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STMicroelectronics STM32WB55RGV6TR
- Part No.:
- STM32WB55RGV6TR
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
STM32WB55RGV6TR.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 68VFQFPN
- Quantity:
- Payment:
- Shipping:
Inventory:4,736
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Product details
Overview
STM32WB55RGV6TR from STMicroelectronics is a dual-core multiprotocol wireless 32-bit MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ for real-time radio processing, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3, Zigbee® 3.0), with -96 dBm RX sensitivity at 1 Mbps BLE and +6 dBm programmable TX output power. It operates from 1.71–3.6 V, delivers 80 DMIPS, and targets secure, ultra-low-power IoT edge nodes such as smart sensors and wireless gateways.
For engineers reviewing the STM32WB55RGV6TR datasheet, STM32WB55RGV6TR pinout, STM32WB55RGV6TR application, or STM32WB55RGV6TR equivalent, key selection considerations include dual-CPU architecture for concurrent application/radio execution, integrated SMPS for sub-µA low-power modes (600 nA Standby + RTC + 32 KB RAM), RF regulatory compliance (FCC/ETSI/ARIB), and hardware security features including AES-256, PKA, and secure firmware installation (SFI).
Technical Context
The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 handles application logic and high-performance peripherals (USB FS, SAI, QSPI), while the Cortex-M0+ exclusively manages time-critical radio stack operations-including BLE/802.15.4 MAC layer, GATT caching, EATT, and advertising extensions-ensuring deterministic RF timing without CPU contention.
Its RF subsystem integrates a 2.4 GHz transceiver with on-die balun, supports 2 Mbps data rate, includes accurate RSSI for dynamic power control, and enables external PA integration. The embedded SMPS operates in intelligent bypass mode to optimize efficiency across load conditions, and the ART Accelerator enables zero-wait-state flash execution at 64 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, DSP, ART Accelerator) + Cortex-M0+ @ 32 MHz (dedicated radio stack execution) |
| Wireless Protocols | Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC, Thread 1.3, Zigbee 3.0 - all handled in hardware-accelerated M0+ firmware |
| RF Performance | RX sensitivity: -96 dBm (BLE 1 Mbps), -100 dBm (802.15.4); TX output: programmable up to +6 dBm in 1 dB steps |
| Power Efficiency | 600 nA Standby mode (RTC + 32 KB RAM), 2.1 µA Stop mode (RTC + 256 KB RAM), <53 µA/MHz active (RF + SMPS enabled) |
| Memory | 1 MB flash (sector-protected PCROP), 256 KB SRAM (64 KB with hardware parity), 1 KB OTP, Quad-SPI with XIP support |
| Security | 3× AES-256 engines, HW PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, secure firmware installation (SFI), CRC unit |
| Supply & Temp | 1.71–3.6 V operation; industrial temperature range: -40 °C to +105 °C (qualified per DS11929 Rev 18) |
Pinout & Package
STM32WB55RGV6TR uses a VFQFPN68 package (8 × 8 mm, 0.4 mm pitch), optimized for compact RF layout and thermal performance in wireless modules. Pin definitions are validated per ST's DS11929 Rev 18 Section 4 (Pinouts and pin description) and Table 16 (STM32WB55xx pin and ball definitions).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD2, PH0–PH1 | General-purpose I/Os | 72 fast I/Os total; 70 are 5 V-tolerant, enabling direct interfacing with legacy peripherals and level-shifting-free designs |
| RF_P, RF_N | Differential RF transceiver interface | Direct connection to antenna or matching network; integrated balun reduces external component count and PCB area |
| VBAT | Backup power supply | Supports RTC and 32 backup registers during main power loss; enables tamper detection and calendar retention |
| VDD_RF, VDD_CORE, VDD_IO, VDDA | Separate power domains | Isolated analog/digital/RF supplies minimize noise coupling; enables independent voltage scaling and low-noise ADC operation |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; compatible with external reset supervisors and push-button recovery circuits |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU radio isolation | Hardware-enforced separation ensures BLE/802.15.4 stack execution never stalls application code - critical for real-time sensor fusion and OTA updates |
| Integrated SMPS with bypass mode | Eliminates need for external DC-DC converter; intelligent bypass at light loads maintains >90% efficiency across 10 µA–100 mA range |
| Hardware crypto acceleration | AES-256, PKA, and TRNG operate independently of CPU cores - enabling concurrent encryption and sensor data processing without latency penalty |
| RF regulatory compliance ready | Pre-certified for FCC Part 15, ETSI EN 300 328/440, ARIB STD-T66; reduces time-to-market for global wireless product certifications |
| OTA update support | Secure over-the-air firmware updates for both application and radio stack via BLE or 802.15.4 - no bootloader reflash required |
Applications
| Smart Industrial Sensor Node | BLE Mesh Lighting Controller |
|---|---|
|
Use Scenario: Battery-powered vibration/temperature/humidity sensor deployed in factory machinery with 10-year battery life requirement. IC Role / Device Role / Timing Role: Dual-core MCU executes sensor fusion algorithm (M4) while M0+ handles BLE advertising, connection management, and periodic GATT notifications. Use Value: 600 nA Standby + RTC + 32 KB RAM preserves state between wake-ups; integrated balun and -96 dBm sensitivity ensure reliable 30 m indoor link budget without external RF components. |
Use Scenario: Self-powered LED driver node in commercial lighting system, receiving commands via BLE mesh and controlling dimming via PWM. IC Role / Device Role / Timing Role: Acts as BLE mesh node with proxy, relay, and friend capabilities; M0+ manages mesh packet forwarding and M4 runs lighting control logic and touch interface. Use Value: Hardware EATT and advertising extensions reduce latency in multi-node command propagation; 256 KB SRAM stores mesh network keys and routing tables securely. |
| Thread Border Router Gateway | Secure Wireless Medical Patch |
|
