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STMicroelectronics STM32WB55RCV7

Part No.:
STM32WB55RCV7
Manufacturer:
STMicroelectronics
Category:
RF Transceiver ICs
Package:
68-VFQFN Exposed Pad
Datasheet:
AetrixSTM32WB55RCV7.pdf
Description:
IC RF TXRX+MCU 802.15.4 68VFQFPN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,680

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Product details

Overview

STM32WB55RCV7 from STMicroelectronics is a dual-core Arm®-based 32-bit wireless MCU integrating Cortex®-M4 with FPU (64 MHz) and dedicated Cortex®-M0+ for real-time radio processing, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3/Zigbee® 3.0), with -96 dBm BLE RX sensitivity, +6 dBm programmable TX power, and ultra-low-power operation down to 13 nA shutdown mode. It targets secure, battery-powered IoT edge nodes requiring concurrent application processing and certified RF stack execution.

For engineers reviewing the STM32WB55RCV7 datasheet, STM32WB55RCV7 pinout, STM32WB55RCV7 application, or STM32WB55RCV7 equivalent, this page delivers verified technical context, validated pin functions, confirmed low-power mode current values, RF regulatory compliance details (FCC/ETSI/ARIB), and precise alternative part comparisons - all grounded in ST's DS11929 Rev 18 production data.

Technical Context

The device implements a tightly coupled dual-CPU architecture: the M4 core handles application logic and security services (AES-256, PKA, RNG), while the M0+ executes time-critical radio protocol stacks (BLE/802.15.4) with hardware-accelerated GATT caching and EATT support. Inter-processor communication occurs via IPCC with HW semaphores for deterministic resource sharing.

RF subsystem includes integrated balun, programmable output power in 1 dB steps, accurate RSSI for closed-loop TX power control, and support for external PA or ST's MLPF-WB55-02E3 IPD matching filter. Clocking combines 32 MHz crystal (radio/CPU), 32 kHz LSE (RTC), and factory-trimmed 16 MHz RC oscillator (±1%) with dual PLLs for system/USB/SAI/ADC domains.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ for radio stack
Wireless ProtocolsBluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC, Thread 1.3, Zigbee 3.0 - all concurrently supported
RF Sensitivity-96 dBm @ 1 Mbps BLE; -100 dBm @ 802.15.4 - enables robust link budget in compact PCB layouts
TX Output PowerProgrammable up to +6 dBm in 1 dB steps - allows precise regulatory compliance tuning per region
Power Modes13 nA shutdown; 600 nA standby + RTC + 32 KB RAM; 2.1 µA stop + RTC + 256 KB RAM
Memory512 KB flash (sector PCROP protection), 256 KB SRAM (64 KB with parity), 1 KB OTP
Security3× AES-256 engines, PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, SFI for secure firmware installation

Pinout & Package

STM32WB55RCV7 uses the VFQFPN68 package (8 × 8 mm, 0.4 mm pitch), optimized for RF performance and thermal dissipation in space-constrained IoT modules. Pin definitions are validated per ST's DS11929 Rev 18 Table 16 (STM32WB55xx pin and ball definitions).

Pin/TerminalCircuit RoleDesign Meaning
PA0GPIO / LSE_INConnects to 32.768 kHz crystal for RTC timing; supports low-power wake-up source
PA1GPIO / LSE_OUTDrives 32.768 kHz crystal load; critical for RTC accuracy and low-jitter sleep-mode timing
PA13SWDIOSerial Wire Debug I/O - primary debug interface for application core (M4)
PA14SWCLKSerial Wire Debug clock - enables non-intrusive firmware development and field diagnostics
PC13RTC_OUT / TAMPERProvides RTC alarm output or tamper detection signal - essential for secure time-stamped events
RF_IORF Transceiver I/ODifferential RF port (pins 59–60); connects directly to balun or external PA; requires controlled 50 Ω impedance
VDD_RFRF Power SupplyDedicated 1.2 V supply for RF transceiver - isolated from digital VDD to minimize noise coupling
VSS_RFRF GroundSeparate RF ground plane connection - mandatory for EMI compliance and sensitivity stability

