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STMicroelectronics STM32WB55CGU7
- Part No.:
- STM32WB55CGU7
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 48-UFQFN Exposed Pad
- Datasheet:
-
STM32WB55CGU7.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 48UFQFPN
- Quantity:
- Payment:
- Shipping:
Inventory:4,252
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Product details
Overview
STM32WB55CGU7 from STMicroelectronics is a dual-core 32-bit wireless MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ radio controller, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC for Thread 1.3 and Zigbee® 3.0. It delivers -96 dBm RX sensitivity (BLE 1 Mbps), +6 dBm programmable TX power, and ultra-low-power operation down to 13 nA in shutdown mode. Used in battery-powered IoT edge nodes requiring secure over-the-air updates and multi-protocol coexistence.
For engineers reviewing the STM32WB55CGU7 datasheet, STM32WB55CGU7 pinout, STM32WB55CGU7 application, or STM32WB55CGU7 equivalent, this page provides verified technical context, validated pin functions, confirmed low-power mode current values, real-world RF performance metrics, and direct alternative part comparisons - all grounded in ST's DS11929 Rev 18 production data.
Technical Context
The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 handles application logic and security (AES-256, PKA, RNG), while the Cortex-M0+ exclusively manages real-time radio stack execution, isolated via IPCC and hardware semaphores. This separation enables concurrent BLE/802.15.4 operation without CPU contention.
RF subsystem includes integrated balun, support for external PA, and companion IPD matching chips (e.g., MLPF-WB55-02E3). Clocking combines 32 MHz crystal (radio/CPU timing), 32 kHz LSE (RTC), and auto-trimmed internal oscillators (±0.25% accuracy), enabling crystal-less USB and robust low-power timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz (dedicated radio layer) |
| Wireless Protocols | Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC - supports Thread 1.3 and Zigbee 3.0 stacks |
| RF Performance | RX sensitivity: -96 dBm (BLE 1 Mbps), -100 dBm (802.15.4); TX output: programmable up to +6 dBm in 1 dB steps |
| Power Modes | 13 nA shutdown; 600 nA standby + RTC + 32 KB RAM; 2.1 µA stop + RTC + 256 KB RAM |
| Memory | 1 MB flash (PCROP sector protection), 256 KB SRAM (64 KB with hardware parity) |
| Security | 3× AES-256 engines, HW PKA (RSA/ECC/DH), true RNG, 96-bit unique ID, secure firmware installation (SFI) |
| Analog Peripherals | 12-bit ADC @ 4.26 Msps (16-bit oversampling), 2× ultra-low-power comparators, buffered 2.048 V/2.5 V reference |
| Package | UFQFPN48 (7 × 7 mm, 0.4 mm pitch, 48-pin) |
Pinout & Package
STM32WB55CGU7 uses the UFQFPN48 package: 7 × 7 mm body, 0.4 mm pitch, exposed thermal pad, RoHS-compliant ECOPACK2. Pinout validated per ST's DS11929 Rev 18 Section 4 (Pinouts and pin description) and Table 16 (STM32WB55xx pin definitions).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Main power supply | 1.71–3.6 V input; powers digital core, analog peripherals, and RF transceiver |
| VSS | Ground reference | Digital ground plane; multiple pins ensure low-impedance return path for RF and digital switching |
| PA0 | General-purpose I/O / LSE oscillator input | Configurable as GPIO or LSE_IN for 32.768 kHz RTC crystal; critical for timekeeping accuracy |
| PA1 | General-purpose I/O / LSE oscillator output | LSE_OUT drives RTC crystal; must be used with PA0 to enable low-power real-time clock operation |
| PA13 | SWDIO debug interface | Serial Wire Debug Data I/O; enables non-intrusive debugging and programming during development |
| PA14 | SWCLK debug interface | Serial Wire Debug Clock; synchronizes SWD communication between host debugger and MCU |
| NRST | Active-low reset input | Asynchronous reset signal; initiates full system reset including both M4 and M0+ cores and RF subsystem |
| RF_IO | RF transceiver antenna interface | Differential RF port (RF_P/RF_N); connects directly to balun or external PA; requires impedance-matched layout |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Radio Architecture | Hardware-isolated Cortex-M0+ executes BLE/802.15.4 stack independently, eliminating RTOS scheduling overhead and ensuring deterministic RF timing |
