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STMicroelectronics STM32WB55REV6TR

Part No.:
STM32WB55REV6TR
Manufacturer:
STMicroelectronics
Category:
RF Transceiver ICs
Package:
68-VFQFN Exposed Pad
Datasheet:
AetrixSTM32WB55REV6TR.pdf
Description:
IC RF TXRX+MCU 802.15.4 68VFQFPN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,163

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Product details

Overview

STM32WB55REV6TR from STMicroelectronics is a dual-core multiprotocol wireless 32-bit MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ for real-time radio processing, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3, Zigbee® 3.0), with -96 dBm BLE RX sensitivity, +6 dBm programmable TX power, and integrated balun. It targets ultra-low-power IoT edge nodes such as smart sensors and secure wireless gateways.

For engineers reviewing the STM32WB55REV6TR datasheet, STM32WB55REV6TR pinout, STM32WB55REV6TR application, or STM32WB55REV6TR equivalent, this page delivers verified RF performance specs, dual-CPU architecture details, low-power mode current values, flash/SRAM configuration, and package-specific pin mapping - all critical for BLE/802.15.4 system integration and regulatory-compliant RF design.

Technical Context

The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 handles application logic and security (AES-256, PKA, RNG), while the Cortex-M0+ exclusively manages time-critical radio stack execution, enabling concurrent BLE and 802.15.4 operation without CPU contention. Inter-processor communication uses hardware IPCC and semaphores for deterministic latency.

RF subsystem includes a fully integrated 2.4 GHz transceiver with on-die balun, programmable output power in 1 dB steps (–20 to +6 dBm), and support for GATT caching, EATT, and advertising extensions. It complies with ETSI EN 300 328, FCC Part 15, and ARIB STD-T66, and supports external PA and IPD matching chips (e.g., MLPF-WB55-02E3).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz for radio stack
Wireless Protocols Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC, Thread 1.3, Zigbee 3.0 - all concurrently supported
RF Sensitivity –96 dBm at 1 Mbps BLE; –100 dBm at 250 kbps 802.15.4 - enables robust link budget in noisy environments
TX Output Power Programmable from –20 dBm to +6 dBm in 1 dB steps - allows precise EIRP tuning for regional compliance
Memory 1 MB flash (sector-protected PCROP), 256 KB SRAM (64 KB with parity) - sufficient for dual-stack OTA updates
Power Modes 13 nA shutdown; 600 nA standby + RTC + 32 KB RAM; 2.1 µA stop + RTC + 256 KB RAM - extends battery life to years
Supply Voltage 1.71 V to 3.6 V - compatible with single-cell Li-ion, Li-SOCl₂, and alkaline battery systems
Package UFBGA129, 0.5 mm pitch, 7 × 7 mm - high I/O density (72 fast I/Os, 70 5 V-tolerant) in compact footprint

Pinout & Package

STM32WB55REV6TR is housed in a 129-ball UFBGA package (0.5 mm pitch, 7 × 7 mm body). Pin functions are validated per ST's DS11929 Rev 18, Section 4 ("Pinouts and pin description") and Table 16 ("STM32WB55xx pin and ball definitions"). Key RF pins include ANT (RF antenna interface), VDD_RF (dedicated RF supply), and VSS_RF (RF ground plane separation).

Pin/Terminal Circuit Role Design Meaning
ANT RF Antenna Interface Differential RF output/input node; requires impedance-matched layout and external matching network or IPD (e.g., MLPF-WB55-02E3)
VDD_RF / VSS_RF Dedicated RF Power/Ground Isolated analog supply/ground domain to minimize digital noise coupling into sensitive RF receiver path
PA_EN / SW_CTRL External PA Control GPIO-driven signals to enable/disable external power amplifier; supports dynamic TX power scaling
BOOT0 Boot Mode Selection High at reset selects system memory bootloader - enables UART/SPI/I²C/USB-based firmware recovery without debugger
NRST Active-Low Reset Input Asynchronous reset input with internal pull-up; accepts 1.65–5.5 V logic - tolerant of brownout or ESD-induced glitches
VDDA / VSSA Analog Supply/Ground Separate 1.71–3.6 V analog domain for ADC, comparators, and VREFBUF - ensures <±1 LSB INL under RF switching noise