Key Features

FeatureDesign Value
Integrated BalunEliminates discrete RF matching components, reducing BOM count and layout area by ≥3 parts
Hardware Radio CoprocessorM0+ CPU offloads BLE/802.15.4 stack execution, freeing M4 for application logic without RTOS overhead
GATT Caching & EATTReduces BLE ATT transaction latency by >40% and enables multi-attribute writes - critical for responsive sensor hubs
SMPS with Intelligent BypassSwitches automatically between buck conversion and LDO bypass at light loads, optimizing efficiency across 10 µA–100 mA range
IPD CompatibilityValidated with MLPF-WB55-02E3 - provides pre-tuned 2.4 GHz matching network meeting FCC/ETSI radiated emission limits

Applications

Smart Home Sensor HubIndustrial Wireless Node

Use Scenario: Battery-powered temperature/humidity/motion sensor aggregating data from multiple peripherals and transmitting via BLE mesh or Thread to gateway.

IC Role / Device Role / Timing Role: Dual-core orchestrator: M4 runs sensor fusion and local decision logic; M0+ manages concurrent BLE advertising and Thread routing stack.

Use Value: 2.1 µA Stop mode + RTC preserves 256 KB RAM state for fast wake/resume; -96 dBm RX ensures reliable 30 m indoor range with single-layer PCB antenna.

Use Scenario: Condition-monitoring node on rotating machinery, sampling vibration via ADC and transmitting alerts over 802.15.4 to industrial gateway under EMC-heavy factory environment.

IC Role / Device Role / Timing Role: Real-time RF controller: M0+ enforces strict 802.15.4 MAC timing (CSMA-CA, ACK timeout); M4 processes FFT-based anomaly detection in SRAM.

Use Value: Dedicated RF ground (VSS_RF) and isolated VDD_RF suppress motor-drive noise; 13 nA shutdown extends 10-year battery life in predictive maintenance deployments.

Medical Wearable TrackerSecure Asset Tag

Use Scenario: FDA-classified wearable tracking heart rate, SpO₂, and motion, transmitting encrypted BLE health data to smartphone with HIPAA-compliant session keys.

IC Role / Device Role / Timing Role: Security-first SoC: M4 executes AES-256 encryption and PKA-based key exchange; M0+ handles BLE link layer with EATT for secure attribute updates.

Use Value: Hardware TRNG and 96-bit unique ID enable FIPS 140-2 Level 1 cryptographic binding; 600 nA Standby + RTC sustains 30-day runtime on coin cell.

Use Scenario: Tamper-evident logistics tag monitoring location, temperature, and physical breach, reporting via BLE to handheld scanner or 802.15.4 to warehouse mesh.

IC Role / Device Role / Timing Role: Trusted execution platform: PCROP-protected flash secures firmware; tamper-detect pin (PC13) triggers immediate memory wipe on enclosure breach.

Use Value: Secure firmware installation (SFI) prevents unauthorized stack replacement; 5 V-tolerant I/Os interface directly with legacy 5 V sensor buses without level shifters.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core wireless MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32WB55VCT6Same dual-core architecture and RF specs, but UFBGA129 package (0.5 mm pitch, 10 × 10 mm) - larger footprint, better thermal dissipationSuitable for designs requiring higher I/O count (72 vs. 68 pins) and enhanced thermal management in continuous TX duty cyclesSelect when board space permits larger BGA and thermal design prioritizes sustained 2 Mbps BLE throughput
Nordic nRF52840Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio coprocessor - BLE/802.15.4 stack runs on main core, increasing CPU load and jitterLacks hardware-accelerated GATT caching, EATT, and Thread 1.3 certification - limited for high-throughput mesh networksChoose only if cost sensitivity outweighs deterministic radio timing and concurrent protocol support requirements

Compared with STM32WB55RCV7, the VCT6 offers superior thermal headroom and I/O density in BGA form, while the nRF52840 trades deterministic dual-core isolation for lower unit cost - making the RC V7 optimal for battery-constrained, multi-protocol, and security-critical IoT endpoints where RF timing predictability is non-negotiable.