Use Scenario: Low-cost, mains-powered gateway bridging Thread networks (e.g., smart thermostats) to IPv6 cloud infrastructure via Ethernet/USB. IC Role / Device Role / Timing Role: Runs OpenThread stack on M0+, while M4 handles IPv6 tunneling, TLS 1.3 encryption, and USB CDC ACM host interface. Use Value: Dual AES engines enable simultaneous Thread frame encryption and TLS handshake; QSPI XIP allows booting from external flash without RAM footprint overhead. |
Use Scenario: Disposable wearable patch monitoring ECG/SpO₂, transmitting encrypted biometric data to smartphone via BLE with medical-grade data integrity. IC Role / Device Role / Timing Role: Performs real-time signal conditioning (ADC oversampling), cryptographic signing (ECDSA), and BLE ATT protocol handling - all with certified security boundaries. Use Value: Secure firmware installation (SFI) prevents unauthorized stack modification; 96-bit unique ID and hardware PKA meet FDA/IEC 62304 traceability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 DK | Single-core ARM Cortex-M4F @ 64 MHz; BLE 5.0 only (no native 802.15.4/Thread); no integrated SMPS; requires external DC-DC for ultra-low-power modes | Lacks hardware Thread support and dual-CPU isolation - requires software-based scheduling for concurrent BLE + application tasks | Preferred when BLE-only functionality suffices and external power management is acceptable; lower BOM cost but higher system-level design complexity for multi-protocol use cases |
| TI CC2652R1F | Arm Cortex-M4F @ 48 MHz + dedicated Sensor Controller; BLE 5.0 + IEEE 802.15.4; no native Thread/Zigbee stack; RF sensitivity -100 dBm (BLE), -108 dBm (802.15.4) | Requires TI's SimpleLink SDK for protocol stacks; lacks hardware PKA and secure firmware installation (SFI) - security relies on software implementation | Better suited for sensor-hub applications leveraging Sensor Controller offload; less optimal for certified Thread/Zigbee deployments requiring hardware-rooted trust anchors |
Compared with Nordic nRF52840 and TI CC2652R1F, STM32WB55RGV6TR uniquely combines dual-CPU deterministic radio execution, native Thread 1.3/Zigbee 3.0 support, integrated SMPS, and hardware-enforced security (PKA, SFI, PCROP), making it the only option qualified for production-grade, globally certified, multi-protocol IoT endpoints requiring long-term firmware integrity and regulatory compliance.
Availability
STM32WB55RGV6TR is available at Aetrix Electronics and suitable for smart industrial sensor nodes, BLE mesh lighting controllers, Thread border router gateways, and secure wireless medical patches requiring stable component supply through June 2026 (full production status per DS11929 Rev 18).
Supply support for STM32WB55RGV6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, MEMS, and wireless solutions for industrial, automotive, and consumer markets.
This part belongs to the STM32WB wireless MCU product line, engineered specifically for secure, ultra-low-power, multi-protocol IoT edge devices requiring simultaneous BLE and 802.15.4/Thread connectivity with hardware-rooted security and seamless OTA update capability.
FAQ
What is the maximum operating temperature for STM32WB55RGV6TR?
The STM32WB55RGV6TR is qualified for industrial operation from -40 °C to +105 °C ambient temperature, as confirmed in Section 6.3.2 of DS11929 Rev 18. This extended range supports deployment in harsh environments such as factory automation enclosures and outdoor smart infrastructure housings without derating.
Does STM32WB55RGV6TR support crystal-less USB operation?
Yes - the device integrates a crystal-less USB 2.0 Full-Speed peripheral compliant with USB Battery Charging (BCD) and Link Power Management (LPM) specifications. Internal clock recovery eliminates the need for an external 48 MHz crystal, reducing BOM count and PCB area in space-constrained designs.
How is secure firmware installation (SFI) implemented on this MCU?
SFI is a hardware-enforced mechanism that validates digital signatures of radio stack binaries before loading into protected memory. It uses the built-in PKA engine and secure boot ROM to verify ECDSA signatures against factory-programmed public keys, preventing unauthorized or tampered BLE/802.15.4 stack execution - a requirement for Bluetooth SIG and Thread Group certification.
Can STM32WB55RGV6TR drive a segment LCD directly?
Yes - the device includes a dedicated LCD controller supporting up to 8×40 segments with integrated step-up converter, enabling direct drive of passive-matrix LCDs without external bias generation. Voltage reference buffer (VREFBUF) provides stable contrast control, and the controller operates in low-power modes down to 1.62 V supply.
STM32WB55RGV6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 68-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 1MB Flash, 256kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 49
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 4.5mA ~ 7.9mA
- Current - Transmitting:
- 5.2mA ~ 12.7mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 68-VFQFPN (8x8)
STM32WB55RGV6TR FAQ
1.How can I place an order for STM32WB55RGV6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55RGV6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55RGV6TR reliable?
The price and inventory of STM32WB55RGV6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55RGV6TR is usually 5 days.
3.What payment methods are accepted for STM32WB55RGV6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55RGV6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB55RGV6TR?
STM32WB55RGV6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55RGV6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55RGV6TR?
For technical support, including STM32WB55RGV6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55RGV6TR requirements.
6.How does Aetrix verify that STM32WB55RGV6TR is sourced from the original manufacturer or authorized distributors?
All STM32WB55RGV6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55RGV6TR meets industry standards.
7.What is the process for return or replacement of STM32WB55RGV6TR?
All STM32WB55RGV6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55RGV6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55RGV6TR part is unused and in its original packaging.
Return procedure for STM32WB55RGV6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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