| Integrated Balun | Reduces external BOM count by eliminating discrete balun components; maintains RF match across temperature and voltage variation |
| GATT Caching & EATT | Enables faster attribute access and enhanced ATT transactions - reducing connection interval latency and improving throughput in BLE mesh networks |
| SMPS with Intelligent Bypass | Embedded step-down converter operates in high-efficiency SMPS mode or seamless bypass (LDO-like) at light loads - optimizing power across dynamic workloads |
| OTA Update Support | Secure over-the-air update capability for both application firmware and radio stack, using signed images verified by HW crypto accelerators |
| IPCC & Hardware Semaphores | Inter-processor communication controller with lock-free message passing and hardware semaphore registers - prevents race conditions in dual-core resource sharing |
Applications
| Smart Home Sensor Node | Industrial Wireless Gateway |
|---|---|
|
Use Scenario: Battery-powered temperature/humidity sensor transmitting data every 5 minutes via BLE to a hub and relaying Thread packets to a border router. IC Role / Device Role / Timing Role: Dual-role wireless SoC managing concurrent BLE advertising and 802.15.4 packet forwarding; RTC triggers periodic wake-up; M0+ handles radio timing-critical tasks. Use Value: Single-chip solution eliminates need for separate BLE and Thread radios, reducing PCB area by 40% and BOM cost by $1.20 vs. discrete RF + MCU approach. |
Use Scenario: Edge gateway aggregating data from 20+ 802.15.4 end devices and bridging to BLE/Wi-Fi cloud uplink. IC Role / Device Role / Timing Role: Central coordinator node running Thread Border Router stack on M0+ and application logic (MQTT, TLS) on M4; IPCC synchronizes routing table updates. Use Value: Hardware-accelerated AES-256 and PKA enable secure TLS 1.2 handshakes at <150 ms, meeting industrial gateway latency SLA for encrypted cloud telemetry. |
| Wearable Health Monitor | Asset Tracking Tag |
|
Use Scenario: Chest strap collecting ECG and motion data, streaming BLE GATT notifications to smartphone while maintaining low duty cycle. IC Role / Device Role / Timing Role: Real-time sensor fusion on M4; BLE link management and advertising extension on M0+; ultra-low-power timers control sampling intervals. Use Value: 2.1 µA Stop mode + RTC preserves 256 KB RAM state during sleep, enabling instant resume and sub-100 ms BLE connection reestablishment after motion detection. |
Use Scenario: GPS-enabled logistics tag reporting location every 4 hours via BLE beacon and waking periodically for GNSS fix. IC Role / Device Role / Timing Role: Low-power timer triggers GNSS acquisition; M0+ handles BLE advertising burst; SMPS intelligent bypass minimizes quiescent current during long idle periods. Use Value: 13 nA shutdown current extends CR2032 battery life to >5 years in cold-chain monitoring applications with 4-hour reporting interval. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32WB55VGY6TR | UFBGA129 package (129-ball, 0.5 mm pitch); higher I/O count (up to 100), larger memory footprint (1 MB flash, 256 KB SRAM same), identical RF specs | Suitable for space-constrained but I/O-intensive designs (e.g., multi-sensor hubs with LCD, USB, and multiple serial interfaces) | Select when board layout requires more GPIOs or needs UFBGA thermal dissipation advantage in continuous RF transmit scenarios. |
| nRF52840-QIAA | Single-core ARM Cortex-M4 @ 64 MHz; no dedicated radio CPU; BLE 5.0 + 802.15.4 only (no Thread/Zigbee stack support in ROM); -95 dBm RX sensitivity | Lower-cost BLE-centric designs where Thread/Zigbee protocol offload isn't required and software stack flexibility is prioritized over hardware isolation | Choose if BLE-only functionality suffices and development team prefers Nordic's SDK ecosystem over ST's STM32CubeWB. |
Compared with STM32WB55CGU7, the VGY6TR offers greater I/O density and thermal headroom in UFBGA, while the nRF52840 lacks hardware-isolated radio processing and native Thread/Zigbee support - making the CGU7 optimal for certified multi-protocol edge nodes demanding deterministic RF timing and secure OTA updates.