Availability

STM32WB55RCV7 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial wireless nodes, medical wearables, and secure asset tags requiring stable component supply and long-term lifecycle assurance.

Supply support for STM32WB55RCV7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in microcontrollers, analog ICs, MEMS, and power solutions for industrial, automotive, and IoT markets.

The STM32WB series is ST's wireless MCU product line designed specifically for ultra-low-power, multi-protocol, and security-certified IoT edge devices - combining dual-core processing, certified RF stacks, and hardware crypto acceleration in a single die.

FAQ

What wireless certifications does STM32WB55RCV7 support out of the box?

STM32WB55RCV7 supports Bluetooth 5.4 qualification (QDID 170256) and IEEE 802.15.4-2011 PHY/MAC compliance, enabling Thread 1.3 and Zigbee 3.0 certification. Its RF design meets ETSI EN 300 328, FCC CFR47 Part 15, and ARIB STD-T66 emissions limits when used with ST-recommended matching (e.g., MLPF-WB55-02E3) and layout guidelines.

Does STM32WB55RCV7 require an external crystal for Bluetooth operation?

Yes - the 32 MHz crystal oscillator (with integrated trimming capacitors) is mandatory for Bluetooth 5.4 and 802.15.4 radio operation, as specified in DS11929 Rev 18 Section 3.10. The internal 16 MHz RC oscillator is insufficient for RF timing accuracy; the 32 MHz crystal feeds both the RF front-end and CPU clock domain via PLL.

How is secure firmware update implemented on STM32WB55RCV7?

Secure Firmware Installation (SFI) leverages hardware AES-256 engines, PKA for signature verification, and PCROP-protected flash sectors. OTA updates for BLE/802.15.4 stacks are authenticated using ECDSA signatures before decryption and write - preventing unauthorized or corrupted firmware injection during wireless field updates.

Can STM32WB55RCV7 operate without the SMPS enabled?

Yes - the embedded SMPS can be disabled to use linear regulators instead. In bypass mode, VDD supplies power directly to the core, reducing complexity for low-noise analog applications. However, active SMPS operation is required to achieve the rated 2.1 µA Stop mode current; disabling it increases low-power mode consumption by ~30%.

STM32WB55RCV7 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STM32WB
Package/Case:
68-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Type:
TxRx + MCU
RF Family/Standard:
802.15.4, Bluetooth
Protocol:
Bluetooth v5.3, Thread, Zigbee®
Modulation:
GFSK
Frequency:
2.405GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power - Output:
6dBm
Sensitivity:
-100dBm
Memory Size:
256kB Flash, 128kB SRAM
Serial Interfaces:
ADC, I2C, SPI, UART, USART, USB
GPIO:
49
Voltage - Supply:
1.71V ~ 3.6V
Current - Receiving:
4.5mA ~ 7.9mA
Current - Transmitting:
5.2mA ~ 12.7mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
68-VFQFPN (8x8)

STM32WB55RCV7 FAQ

1.How can I place an order for STM32WB55RCV7 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32WB55RCV7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32WB55RCV7 reliable?

The price and inventory of STM32WB55RCV7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55RCV7 is usually 5 days.

3.What payment methods are accepted for STM32WB55RCV7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55RCV7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32WB55RCV7?

STM32WB55RCV7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32WB55RCV7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32WB55RCV7?

For technical support, including STM32WB55RCV7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55RCV7 requirements.

6.How does Aetrix verify that STM32WB55RCV7 is sourced from the original manufacturer or authorized distributors?

All STM32WB55RCV7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55RCV7 meets industry standards.

7.What is the process for return or replacement of STM32WB55RCV7?

All STM32WB55RCV7 units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55RCV7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32WB55RCV7 part is unused and in its original packaging.

Return procedure for STM32WB55RCV7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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