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STMicroelectronics STM32WB55CGU6TR
- Part No.:
- STM32WB55CGU6TR
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 48-UFQFN Exposed Pad
- Datasheet:
-
STM32WB55CGU6TR.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 48UFQFPN
- Quantity:
- Payment:
- Shipping:
Inventory:8,595
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Product details
Overview
STM32WB55CGU6TR from STMicroelectronics is a dual-core 32-bit wireless MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ for radio stack execution, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3, Zigbee® 3.0), with -96 dBm BLE RX sensitivity, +6 dBm programmable TX power, and ultra-low-power operation down to 13 nA shutdown mode. It targets secure, battery-powered IoT edge nodes requiring concurrent application processing and certified RF communication.
For engineers reviewing the STM32WB55CGU6TR datasheet, STM32WB55CGU6TR pinout, STM32WB55CGU6TR application, or STM32WB55CGU6TR equivalent, key selection criteria include dual-CPU real-time radio coexistence, integrated SMPS with bypass mode, hardware AES-256 and PKA acceleration, GATT caching, EATT support, and RF regulatory compliance (FCC Part 15, ETSI EN 300 328).
Technical Context
The device implements a tightly coupled dual-CPU architecture: the M4 handles application firmware and security services (AES, PKA, RNG), while the M0+ exclusively manages time-critical radio protocol layers (BLE/802.15.4 MAC/PHY), synchronized via IPCC and HW semaphores. This separation ensures deterministic RF timing without application interference.
RF subsystem includes an integrated balun, programmable output power in 1 dB steps, accurate RSSI for closed-loop TX power control, and support for external PA or IPD companion chips (e.g., MLPF-WB55-02E3). Clocking uses a 32 MHz crystal with integrated trimming capacitors for both CPU and radio timing stability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz (dedicated radio stack) |
| Wireless Protocols | Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC, Thread 1.3, Zigbee 3.0 - all supported concurrently in single-chip solution |
| RF Sensitivity | -96 dBm @ 1 Mbps BLE; -100 dBm @ 802.15.4 - enables robust link budget in compact PCB layouts |
| TX Output Power | Programmable up to +6 dBm in 1 dB steps - allows precise range/power trade-off per deployment environment |
| Power Modes | 13 nA shutdown; 600 nA standby + RTC + 32 KB RAM; 2.1 µA stop + RTC + 256 KB RAM - extends coin-cell life to multi-year operation |
| Memory | 1 MB flash (PCROP sector protection), 256 KB SRAM (64 KB with parity) - supports secure OTA updates and large protocol stacks |
| Security | 3× AES-256 engines, PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, Secure Firmware Installation (SFI) - meets PSA Level 3 and SESIP requirements |
Pinout & Package
STM32WB55CGU6TR is housed in a 48-pin UFQFPN package (7 × 7 mm, 0.5 mm pitch), optimized for space-constrained wireless sensor modules and wearable designs. The package supports reflow soldering and provides 72 fast I/Os (70 × 5 V-tolerant), including dedicated RF pins (RFIO, RFVSS, RFVDD) and antenna matching interface points.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RFIO | RF Transceiver I/O | Differential RF port for direct connection to antenna or balun; requires impedance-matched trace routing |
| RFVDD | RF Power Supply | Dedicated 1.2 V supply for RF analog block; must be decoupled with 10 nF + 100 pF near pin |
| RFVSS | RF Ground Reference | Isolated ground plane for RF section; separate from digital ground to minimize coupling noise |
| HSE_IN / HSE_OUT | 32 MHz Crystal Interface | Drives high-accuracy clock for CPU and radio; integrated trimming capacitors eliminate external load caps |
| LSE_IN / LSE_OUT | 32.768 kHz RTC Crystal | Enables calendar-mode RTC operation with < ±20 ppm accuracy over -40°C to +85°C |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Real-Time Radio Isolation | M0+ executes BLE/802.15.4 stack independently; M4 runs application logic - no RTOS scheduling jitter on radio timing |
| Integrated Balun & Matching | Reduces BOM count by 4–6 passive components; eliminates manual RF tuning during production |
| GATT Caching & EATT Support | Accelerates BLE attribute access and enables multiple concurrent ATT transactions - critical for mesh gateway throughput |
| SMPS with Intelligent Bypass Mode | Switches to LDO mode at light loads (< 1 mA), improving efficiency across full operating current range (13 nA–53 µA/MHz) |
| Hardware Crypto Acceleration | AES-256, PKA (ECC-256, RSA-2048), TRNG - enables TLS 1.3 handshake in < 100 ms without software overhead |
Applications
| Smart Building Sensor Node | Medical Wearable Monitor |
|---|---|
Use Scenario: Battery-powered temperature/humidity/motion sensor deployed in HVAC ducts or ceiling cavities, transmitting data every 5 minutes via BLE mesh to gateway. IC Role / Device Role / Timing Role: Dual-core MCU performs local sensor fusion, manages BLE advertising extension packets, and maintains precise 32.768 kHz RTC wake-up intervals. Use Value: 2.1 µA stop mode + RTC preserves 256 KB RAM context across sleep cycles; integrated balun ensures FCC-certified radiated emissions without RF chamber retest. | Use Scenario: Disposable ECG patch with 7-day runtime, streaming raw biosignals via BLE to smartphone app using LE Audio LC3 codec. IC Role / Device Role / Timing Role: M4 processes ADC oversampling and digital filtering; M0+ handles LE Audio SBC/LC3 encoding and real-time packetization at 2 Mbps PHY. Use Value: 4.5 mA RX / 5.2 mA TX at 0 dBm enables low-noise analog front-end design; hardware AES secures patient data before transmission. |
| Industrial Wireless Gateway | Asset Tracking Tag |
