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STMicroelectronics STM32WB55CGU6
- Part No.:
- STM32WB55CGU6
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 48-UFQFN Exposed Pad
- Datasheet:
-
STM32WB55CGU6.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 48UFQFPN
- Quantity:
- Payment:
- Shipping:
Inventory:17,608
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Product details
Overview
STM32WB55CGU6 from STMicroelectronics is a dual-core 32-bit wireless MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ radio controller, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3/Zigbee® 3.0), with -96 dBm RX sensitivity at 1 Mbps BLE and +6 dBm programmable TX output power. It targets ultra-low-power IoT edge nodes such as smart sensors and secure wearables requiring concurrent application processing and certified RF operation.
For engineers reviewing the STM32WB55CGU6 datasheet, STM32WB55CGU6 pinout, STM32WB55CGU6 application, or STM32WB55CGU6 equivalent, key selection criteria include dual-CPU real-time radio coexistence, integrated SMPS for sub-µA standby (600 nA), hardware AES-256/ECDSA/RNG security, and QFN48 package compatibility with RF layout constraints.
Technical Context
The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 executes application firmware while the Cortex-M0+ handles real-time Bluetooth LE and 802.15.4 protocol stack execution, communicating via IPCC and hardware semaphores. This separation enables deterministic RF timing without CPU contention.
RF subsystem includes an integrated 2.4 GHz transceiver with on-die balun, programmable TX power in 1 dB steps (–20 to +6 dBm), and support for GATT caching, EATT, and advertising extensions - all compliant with ETSI EN 300 328, FCC Part 15, and ARIB STD-T66.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz for radio stack |
| Wireless Protocols | Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC, Thread 1.3, Zigbee 3.0 - all supported concurrently |
| RF Performance | RX sensitivity: –96 dBm (BLE 1 Mbps), –100 dBm (802.15.4); TX output: up to +6 dBm in 1 dB steps |
| Power Modes | 600 nA Standby + RTC + 32 KB RAM; 2.1 µA Stop + RTC + 256 KB RAM; <53 µA/MHz active (RF + SMPS on) |
| Memory | 1 MB flash (sector PCROP protection), 256 KB SRAM (64 KB with parity), 1 KB OTP, Quad-SPI XIP interface |
| Security | 3× AES-256 engines, HW PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, secure firmware installation (SFI) |
| Package | UFQFPN48 (7 × 7 mm, 0.4 mm pitch), 72 I/Os (70 × 5 V-tolerant), ECOPACK2 compliant |
Pinout & Package
STM32WB55CGU6 is housed in a 48-pin Ultra-Fine Pitch Quad Flat No-lead (UFQFPN48) package with 0.4 mm pitch and 7 × 7 mm body size, optimized for compact RF layouts and automated assembly. Pin functions are validated per ST's DS11929 Rev 18, Section 4 ("Pinouts and pin description") and Table 16 ("STM32WB55xx pin and ball definitions").
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_RF / VDD_PA | RF power supply | Dedicated 1.2 V supply for RF transceiver; requires local decoupling for noise isolation |
| RF_IO | Single-ended RF I/O | Integrated balun input/output; connects directly to antenna matching network (e.g., MLPF-WB-01E3) |
| OSC_IN / OSC_OUT | 32 MHz crystal interface | Drives both radio and CPU clock domains; internal trimming capacitors eliminate external load caps |
| VBAT | Backup power rail | Supplies RTC and 32 KB backup RAM during main power loss; supports coin-cell battery connection |
| NRST | Active-low reset | Asynchronous reset input; internal pull-up; compatible with open-drain reset supervisors |
| BOOT0 | Boot mode select | High at power-up enables system memory bootloader (USART/SPI/I2C/USB); low enables user flash boot |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Real-Time Radio Isolation | Cortex-M0+ offloads BLE/802.15.4 stack execution, eliminating M4 interrupt latency impact on RF timing |
| Integrated RF Balun | Reduces external BOM count by 4–6 passive components; maintains impedance match across temperature and voltage |
| SMPS with Intelligent Bypass | Switching regulator achieves >85% efficiency down to 10 µA load; auto-bypasses to LDO below 50 µA for ultra-low-noise RTC operation |
| Hardware Security Subsystem | AES-256, PKA, TRNG, and SFI enable secure OTA updates and device attestation without software crypto overhead |
| Low-Power Analog Peripherals | 12-bit ADC @ 4.26 Msps (200 µA/Msps), 2× ultra-low-power comparators, and buffered 2.048 V reference for sensor signal chain |
Applications
| Smart Wearable Sensor Hub | Secure Industrial Wireless Node |
|---|---|
Use Scenario: Compact wearable tracking device monitoring heart rate, motion, and ambient environment with BLE telemetry. IC Role / Device Role / Timing Role: Dual-core MCU manages sensor fusion (M4) and BLE advertising/connection (M0+) with synchronized timestamping via shared RTC. Use Value: 600 nA standby extends battery life to >1 year on CR2032; integrated balun eliminates RF tuning labor; PCROP protects proprietary algorithm IP. |
Use Scenario: Battery-powered predictive maintenance node on rotating machinery, transmitting vibration/temperature data via Thread mesh network. IC Role / Device Role / Timing Role: Acts as Thread Border Router endpoint with hardware AES-256 encryption and 802.15.4 MAC timing accuracy ±1 µs for time-critical diagnostics. Use Value: –100 dBm 802.15.4 RX sensitivity ensures reliable link in electrically noisy factory environments; SMPS bypass mode preserves RTC accuracy during brownout. |
| BLE Mesh Lighting Controller | Medical-Grade Wireless Patch |
