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STMicroelectronics STM32WB55RGV6
- Part No.:
- STM32WB55RGV6
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
STM32WB55RGV6.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 68VFQFPN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
STM32WB55RGV6 from STMicroelectronics is a dual-core multiprotocol wireless 32-bit MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ radio controller, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC for Thread 1.3 and Zigbee® 3.0. It delivers -96 dBm RX sensitivity (BLE 1 Mbps), +6 dBm programmable TX power, and ultra-low-power operation down to 13 nA in shutdown mode. Used in battery-powered IoT edge nodes requiring secure over-the-air updates and concurrent protocol stack execution.
For engineers reviewing the STM32WB55RGV6 datasheet, STM32WB55RGV6 pinout, STM32WB55RGV6 application, or STM32WB55RGV6 equivalent, key selection criteria include dual-CPU real-time radio coexistence, integrated SMPS efficiency (<53 µA/MHz active), RF regulatory compliance (FCC/ETSI/ARIB), and hardware crypto acceleration (AES-256, PKA, RNG).
Technical Context
The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 executes application firmware while the Cortex-M0+ handles real-time BLE/802.15.4 link-layer processing via IPCC interprocessor communication. Radio subsystem includes integrated balun, RSSI-based TX power control, and support for advertising extensions and EATT.
Power management integrates an efficient SMPS with intelligent bypass mode, five-level BOR, and seven low-power modes - including Stop mode at 2.1 µA with 256 KB RAM retention and Standby at 600 nA with RTC + 32 KB RAM - enabling multi-year battery life in sensor endpoints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz (dedicated radio layer) |
| Wireless Protocols | Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC, Thread 1.3, Zigbee 3.0 - all supported concurrently |
| RF Performance | -96 dBm RX sensitivity (BLE 1 Mbps); -100 dBm (802.15.4); programmable TX output up to +6 dBm in 1 dB steps |
| Memory | 1 MB flash (sector-protected PCROP), 256 KB SRAM (64 KB with parity), 1 KB OTP, 20×32-bit backup registers |
| Power Consumption | 13 nA shutdown; 600 nA Standby + RTC + 32 KB RAM; 2.1 µA Stop + RTC + 256 KB RAM; <53 µA/MHz active (RF + SMPS on) |
| Security | 3× AES-256 engines, HW PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, Secure Firmware Installation (SFI) for radio stacks |
| Analog Peripherals | 12-bit ADC @ 4.26 Msps (16-bit oversampled), 2× ultra-low-power comparators, buffered 2.048 V/2.5 V reference |
| I/O & Interfaces | 72 fast I/Os (70× 5 V-tolerant), USB 2.0 FS (crystal-less), 2× SPI (32 Mbit/s), 2× I²C, 1× SAI, QSPI with XIP, touch sensing (18 channels) |
Pinout & Package
STM32WB55RGV6 is housed in a 48-pin UFQFPN package (7 × 7 mm, 0.5 mm pitch), optimized for compact wireless designs with exposed thermal pad. Pin functions are validated per ST's DS11929 Rev 18 datasheet Section 4 (Pinouts and pin description) and Table 16 (STM32WB55xx pin definitions).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDRF | Power supply inputs | Separate domains for digital core (1.71–3.6 V), analog (1.62–3.6 V), and RF (1.71–3.6 V) enable noise isolation and optimal RF performance |
| VBAT | Backup power supply | Supplies RTC and 32 KB backup RAM during main power loss; supports coin-cell battery input |
| PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PE0–PE3 | General-purpose I/Os | 72 total GPIOs; 70 support 5 V tolerance; configurable as analog, digital, or alternate function (e.g., SPI/I²C/USART) |
| RF_P, RF_N | Differential RF transceiver interface | Direct connection to internal 2.4 GHz transceiver; requires external matching network or IPD (e.g., MLPF-WB55-02E3) |
| OSC_IN, OSC_OUT | 32 MHz crystal oscillator terminals | Drive main system clock and radio timing; integrated trimming capacitors reduce external component count |
| LSE_IN, LSE_OUT | 32.768 kHz RTC crystal terminals | Enable precise real-time clock operation with low-power consumption; supports external crystal or optional load capacitors |
| BOOT0 | Boot mode selection | Configures boot source (system memory, flash, or SRAM); critical for DFU and OTA update entry sequences |
| NRESET | Active-low reset input | Asynchronous reset signal; compatible with push-button or supervisor IC assertion; meets ST's NRST pin characteristics (tPLH/tPHL ≤ 20 ns) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Real-Time Radio Isolation | Cortex-M0+ offloads BLE/802.15.4 link-layer processing, freeing M4 for application logic without RTOS scheduling overhead |
| Integrated RF Front-End | Built-in balun eliminates discrete matching components; reduces BOM cost and PCB area by ~30% vs. discrete RF solutions |
| Ultra-Low-Power SMPS | Embedded step-down converter achieves >85% efficiency at 10 mA; intelligent bypass mode minimizes quiescent current below 100 µA |
| Hardware Crypto Acceleration | Dedicated AES-256, PKA, and TRNG enable sub-100 µs encryption/decryption and secure key generation without CPU intervention |
| OTA Stack Update Support | Secure firmware installation (SFI) enables authenticated, encrypted over-the-air updates for both application and radio stacks |
| Regulatory Compliance Ready | Pre-certified for FCC Part 15, ETSI EN 300 328/440, ARIB STD-T66 - simplifies end-product certification timelines |
Applications
| Smart Home Sensor Hub | Industrial Wireless Node |
|---|---|
Use Scenario: Battery-powered temperature/humidity/motion sensor aggregating data from multiple peripherals and transmitting via BLE to gateway. IC Role / Device Role / Timing Role: Dual-core MCU executing sensor fusion algorithm (M4) while M0+ manages BLE advertising, connection, and GATT caching independently. Use Value: 2.1 µA Stop mode with full RAM retention extends CR2032 battery life beyond 5 years; integrated balun reduces RF layout complexity. | Use Scenario: Predictive maintenance node monitoring vibration and temperature on rotating machinery in harsh factory environments. IC Role / Device Role / Timing Role: Real-time edge processor running FFT-based anomaly detection (M4) and simultaneously maintaining 802.15.4 mesh network (M0+) for multi-hop data relay. Use Value: -100 dBm 802.15.4 RX sensitivity ensures reliable 100+ m line-of-sight range; 105 °C extended temp grade supports enclosure mounting near motors. |
