STMicroelectronics STM32WB55RCV6
- Part No.:
- STM32WB55RCV6
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
STM32WB55RCV6.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 68VFQFPN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32WB55RCV6 from STMicroelectronics is a dual-core 32-bit wireless MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ radio controller, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3/Zigbee® 3.0), with -96 dBm BLE RX sensitivity, +6 dBm programmable TX power, and ultra-low-power operation down to 13 nA in shutdown mode. It targets secure, battery-operated IoT edge nodes requiring concurrent application processing and certified wireless stack execution.
For engineers reviewing the STM32WB55RCV6 datasheet, STM32WB55RCV6 pinout, STM32WB55RCV6 application, or STM32WB55RCV6 equivalent, this page delivers verified technical context, validated pin functions, real-world low-power use cases, and confirmed alternative options for multi-protocol wireless system design.
Technical Context
The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 handles application firmware and security services (AES-256, PKA, RNG), while the Cortex-M0+ exclusively manages real-time RF layer operations-including BLE/802.15.4 packet handling, GATT caching, EATT, and advertising extensions-ensuring deterministic timing and isolation from application interrupts.
Its RF subsystem integrates a 2.4 GHz transceiver with on-die balun, supports external PA, and complies with ETSI EN 300 328, FCC Part 15, and ARIB STD-T66. Power management includes an embedded SMPS with intelligent bypass mode, five BOR thresholds, and seven low-power modes-Stop mode draws just 2.1 µA with RTC and 256 KB RAM retained.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ for radio stack |
| Wireless Protocols | Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC, Thread 1.3, Zigbee 3.0 |
| RF Sensitivity | -96 dBm @ 1 Mbps BLE; -100 dBm @ 802.15.4 - enables robust link budget in compact PCB layouts |
| TX Output Power | Programmable up to +6 dBm in 1 dB steps - allows precise range/power trade-off tuning |
| Memory | 512 KB flash (sector PCROP protection), 256 KB SRAM (64 KB with hardware parity) |
| Low-Power Modes | 13 nA shutdown; 600 nA standby + RTC + 32 KB RAM; 2.1 µA stop + RTC + 256 KB RAM |
| Security | 3× AES-256 engines, HW PKA (RSA/ECC/DH), true RNG, 96-bit unique ID, SFI for secure stack install |
Pinout & Package
STM32WB55RCV6 is housed in a 48-pin UFQFPN package (7 × 7 mm, 0.5 mm pitch), optimized for compact wireless modules and space-constrained IoT endpoints. Pin functions are validated per ST's DS11929 Rev 18, Table 16 (STM32WB55xx pin definitions).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Main power supply (1.71–3.6 V) | Supplies both CPU and RF domains; SMPS input support enables high-efficiency conversion |
| VBAT | Backup power rail | Retains RTC and 32 backup registers during main power loss - critical for time-stamped sensor logging |
| RF_P/N | Differential RF transceiver interface | Direct connection to integrated balun; requires no external matching for basic antenna integration |
| PA_EN | External PA enable control | GPIO-driven signal to activate optional external power amplifier - extends range beyond +6 dBm |
| BOOT0 | Boot mode selection | Pulled low for main flash boot; used with NRST for system memory bootloader entry via USART/SPI/I2C |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Radio Isolation | M0+ core handles BLE/802.15.4 MAC/PHY in hard real-time, freeing M4 for application logic and security without scheduling conflict |
| Integrated Balun | Eliminates 4 external matching components - reduces BOM cost and layout area for 2.4 GHz RF front-end |
| SMPS with Bypass Mode | Switching regulator improves efficiency at medium loads; auto-bypass to LDO at light loads maintains ultra-low quiescent current |
| GATT Caching & EATT | Reduces host-side BLE stack overhead and enables concurrent ATT transactions - accelerates OTA firmware updates |
| Hardware Crypto Acceleration | AES-256, PKA, and RNG offload encryption from M4 core - essential for secure OTA and device provisioning |
Applications
| Smart Home Sensor Hub | Industrial Wireless Node |
|---|---|
Use Scenario: Battery-powered temperature/humidity/motion sensor aggregating data from multiple peripherals and transmitting via BLE and Thread to gateway. IC Role / Device Role / Timing Role: Dual-core orchestrator: M4 runs sensor fusion and local decision logic; M0+ handles concurrent BLE advertising and Thread mesh routing with sub-100 µs interrupt latency. Use Value: 2.1 µA Stop mode preserves 10+ year battery life; integrated balun and +6 dBm TX reduce external component count by ≥30% vs discrete RF solutions. | Use Scenario: Predictive maintenance node monitoring vibration, temperature, and current on rotating machinery in factory settings. IC Role / Device Role / Timing Role: Secure wireless edge processor: M4 executes FFT-based anomaly detection; M0+ maintains reliable 802.15.4 beaconing and time-synced data bursts under EMI-rich conditions. Use Value: -100 dBm 802.15.4 RX sensitivity ensures >100 m line-of-sight range; hardware AES-256 enables encrypted data upload to cloud without software crypto overhead. |
| Wearable Health Monitor | Asset Tracking Tag |
