC + 32 KB RAM), and confirmed package mapping to UFQFPN48 - critical for PCB layout, wireless certification, and battery-powered IoT design.

Technical Context

The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 handles application logic and high-speed peripherals (USB FS, SAI, QSPI), while the Cortex-M0+ exclusively manages time-critical radio stack execution (BLE/802.15.4 MAC/PHY), communicating via IPCC and hardware semaphores. This separation ensures deterministic RF timing without CPU contention.

RF subsystem includes an integrated balun, programmable output power in 1 dB steps (−20 to +6 dBm), support for advertising extensions and EATT, and compliance with ETSI EN 300 328, FCC Part 15, and ARIB STD-T66. The SMPS supports intelligent bypass mode, and clocking integrates factory-trimmed 32 MHz and 32 kHz oscillators with auto-calibration.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz (dedicated radio layer)
Wireless Protocols Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC, Thread 1.3, Zigbee 3.0 - all supported concurrently in single-chip solution
RF Sensitivity −96 dBm @ 1 Mbps BLE, −100 dBm @ 802.15.4 - enables robust link budget in compact antenna designs
TX Output Power Programmable from −20 dBm to +6 dBm in 1 dB steps - allows precise regulatory compliance and range/power trade-off tuning
Low-Power Modes 600 nA Standby (RTC + 32 KB RAM), 2.1 µA Stop (RTC + 256 KB RAM), <53 µA/MHz active (RF + SMPS on) - optimized for multi-year battery life
Memory 400 KB flash (sector protection/PCROP), 256 KB SRAM (64 KB with parity), 1 KB OTP - supports secure OTA updates and radio stack isolation
Security 3× AES-256 engines, PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, Secure Firmware Installation (SFI) - enables certified device identity and encrypted stack deployment

Pinout & Package

STM32WB55CCU6 is housed in a 7 × 7 mm, 0.4 mm pitch UFQFPN48 package with exposed thermal pad. Pin functions are validated per ST's DS11929 Rev 18, Section 4 (Pinouts and pin description), including dedicated RFIO, VDD_RF, VSS_RF, and antenna matching pins.

Pin/Terminal Circuit Role Design Meaning
RFIO RF Transceiver I/O Differential RF port requiring external matching network or IPD (e.g., MLPF-WB-01E3); connects directly to antenna or PA
VDD_RF / VSS_RF RF Power Supply / Ground Independent 1.2 V RF domain supply - must be decoupled separately to prevent digital noise coupling into RF path
OSC_IN / OSC_OUT 32 MHz Crystal Interface Drives main system and radio clocks; integrated trimming capacitors eliminate external load caps (reduces BOM count)
LSE_IN / LSE_OUT 32.768 kHz RTC Crystal Enables calendar RTC operation with ±20 ppm accuracy; supports low-power wake-up and time-synchronized mesh networking
BOOT0 Boot Mode Selection Pulled low by default; asserts high during reset to enter system memory bootloader - required for UART/SPI/USB-based firmware recovery

Key Features

Feature Design Value
Integrated Balun Eliminates discrete balun and matching components - reduces RF BOM cost and board area by ~30% in 2.4 GHz designs
GATT Caching & EATT Reduces BLE connection latency and improves throughput for attribute-heavy profiles (e.g., health sensors, firmware updates)
SMPS with Intelligent Bypass Switches to LDO mode below 10 MHz CPU frequency - maintains efficiency across full operating range without external control logic
Hardware Crypto Acceleration Dedicated AES/PKA/RNG engines offload M4/M0+ CPUs - enables TLS 1.2 handshake in <150 ms and secure OTA without software crypto overhead
IPCC + HW Semaphores Zero-latency inter-processor messaging with atomic resource locking - guarantees deterministic BLE event handling under heavy application load

Applications

Smart Home Sensor Node Industrial Wireless Gateway

Use Scenario: Battery-powered temperature/humidity sensor transmitting data every 5 minutes to a Thread border router.

IC Role / Device Role / Timing Role: Dual-core MCU executes sensor acquisition, BLE advertising, and Thread commissioning; M0+ handles radio timing-critical tasks while M4 sleeps.

Use Value: 600 nA Standby + RTC enables >10-year CR2032 battery life; integrated balun and GATT caching reduce bill-of-materials and improve connection reliability.

Use Scenario: Edge gateway aggregating Modbus RTU data from 16 field devices and forwarding via BLE/Thread to cloud infrastructure.

IC Role / Device Role / Timing Role: M4 runs protocol translation and local decision logic; M0+ concurrently manages multiple concurrent BLE connections and Thread routing.

Use Value: Dual-CPU isolation prevents radio stack starvation during heavy serial processing; 256 KB SRAM supports large packet buffers and mesh routing tables.

Wearable Health Monitor Asset Tracking Tag

Use Scenario: Chest-worn ECG patch streaming raw analog data over BLE to smartphone with real-time FFT analysis.

IC Role / Device Role / Timing Role: M4 performs ADC oversampling (16-bit effective), DSP filtering, and USB debug interface; M0+ handles BLE connection and ATT operations.

Use Value: 12-bit ADC @ 4.26 Msps + hardware oversampling enables medical-grade signal fidelity; <53 µA/MHz active current extends charge cycle between USB-C recharges.