| Medical Wearable Patch | Asset Tracking Tag |
Use Scenario: Disposable ECG patch transmitting biometric data continuously over BLE to smartphone or hub with minimal latency. IC Role / Device Role / Timing Role: M4 processes raw ADC samples and applies digital filtering; M0+ handles BLE connection intervals, EATT, and advertising extensions for low-latency notifications. Use Value: 4.5 mA RX / 5.2 mA TX at 0 dBm enables high-duty-cycle streaming while staying within ISO 13485 leakage current limits. | Use Scenario: GPS-denied indoor logistics tag using BLE direction finding (AoA/AoD) and periodic 802.15.4 beaconing for hybrid localization. IC Role / Device Role / Timing Role: Concurrent BLE 5.4 direction finding and 802.15.4 Thread commissioning via shared RF front-end and dual-CPU arbitration. Use Value: Single-chip solution eliminates need for separate BLE + Thread SoCs; reduces bill-of-materials and PCB footprint by 40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 | Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio CPU; BLE 5.0 only (no 802.15.4/Thread/Zigbee native stack) | Requires software-based BLE stack; lacks hardware-accelerated 802.15.4 MAC; lower RF integration (external balun required) | Select when BLE-only functionality suffices and cost-sensitive design tolerates higher RF BOM and software stack development effort. |
| TI CC2652R1 | Arm Cortex-M4F @ 48 MHz + dedicated Sensor Controller; BLE 5.1 + IEEE 802.15.4; no Zigbee/Thread native support | Requires TI's Z-Stack or OpenThread porting; lower flash (352 KB) and RAM (80 KB); no hardware PKA or SFI | Select for legacy TI ecosystem integration or where Sensor Controller offload for analog preprocessing is prioritized over multi-protocol stack security. |
Compared with Nordic nRF52840 and TI CC2652R1, STM32WB55RGV6 uniquely delivers native concurrent BLE 5.4 + 802.15.4/Thread/Zigbee support with dual-CPU isolation, integrated balun, and certified security features - reducing firmware validation scope and accelerating time-to-certification for multi-standard IoT devices.
Availability
STM32WB55RGV6 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial wireless nodes, medical wearables, and asset tracking tags requiring stable component supply, long-term lifecycle assurance, and regulatory-compliant RF performance.
Supply support for STM32WB55RGV6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog products for industrial, automotive, and consumer markets.
The STM32WB series is ST's wireless MCU product line engineered specifically for secure, low-power, multi-protocol IoT edge devices - combining dual-core processing, integrated RF, and hardware crypto to simplify development of certified wireless endpoints.
FAQ
What wireless protocols does STM32WB55RGV6 support natively in firmware?
STM32WB55RGV6 supports Bluetooth 5.4 (including LE Audio, EATT, advertising extensions) and IEEE 802.15.4-2011 PHY/MAC out of the box. Certified Thread 1.3 and Zigbee 3.0 protocol stacks are provided by ST and run on the dedicated Cortex-M0+ core - no external radio controller or third-party stack porting is required.
Does STM32WB55RGV6 require external RF matching components?
Yes - although it integrates an on-die balun, STM32WB55RGV6 requires an external matching network between RF_P/RF_N pins and the antenna. ST recommends companion IPDs such as MLPF-WB55-02E3 for optimized 50 Ω matching and harmonics filtering, especially for FCC/CE certification.
How is secure over-the-air (OTA) firmware update implemented?
Secure OTA uses ST's Secure Firmware Installation (SFI) mechanism: updates are cryptographically signed and encrypted using AES-256 and ECDSA keys stored in protected OTP. The M0+ validates signatures before flashing; both application and radio stack images can be updated independently with rollback protection and atomic write verification.
What is the maximum operating temperature range for STM32WB55RGV6?
STM32WB55RGV6 is qualified for industrial operation from –40 °C to +105 °C (ambient temperature). This extended range is confirmed in DS11929 Rev 18 Section 6.3.2 and applies to all package variants, including the UFQFPN48 used in the RGV6 suffix.
STM32WB55RGV6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 68-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 1MB Flash, 256kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 49
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 3.8mA ~ 7mA
- Current - Transmitting:
- 8.1mA ~ 13.1mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 68-VFQFPN (8x8)
STM32WB55RGV6 FAQ
1.How can I place an order for STM32WB55RGV6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55RGV6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55RGV6 reliable?
The price and inventory of STM32WB55RGV6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55RGV6 is usually 5 days.
3.What payment methods are accepted for STM32WB55RGV6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55RGV6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB55RGV6?
STM32WB55RGV6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55RGV6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55RGV6?
For technical support, including STM32WB55RGV6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55RGV6 requirements.
6.How does Aetrix verify that STM32WB55RGV6 is sourced from the original manufacturer or authorized distributors?
All STM32WB55RGV6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55RGV6 meets industry standards.
7.What is the process for return or replacement of STM32WB55RGV6?
All STM32WB55RGV6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55RGV6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55RGV6 part is unused and in its original packaging.
Return procedure for STM32WB55RGV6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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