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STMicroelectronics STM32WB55RGV7
- Part No.:
- STM32WB55RGV7
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
STM32WB55RGV7.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 68VFQFPN
- Quantity:
- Payment:
- Shipping:
Inventory:7,030
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Product details
Overview
STM32WB55RGV7 from STMicroelectronics is a dual-core 32-bit wireless MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ radio controller, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC for Thread 1.3 and Zigbee® 3.0. It delivers -96 dBm RX sensitivity (BLE 1 Mbps), +6 dBm programmable TX power, and ultra-low-power operation down to 13 nA in shutdown mode. Designed for secure, battery-powered IoT edge nodes requiring concurrent application processing and certified RF stack execution.
For engineers reviewing the STM32WB55RGV7 datasheet, STM32WB55RGV7 pinout, STM32WB55RGV7 application, or STM32WB55RGV7 equivalent, key selection criteria include dual-CPU architecture for real-time radio coexistence, integrated SMPS with intelligent bypass, hardware AES-256 and PKA acceleration, and RF regulatory compliance (FCC Part 15, ETSI EN 300 328).
Technical Context
The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 executes application firmware while the Cortex-M0+ handles real-time BLE/802.15.4 link-layer operations via IPCC interprocessor communication. Radio subsystem includes integrated balun, RSSI measurement, advertising extensions, and EATT support - enabling low-latency, deterministic wireless protocol timing without host CPU intervention.
Power management integrates a high-efficiency SMPS step-down converter with automatic bypass mode, five selectable BOR thresholds, and seven low-power modes including Stop mode with 256 KB RAM retention at 2.1 µA. Clock system combines 32 MHz crystal oscillator (with trimming capacitors), 32 kHz LSE for RTC, and auto-trimmed multispeed internal RC (±0.25% accuracy).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz (dedicated radio layer) |
| Wireless Protocols | Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC - supports Thread 1.3 and Zigbee 3.0 stacks |
| RF Performance | RX sensitivity: -96 dBm (BLE 1 Mbps), -100 dBm (802.15.4); TX output: programmable up to +6 dBm in 1 dB steps |
| Memory | 1 MB flash (sector PCROP protection), 256 KB SRAM (64 KB with hardware parity) |
| Power Modes | 13 nA shutdown, 600 nA standby + RTC + 32 KB RAM, 2.1 µA stop + RTC + 256 KB RAM |
| Security | 3× AES-256 engines, HW PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, SFI for secure stack installation |
| Analog Peripherals | 12-bit ADC @ 4.26 Msps (16-bit oversampling), 2× ultra-low-power comparators, VREFBUF (2.048 V / 2.5 V) |
Pinout & Package
STM32WB55RGV7 uses the VFQFPN68 package (8 × 8 mm, 0.4 mm pitch), optimized for compact RF layout and thermal performance in space-constrained IoT modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Main power supply | 1.71–3.6 V input powering both cores, peripherals, and RF transceiver |
| VSS | Ground reference | Dedicated analog/digital ground pins ensure noise isolation for RF and ADC operation |
| RF_P/N | Differential RF transceiver interface | Direct connection to antenna or external PA; integrated balun reduces external component count |
| OSC_IN/OSC_OUT | 32 MHz crystal oscillator terminals | Supports crystal-based clocking for radio and CPU with integrated trimming capacitors |
| LSE_IN/LSE_OUT | 32.768 kHz RTC crystal terminals | Enables precise timekeeping and low-power wake-up timing independent of main clock |
| BOOT0 | Boot mode selection | Configures boot source (system memory, flash, or SRAM) during reset |
| NRESET | Active-low reset input | Asynchronous reset signal compatible with external supervisors and power sequencing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Real-Time Radio Isolation | Separate Cortex-M0+ core offloads BLE/802.15.4 link-layer processing, eliminating timing jitter on M4 application thread |
| Integrated RF Balun | Reduces BOM by eliminating discrete matching network; maintains impedance control across temperature and voltage |
| Hardware Security Engine | AES-256, PKA, TRNG, and Secure Firmware Installation (SFI) enable end-to-end encrypted OTA updates and device identity binding |
| Ultra-Low-Power SMPS | Embedded step-down converter with intelligent bypass mode improves efficiency across load range - critical for coin-cell and energy-harvesting systems |
| Adaptive Real-Time Accelerator (ART) | Enables zero-wait-state execution from flash at 64 MHz, reducing code footprint and power vs. SRAM-only execution |
Applications
| Smart Home Sensor Node | Industrial Wireless Gateway |
|---|---|