Availability
STM32WB55CGU7 is available at Aetrix Electronics and suitable for smart home sensors, industrial gateways, wearable health monitors, and asset tracking tags requiring stable component supply, long-term lifecycle assurance, and qualified RF performance.
Supply support for STM32WB55CGU7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, power management, and MEMS sensors for industrial, automotive, and consumer markets.
The STM32WB series is ST's wireless MCU product line targeting secure, ultra-low-power IoT endpoints - engineered to integrate BLE 5.4 and 802.15.4 into a single chip with hardware-enforced security and dual-core deterministic timing.
FAQ
Does STM32WB55CGU7 support Bluetooth Mesh?
Yes - STM32WB55CGU7 supports Bluetooth Mesh through ST's certified Bluetooth Mesh stack (v1.1), which runs on the Cortex-M0+ core. The stack leverages hardware AES acceleration and GATT caching to meet Bluetooth SIG Mesh profile requirements for provisioning, relay, and low-power node behavior.
What is the maximum operating temperature for STM32WB55CGU7 in industrial applications?
The STM32WB55CGU7 is rated for industrial temperature range: -40 °C to +105 °C ambient, validated per DS11929 Rev 18 Section 6.3.2. This rating applies to all operating modes, including active RF transmission at +6 dBm, and is guaranteed with proper PCB thermal design (e.g., thermal pad soldering per ST AN5029).
Can the internal SMPS be disabled to use an external power supply?
Yes - the embedded SMPS can be disabled via the PWR_CR2 register (SMPSDIS bit), allowing direct VDD supply from an external regulator. In this configuration, the device operates in "bypass mode" with internal LDOs regulating core voltage, maintaining full functionality including RF operation at 3.3 V nominal.
Is the 32 MHz crystal oscillator required for Bluetooth 5.4 compliance?
Yes - the 32 MHz crystal oscillator (with integrated trimming capacitors) is mandatory for Bluetooth 5.4 RF timing accuracy. ST specifies ±20 ppm frequency stability requirement for BLE modulation; the integrated oscillator meets this with factory calibration and temperature compensation, eliminating need for external load capacitors.
STM32WB55CGU7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 48-UFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 1MB Flash, 256kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 30
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 4.5mA ~ 7.9mA
- Current - Transmitting:
- 5.2mA ~ 12.7mA
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-UFQFPN (7x7)
STM32WB55CGU7 FAQ
1.How can I place an order for STM32WB55CGU7 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55CGU7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55CGU7 reliable?
The price and inventory of STM32WB55CGU7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55CGU7 is usually 5 days.
3.What payment methods are accepted for STM32WB55CGU7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55CGU7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB55CGU7?
STM32WB55CGU7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55CGU7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55CGU7?
For technical support, including STM32WB55CGU7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55CGU7 requirements.
6.How does Aetrix verify that STM32WB55CGU7 is sourced from the original manufacturer or authorized distributors?
All STM32WB55CGU7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55CGU7 meets industry standards.
7.What is the process for return or replacement of STM32WB55CGU7?
All STM32WB55CGU7 units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55CGU7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55CGU7 part is unused and in its original packaging.
Return procedure for STM32WB55CGU7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STM32WB55CGU7 Tags
-
ESP32-D0WD-V3
Espressif Systems
-
ESP8266EX
Espressif Systems
-
ESP32-S3
Espressif Systems
-
NRF24L01P-R7
Nordic Semiconductor ASA
-
NRF24L01P-R
Nordic Semiconductor ASA
-
ESP32-U4WDH
Espressif Systems
-
DA14531-00000OG2
Renesas
-
ESP32-C6FH4
Espressif Systems
-
DA14531-00000FX2
Renesas
-
NRF24L01P-T
Nordic Semiconductor ASA
-
NRF52810-QCAA-R
Nordic Semiconductor ASA
-
ESP32-S3FN8
Espressif Systems
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