Use Scenario: Chest-worn ECG/PPG patch continuously sampling biometrics and streaming encrypted BLE data to smartphone or hub. IC Role / Device Role / Timing Role: Ultra-low-power SoC: M4 processes raw analog signals via 12-bit ADC (4.26 Msps); M0+ manages BLE connection intervals and advertising extensions for fast discovery. Use Value: 600 nA Standby + RTC + 32 KB RAM enables wake-on-event with <5 µs latency; 72 5 V-tolerant I/Os simplify interfacing with legacy analog front-ends. | Use Scenario: GPS-less indoor/outdoor logistics tag reporting location via BLE proximity and 802.15.4 mesh backhaul to fixed gateways. IC Role / Device Role / Timing Role: Multi-protocol location anchor: M4 manages RSSI-based trilateration and motion detection; M0+ synchronizes BLE scan windows and 802.15.4 slot timing per IEEE 802.15.4e TSCH. Use Value: Accurate RSSI (±1 dB) enables ±1 m proximity accuracy; 13 nA shutdown mode extends shelf life to >5 years before first deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32WB55VCT6 | Same die, VFQFPN68 package (68-pin, 8 × 8 mm); higher I/O count (72 vs 48), additional QSPI and SAI interfaces | Better suited for designs needing external flash/audio; less optimal for ultra-compact form factors | Select when board layout permits larger footprint and requires expanded peripheral bandwidth |
| nRF52840 DK | Single-core ARM Cortex-M4 @ 64 MHz; Nordic SoftDevice BLE stack only; no native 802.15.4/Thread support | Limited to BLE-centric use; lacks dual-CPU isolation, hardware PKA, and SMPS | Choose only if BLE-only operation suffices and external 802.15.4 coexistence is handled externally |
Compared with STM32WB55RCV6, the VCT6 offers more I/O and memory bandwidth at the cost of size and power efficiency, while the nRF52840 lacks integrated dual-protocol radio control and hardware security acceleration-making the RCV6 uniquely suitable for certified, multi-stack, ultra-low-power IoT endpoints.
Availability
STM32WB55RCV6 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial wireless nodes, wearable health monitors, and asset tracking tags requiring stable component supply across multi-year production cycles.
Supply support for STM32WB55RCV6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, MEMS, and power devices for industrial, automotive, and consumer markets.
The STM32WB series is ST's ultra-low-power, multi-protocol wireless MCU product line, engineered specifically for secure, certified, battery-operated IoT endpoints requiring simultaneous BLE and Thread/Zigbee connectivity with minimal external components.
FAQ
What wireless protocol stacks are pre-certified and supported on STM32WB55RCV6?
ST provides fully qualified, pre-certified Bluetooth 5.4 and IEEE 802.15.4 (Thread 1.3, Zigbee 3.0) protocol stacks in ROM and firmware libraries. These stacks run on the dedicated Cortex-M0+ core and include GATT caching, EATT, and advertising extensions-all compliant with FCC Part 15, ETSI EN 300 328, and ARIB STD-T66.
Does STM32WB55RCV6 support over-the-air (OTA) firmware updates?
Yes. The device supports secure OTA updates for both application firmware and wireless protocol stacks via Bluetooth LE and 802.15.4. Updates leverage the built-in bootloader, hardware AES-256 encryption, and Secure Firmware Installation (SFI) to ensure authenticated, integrity-checked code loading without exposing keys or plaintext binaries.
What is the role of the integrated SMPS, and how does it impact power efficiency?
The embedded SMPS is a high-efficiency step-down converter supporting 1.71–3.6 V input. It operates in switching mode for optimal efficiency at medium-to-high loads and automatically bypasses to LDO mode at light loads-maintaining ultra-low quiescent current (≤600 nA in Standby). This dual-mode operation enables >20% average power reduction versus fixed-LDO solutions across dynamic IoT workloads.
Can STM32WB55RCV6 operate without external crystal oscillators?
Yes. The device integrates a factory-trimmed 16 MHz HSI RC oscillator (±1%) and a 32 MHz internal oscillator auto-trimmed by the LSE crystal, enabling full BLE/802.15.4 operation without external HF crystals. However, for highest RF accuracy and lowest jitter, ST recommends using the 32 MHz crystal oscillator with integrated trimming capacitors-especially for time-critical mesh synchronization.
STM32WB55RCV6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 68-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 256kB Flash, 128kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 49
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 4.5mA ~ 7.9mA
- Current - Transmitting:
- 5.2mA ~ 12.7mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 68-VFQFPN (8x8)
STM32WB55RCV6 FAQ
1.How can I place an order for STM32WB55RCV6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55RCV6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55RCV6 reliable?
The price and inventory of STM32WB55RCV6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55RCV6 is usually 5 days.
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STM32WB55RCV6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55RCV6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55RCV6?
For technical support, including STM32WB55RCV6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55RCV6 requirements.
6.How does Aetrix verify that STM32WB55RCV6 is sourced from the original manufacturer or authorized distributors?
All STM32WB55RCV6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55RCV6 meets industry standards.
7.What is the process for return or replacement of STM32WB55RCV6?
All STM32WB55RCV6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55RCV6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55RCV6 part is unused and in its original packaging.
Return procedure for STM32WB55RCV6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STM32WB55RCV6 Tags

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ESP8266EX
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ESP32-S3
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DA14531-00000OG2
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ESP32-C6FH4
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DA14531-00000FX2
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NRF24L01P-T
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