Key Features

Feature Design Value
Dual-CPU Radio Architecture Hardware-isolated Cortex-M0+ executes BLE/802.15.4 stack independently - eliminates RTOS scheduling jitter in timing-critical radio events
Integrated Balun On-chip differential-to-single-ended conversion reduces external BOM by ≥3 passive components - lowers PCB area and RF tuning complexity
Secure Firmware Installation (SFI) Hardware-enforced authentication of radio stack binaries during OTA update - prevents unauthorized or corrupted stack injection
SMPS with Intelligent Bypass Embedded step-down converter achieves >85% efficiency at 10–200 mA; auto-bypasses to LDO below 5 mA - optimizes efficiency across full load range
ULPMark™ CP Score 303 - industry-leading energy efficiency benchmark for active-mode MCU + RF operation - validates sub-µA sleep and fast wake-up (<3.5 µs from Stop)
Hardware Crypto Acceleration AES-128/192/256, PKA (RSA/ECC/DH), TRNG, and CRC unit offload crypto from M4 core - enables TLS 1.2 handshake in <120 ms at 64 MHz

Applications

Smart Home Sensor Node Industrial Wireless Gateway

Use Scenario: Battery-powered temperature/humidity sensor transmitting BLE advertisements and 802.15.4 unicast data to mesh coordinator every 5 minutes.

IC Role / Device Role / Timing Role: Dual-core MCU acts as BLE peripheral and 802.15.4 end-device; M0+ handles radio timing-critical tasks (advertising interval, channel hopping), M4 processes sensor fusion and OTA update logic.

Use Value: 600 nA standby + RTC + 32 KB RAM preserves sensor state across multi-year deployments; integrated balun eliminates RF calibration labor.

Use Scenario: Edge gateway aggregating data from 50+ Thread/Zigbee end-devices and bridging to cloud via Wi-Fi/Ethernet.

IC Role / Device Role / Timing Role: Acts as Thread Border Router and BLE provisioning interface; M4 runs Linux-compatible OpenThread stack and web server; M0+ handles concurrent 802.15.4 MAC layer timing and BLE connection management.

Use Value: 256 KB SRAM enables simultaneous BLE connection (5 links) + Thread network stack + TLS stack; hardware AES-256 accelerates DTLS handshakes for secure device onboarding.

Medical Wearable Monitor Asset Tracking Tag

Use Scenario: Chest-worn ECG patch logging data locally and streaming alerts via BLE to smartphone during clinical trials.

IC Role / Device Role / Timing Role: Real-time signal acquisition (12-bit ADC @ 4.26 Msps), cryptographic signing of biometric data (PKA + AES), and low-latency BLE connection (EATT enabled).

Use Value: 13 nA shutdown mode extends CR2032 battery life beyond 18 months; medical-grade 2.048 V VREFBUF ensures ±0.5% ADC accuracy over temperature.

Use Scenario: GPS-less indoor asset tag using BLE AoA and 802.15.4 RSSI triangulation in warehouse logistics.

IC Role / Device Role / Timing Role: Simultaneous BLE direction-finding packet transmission and 802.15.4 beacon reception; M0+ synchronizes RF timestamps across protocols with <100 ns jitter.

Use Value: Accurate RSSI (±1 dB linearity) and programmable TX power enable cm-level proximity estimation; 72 I/Os support multi-antenna switching matrix without external mux.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core wireless MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
Nordic nRF52840 DK Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio CPU - BLE/802.15.4 stacks share same core; no integrated SMPS Limited concurrent protocol handling; higher CPU load during radio activity increases active-mode current (3.5 mA RX vs. STM32WB55's 4.5 mA) Prefer when BLE-only operation suffices and external DC/DC is acceptable; avoid for strict Thread/BLE coexistence requirements.
TI CC2652R1F Arm Cortex-M4F @ 48 MHz + dedicated Sensor Controller Engine (SCE); supports BLE 5.0 and IEEE 802.15.4 but not Thread 1.3 or Zigbee 3.0 out-of-box Requires TI's Z-Stack or SimpleLink SDK for Zigbee; lacks hardware PKA and 256-bit AES acceleration Choose for legacy Zigbee 3.0 deployments where TI ecosystem tooling is mandated; not suitable for Thread-certified products.