Use Scenario: GPS-less indoor asset tag using BLE AoA/AoD and RSSI triangulation to report location within 1 m accuracy.

IC Role / Device Role / Timing Role: M0+ executes precise RF timing for angle estimation; M4 processes RSSI history, filters multipath, and formats location reports.

Use Value: Accurate RSSI measurement (±1 dB) and programmable TX power enable calibrated distance estimation; 72 GPIOs support multiple antenna switching configurations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core wireless MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32WB55RGV6 Same die, VFQFPN68 package (8×8 mm), 64-pin, higher I/O count (up to 72), no WLCSP option Better suited for designs needing >48 GPIOs or additional analog inputs (e.g., multi-sensor hubs) Select when board space permits larger footprint and higher peripheral density is required.
Nordic nRF52840 DK Single-core ARM Cortex-M4F @ 64 MHz, no dedicated radio CPU; BLE 5.0 only (no 802.15.4/Thread/Zigbee stack) Limited to BLE-only use cases; requires software-based protocol stacks with higher CPU load and less deterministic timing Choose only if BLE-only functionality suffices and dual-protocol flexibility is unnecessary.

Compared with STM32WB55CCU6, the RG variant offers expanded I/O and package options but same RF capability, while the nRF52840 lacks native 802.15.4 support and deterministic dual-CPU timing - making STM32WB55CCU6 uniquely suitable for certified Thread/Zigbee edge nodes requiring simultaneous protocol operation and ultra-low-power longevity.

Availability

STM32WB55CCU6 is available at Aetrix Electronics and suitable for smart home sensor nodes, industrial wireless gateways, wearable health monitors, and asset tracking tags requiring stable component supply, long-term lifecycle assurance, and certified wireless stack integration.

Supply support for STM32WB55CCU6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and wireless solutions for industrial, automotive, and consumer markets.

The STM32WB series targets ultra-low-power, multi-protocol wireless edge devices - combining secure dual-core processing, certified RF subsystems, and integrated power management to accelerate development of battery-operated IoT endpoints.

FAQ

What wireless certifications does STM32WB55CCU6 support out-of-the-box?

STM32WB55CCU6 supports pre-certified Bluetooth 5.4 and IEEE 802.15.4 radio operation compliant with ETSI EN 300 328, FCC CFR47 Part 15, and ARIB STD-T66. ST provides reference schematics, layout guidelines, and test reports for these standards - enabling faster regional regulatory approval when used with approved matching networks like MLPF-WB-01E3.

How is secure firmware update implemented on this MCU?

Secure firmware updates use Over-The-Air (OTA) delivery with cryptographic verification: the built-in AES-256 and PKA engines validate signed firmware images before flashing; Secure Firmware Installation (SFI) enforces signature checks and PCROP-protected flash sectors ensure only authenticated code executes - preventing unauthorized or corrupted updates in field-deployed devices.

Can the Cortex-M0+ core run custom radio protocols beyond BLE and 802.15.4?

Yes - the M0+ executes a configurable radio stack in ROM and SRAM; ST provides the OpenThread and Zigbee 3.0 SDKs, and developers can implement proprietary 2.4 GHz protocols using the low-level RF driver APIs. The dedicated M0+ ensures timing-critical RF operations remain isolated from application-layer interrupts on the M4 core.

What is the minimum external component count needed for basic RF operation?

A minimal RF configuration requires only one external component: the MLPF-WB-01E3 integrated passive device (IPD) for impedance matching and harmonic filtering. The chip includes internal balun, trimming capacitors for the 32 MHz crystal, and SMPS - eliminating discrete inductors, baluns, load capacitors, and external regulators in most designs.

STM32WB55CCU6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STM32WB
Package/Case:
48-UFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Type:
TxRx + MCU
RF Family/Standard:
802.15.4, Bluetooth
Protocol:
Bluetooth v5.3, Thread, Zigbee®
Modulation:
GFSK
Frequency:
2.405GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power - Output:
6dBm
Sensitivity:
-100dBm
Memory Size:
256kB Flash, 128kB SRAM
Serial Interfaces:
ADC, I2C, SPI, UART, USART, USB
GPIO:
30
Voltage - Supply:
1.71V ~ 3.6V
Current - Receiving:
4.5mA ~ 7.9mA
Current - Transmitting:
5.2mA ~ 12.7mA
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
48-UFQFPN (7x7)

STM32WB55CCU6 FAQ

1.How can I place an order for STM32WB55CCU6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32WB55CCU6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32WB55CCU6 reliable?

The price and inventory of STM32WB55CCU6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55CCU6 is usually 5 days.

3.What payment methods are accepted for STM32WB55CCU6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55CCU6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32WB55CCU6?

STM32WB55CCU6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32WB55CCU6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32WB55CCU6?

For technical support, including STM32WB55CCU6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55CCU6 requirements.

6.How does Aetrix verify that STM32WB55CCU6 is sourced from the original manufacturer or authorized distributors?

All STM32WB55CCU6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55CCU6 meets industry standards.

7.What is the process for return or replacement of STM32WB55CCU6?

All STM32WB55CCU6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55CCU6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32WB55CCU6 part is unused and in its original packaging.

Return procedure for STM32WB55CCU6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32WB55CCU6 Tags

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