Use Scenario: Self-healing BLE mesh node controlling LED drivers in commercial lighting systems with OTA firmware updates. IC Role / Device Role / Timing Role: Executes lighting control logic (M4) while managing mesh forwarding, GATT caching, and EATT for low-latency group commands (M0+). Use Value: GATT caching reduces connection interval overhead by 40%; OTA update resilience via dual-bank flash prevents bricking during power loss. |
Use Scenario: Disposable ECG patch transmitting clinical-grade biopotential data over BLE to gateway with HIPAA-compliant encryption. IC Role / Device Role / Timing Role: Performs analog front-end conditioning (ADC oversampling), real-time R-peak detection (M4), and encrypted BLE packetization (M0+). Use Value: 16-bit effective resolution via hardware oversampling meets AAMI EC13 requirements; TRNG + PKA enables FIPS 140-2 Level 1 cryptographic key generation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 DK | Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio CPU - BLE stack runs on same core with RTOS scheduling | Limited deterministic RF timing; higher jitter in concurrent app/radio workloads; lacks 802.15.4/Thread native support | Prefer when BLE-only use case, lower BOM cost priority, and RTOS-based scheduling suffices |
| TI CC2652R1 | Arm Cortex-M4F @ 48 MHz + dedicated Sensor Controller (not full M0+); BLE 5.0 only (no 5.4 EATT/advertising extensions) | No native Thread/Zigbee 3.0 stack; weaker security (AES-128 only, no PKA/TRNG); 1.5 µA standby (vs. 0.6 µA) | Prefer for legacy BLE 5.0 designs with TI ecosystem dependency and lower RF feature requirements |
Compared with nRF52840 DK and CC2652R1, STM32WB55CGU6 delivers deterministic dual-CPU RF timing, Bluetooth 5.4 enhancements (EATT, extended advertising), Thread 1.3 certification readiness, and lowest standby current - critical for multi-year battery life in medical and industrial edge nodes.
Availability
STM32WB55CGU6 is available at Aetrix Electronics and suitable for smart wearables, industrial wireless sensors, BLE mesh lighting controllers, and medical wireless patches requiring stable component supply across long-lifecycle deployments.
Supply support for STM32WB55CGU6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, MEMS, and automotive ICs with strong industrial and IoT focus.
The STM32WB series is ST's wireless MCU product line designed specifically for secure, ultra-low-power, multi-protocol IoT endpoints - combining application processing, certified RF, and hardware security in a single die.
FAQ
Does STM32WB55CGU6 support over-the-air (OTA) firmware updates for both application and radio stack?
Yes. The device supports independent OTA updates for the application firmware (via user flash) and the Bluetooth LE/802.15.4 radio stack (stored in protected flash sectors). Updates are secured using hardware AES-256 and verified via SHA-256 signature check before execution, with rollback protection enabled by PCROP sector locking.
What external components are required for RF compliance with FCC Part 15 and ETSI EN 300 328?
ST recommends using the MLPF-WB-01E3 or MLPF-WB55-02E3 integrated passive device (IPD) for impedance matching and harmonic filtering. With these IPDs, only a single 0402-series DC-blocking capacitor and antenna feed trace are needed - no discrete balun, matching network, or PA required for basic compliance at +4 dBm output.
Can the Cortex-M0+ core be used for custom real-time tasks beyond the standard BLE/802.15.4 stack?
Yes. The M0+ is fully programmable and accessible via the IPCC mailbox interface. Developers may replace or extend the default radio stack with custom protocols (e.g., proprietary 2.4 GHz PHY) or offload time-critical sensor preprocessing, provided the real-time constraints of RF timing (e.g., 150 µs TX/RX turnaround) are met.
Is the UFQFPN48 package of STM32WB55CGU6 compatible with standard reflow profiles and automated optical inspection (AOI)?
Yes. The UFQFPN48 package complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak 260 °C). Its exposed thermal pad and defined solder mask opening enable reliable AOI detection of voiding and bridging, with ST-provided land pattern (UM2317) ensuring ≥95% solder fill under the pad.
STM32WB55CGU6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 48-UFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 1MB Flash, 256kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 30
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 3.8mA ~ 7mA
- Current - Transmitting:
- 8.1mA ~ 13.1mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-UFQFPN (7x7)
STM32WB55CGU6 FAQ
1.How can I place an order for STM32WB55CGU6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55CGU6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55CGU6 reliable?
The price and inventory of STM32WB55CGU6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55CGU6 is usually 5 days.
3.What payment methods are accepted for STM32WB55CGU6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55CGU6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB55CGU6?
STM32WB55CGU6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55CGU6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55CGU6?
For technical support, including STM32WB55CGU6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55CGU6 requirements.
6.How does Aetrix verify that STM32WB55CGU6 is sourced from the original manufacturer or authorized distributors?
All STM32WB55CGU6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55CGU6 meets industry standards.
7.What is the process for return or replacement of STM32WB55CGU6?
All STM32WB55CGU6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55CGU6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55CGU6 part is unused and in its original packaging.
Return procedure for STM32WB55CGU6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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