Use Scenario: Edge gateway aggregating LoRaWAN and BLE sensor data, forwarding to cloud via Wi-Fi or cellular backhaul. IC Role / Device Role / Timing Role: Acts as BLE central + 802.15.4 coordinator; uses IPCC to synchronize M4 application tasks with M0+ radio events (e.g., channel hopping, ACK timing). Use Value: Hardware semaphores prevent race conditions during concurrent protocol handling; Quad-SPI XIP supports external flash for multi-protocol stack storage. | Use Scenario: GPS-denied indoor asset tag using BLE direction finding (AoA/AoD) to locate equipment within 1-meter accuracy. IC Role / Device Role / Timing Role: Generates phase-coherent BLE IQ samples via dedicated RF timer; computes angle estimates using M4 DSP instructions. Use Value: Accurate RSSI and 1 dB TX power resolution enable calibrated path-loss models; 13 nA shutdown minimizes self-discharge during idle periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 DK | Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio CPU - BLE stack runs on same core as application | Limited real-time determinism for concurrent BLE + application workloads; no native 802.15.4/Thread support | Prefer when BLE-only use case dominates and cost sensitivity outweighs dual-CPU isolation benefits |
| TI CC2652R1 | Arm Cortex-M4F @ 48 MHz + dedicated Sensor Controller; proprietary BLE stack only - no IEEE 802.15.4 MAC layer | Requires TI-RTOS and SimpleLink SDK; lacks GATT caching, EATT, and advertising extensions defined in BLE 5.4 | Prefer when leveraging TI's extensive RF design ecosystem and legacy BLE 4.x compatibility is sufficient |
Compared with nRF52840 and CC2652R1, STM32WB55CGU6TR delivers true hardware-isolated radio execution, native dual-protocol concurrency (BLE 5.4 + 802.15.4), and broader cryptographic acceleration - making it optimal for certified, multi-standard, security-critical IoT endpoints where deterministic timing and regulatory compliance are non-negotiable.
Availability
STM32WB55CGU6TR is available at Aetrix Electronics and suitable for smart building sensor nodes, medical wearables, industrial gateways, and asset tracking tags requiring stable component supply across multi-year production cycles.
Supply support for STM32WB55CGU6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog devices for industrial, automotive, and consumer markets.
The STM32WB series is ST's ultra-low-power wireless MCU product line, engineered specifically for secure, certified, multi-protocol IoT edge devices that demand simultaneous application processing and real-time RF operation without external co-processors.
FAQ
What development tools are officially supported for STM32WB55CGU6TR?
ST provides STM32CubeWB firmware package, STM32CubeMX configuration tool, and STM32CubeIDE with built-in BLE/802.15.4 stack libraries. Official hardware includes the STM32WB5MMG Discovery kit (with onboard debugger and antenna) and the STM32WB55RG Nucleo board. ST also certifies third-party tools like Segger J-Link for SWD debugging and OTA update validation.
Does STM32WB55CGU6TR require external RF matching components?
No - the device integrates a balun and supports direct antenna connection or simplified matching using ST's MLPF-WB55-02E3 IPD filter. External matching is optional only when using external PA or custom antenna topologies; the integrated solution meets FCC/CE radiated emission limits without additional RF components in standard 2-layer PCB layouts.
How is secure firmware update implemented on this MCU?
Secure firmware installation (SFI) leverages hardware AES-256, PKA, and immutable boot ROM to authenticate and decrypt OTA images signed with ECDSA-P256. Updates are validated before flash programming; PCROP protects radio stack sectors from unauthorized read/write. ST provides reference implementations in STM32CubeWB for BLE DFU and 802.15.4 OTA profiles.
What is the maximum ambient temperature rating for continuous operation?
The STM32WB55CGU6TR is rated for continuous operation from –40 °C to +105 °C (industrial grade), verified per JEDEC JESD22-A104. This rating applies under full RF transmit load (6 dBm) and active M4/M0+ execution, with thermal derating applied above 85 °C per datasheet Section 7.6.2.
STM32WB55CGU6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 48-UFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 1MB Flash, 256kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 30
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 4.5mA ~ 7.9mA
- Current - Transmitting:
- 5.2mA ~ 12.7mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-UFQFPN (7x7)
STM32WB55CGU6TR FAQ
1.How can I place an order for STM32WB55CGU6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55CGU6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55CGU6TR reliable?
The price and inventory of STM32WB55CGU6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55CGU6TR is usually 5 days.
3.What payment methods are accepted for STM32WB55CGU6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55CGU6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB55CGU6TR?
STM32WB55CGU6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55CGU6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55CGU6TR?
For technical support, including STM32WB55CGU6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55CGU6TR requirements.
6.How does Aetrix verify that STM32WB55CGU6TR is sourced from the original manufacturer or authorized distributors?
All STM32WB55CGU6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55CGU6TR meets industry standards.
7.What is the process for return or replacement of STM32WB55CGU6TR?
All STM32WB55CGU6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55CGU6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55CGU6TR part is unused and in its original packaging.
Return procedure for STM32WB55CGU6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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