Compared with Nordic nRF52840 and TI CC2652R1F, STM32WB55REV6TR uniquely delivers certified Thread 1.3 + BLE 5.4 concurrency via hardware-isolated cores, integrated SMPS, and full hardware crypto suite - reducing BOM count by 4+ components and enabling single-chip certification for multi-protocol IoT gateways.

Availability

STM32WB55REV6TR is available at Aetrix Electronics and suitable for industrial wireless gateways, medical wearables, smart home sensors, and asset tracking tags requiring stable component supply across multi-year production cycles.

Supply support for STM32WB55REV6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog devices for industrial, automotive, and consumer markets.

This part belongs to the STM32WB wireless MCU product line, engineered specifically for secure, ultra-low-power, multi-protocol IoT endpoints and gateways - emphasizing regulatory-compliant RF integration, hardware-accelerated cryptography, and long-life battery operation.

FAQ

What is the maximum certified output power and regulatory compliance scope for STM32WB55REV6TR?

The device supports up to +6 dBm programmable TX power and is pre-certified for ETSI EN 300 328 (Europe), FCC CFR47 Part 15 (USA), and ARIB STD-T66 (Japan) when used with ST-recommended matching networks (e.g., MLPF-WB55-02E3) and layout guidelines. Final system-level certification remains the responsibility of the end equipment manufacturer.

Does STM32WB55REV6TR support over-the-air (OTA) updates for both application firmware and wireless protocol stacks?

Yes - it supports independent OTA updates for the application (running on Cortex-M4) and the BLE/802.15.4 protocol stacks (running on Cortex-M0+), using built-in bootloader with USB, USART, SPI, and I²C interfaces. Secure Firmware Installation (SFI) enforces cryptographic signature verification before stack activation.

How does the dual-CPU architecture prevent interference between application processing and radio timing?

The Cortex-M0+ executes only the time-critical radio stack (BLE/802.15.4 MAC/PHY) with hardware-protected memory and dedicated NVIC; the Cortex-M4 runs application code in separate address space. Communication occurs via IPCC mailboxes and hardware semaphores - eliminating software locks and guaranteeing sub-microsecond interrupt latency for radio events.

What are the key differences between STM32WB55REV6TR and STM32WB55CEU7 in terms of memory and package?

STM32WB55REV6TR features 1 MB flash and 256 KB SRAM in UFBGA129 (7 × 7 mm), while STM32WB55CEU7 offers 512 KB flash and 256 KB SRAM in WLCSP100 (3.14 × 3.14 mm). The REV6TR's larger flash enables concurrent dual-stack operation and field-upgradable secure boot images; its UFBGA package supports more I/Os and easier RF layout than WLCSP.

STM32WB55REV6TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STM32WB
Package/Case:
68-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Type:
TxRx + MCU
RF Family/Standard:
802.15.4, Bluetooth
Protocol:
Bluetooth v5.3, Thread, Zigbee®
Modulation:
GFSK
Frequency:
2.4GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power - Output:
6dBm
Sensitivity:
-100dBm
Memory Size:
512kB Flash, 256kB SRAM
Serial Interfaces:
ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART, USB
GPIO:
49
Voltage - Supply:
1.62V ~ 3.6V
Current - Receiving:
4.5mA ~ 9.2mA
Current - Transmitting:
4.5mA ~ 12.7mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
68-VFQFPN (8x8)

STM32WB55REV6TR FAQ

1.How can I place an order for STM32WB55REV6TR through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32WB55REV6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32WB55REV6TR reliable?

The price and inventory of STM32WB55REV6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55REV6TR is usually 5 days.

3.What payment methods are accepted for STM32WB55REV6TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55REV6TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32WB55REV6TR?

STM32WB55REV6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32WB55REV6TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32WB55REV6TR?

For technical support, including STM32WB55REV6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55REV6TR requirements.

6.How does Aetrix verify that STM32WB55REV6TR is sourced from the original manufacturer or authorized distributors?

All STM32WB55REV6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55REV6TR meets industry standards.

7.What is the process for return or replacement of STM32WB55REV6TR?

All STM32WB55REV6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55REV6TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32WB55REV6TR part is unused and in its original packaging.

Return procedure for STM32WB55REV6TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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