Use Scenario: Battery-powered temperature/humidity sensor transmitting data every 5 minutes via BLE to smartphone or via Thread to home hub. IC Role / Device Role / Timing Role: Dual-core MCU executes sensor fusion algorithm on M4 while M0+ autonomously manages BLE advertising and connection intervals. Use Value: 600 nA standby current extends CR2032 battery life beyond 5 years; integrated balun ensures FCC-certified RF performance without layout-sensitive external components. | Use Scenario: Edge gateway aggregating data from multiple 802.15.4/Zigbee sensors and forwarding via Ethernet or cellular to cloud. IC Role / Device Role / Timing Role: M4 runs Linux-compatible RTOS and protocol translation; M0+ handles concurrent BLE and 802.15.4 MAC layer timing with sub-microsecond jitter. Use Value: Hardware IPC (IPCC) and semaphores prevent race conditions during multi-protocol packet handling; 1 MB flash stores dual-stack firmware and secure bootloader. |
| Medical Wearable Monitor | Asset Tracking Tag |
Use Scenario: Chest-worn ECG patch using BLE to stream raw waveform data to mobile app with real-time R-peak detection. IC Role / Device Role / Timing Role: M4 performs DSP filtering and QRS detection; M0+ maintains BLE connection with GATT caching to minimize reconnection latency. Use Value: 12-bit ADC at 4.26 Msps captures high-fidelity biopotential signals; hardware AES encrypts patient data before transmission. | Use Scenario: GPS-less indoor asset tag using BLE AoA/AoD or 802.15.4-based trilateration in warehouse environments. IC Role / Device Role / Timing Role: M0+ executes precise timing-critical radio ranging sequences; M4 processes location algorithms and manages battery telemetry. Use Value: Accurate RSSI measurement and programmable TX power enable calibrated distance estimation; 13 nA shutdown mode preserves battery during idle periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 DK | Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio CPU - BLE/802.15.4 stack runs on same core with RTOS scheduling | Limited deterministic timing for concurrent protocols; lower RF sensitivity (-95 dBm BLE) | Preferred for cost-sensitive BLE-only designs where dual-core isolation is not required |
| TI CC2652RB | Arm Cortex-M4F @ 48 MHz + dedicated Sensor Controller; integrated RF BAW resonator (no external crystal needed) | No native Thread/Zigbee 3.0 stack support; requires external flash for full protocol stacks | Best for ultra-low-power sensor nodes needing sub-µA sleep but lacking multi-protocol certification requirements |
Compared with nRF52840 and CC2652RB, STM32WB55RGV7 uniquely provides hardware-isolated dual CPUs for guaranteed real-time BLE/802.15.4 coexistence, integrated balun for simplified RF design, and full regulatory-certified stacks - making it optimal for production-grade multi-protocol IoT endpoints requiring long-term firmware maintainability and security.
Availability
STM32WB55RGV7 is available at Aetrix Electronics and suitable for smart home sensor nodes, industrial wireless gateways, medical wearables, and asset tracking tags requiring stable component supply across multi-year production cycles.
Supply support for STM32WB55RGV7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs with strong emphasis on industrial and IoT applications.
The STM32WB series is ST's wireless MCU product line designed specifically for secure, low-power, multi-protocol IoT edge devices - combining dual-core processing, certified wireless stacks, and hardware security in a single chip.
FAQ
What wireless protocol stacks are pre-certified and included with STM32WB55RGV7?
ST provides fully certified, production-ready Bluetooth 5.4 Low Energy and IEEE 802.15.4-2011 protocol stacks - including Thread 1.3 and Zigbee 3.0 - validated against FCC Part 15, ETSI EN 300 328, and ARIB STD-T66. These stacks run on the dedicated Cortex-M0+ core and are delivered as binary images with SFI support for secure over-the-air updates.
Does STM32WB55RGV7 require external RF matching components?
No - STM32WB55RGV7 integrates a balun directly into the die, enabling direct connection to a 50 Ω antenna or external PA without discrete matching networks. This simplifies PCB layout, reduces BOM cost, and improves RF performance consistency across manufacturing lots and environmental conditions.
How is secure firmware update implemented on this MCU?
Secure Firmware Installation (SFI) leverages hardware AES-256 encryption, PKA-based signature verification, and flash sector protection (PCROP) to authenticate and install OTA updates. The process validates cryptographic signatures using ECDSA keys stored in protected memory, ensuring only authorized firmware signed by the OEM can be loaded onto the device.
What development tools and debug interfaces are supported?
STM32WB55RGV7 supports Serial Wire Debug (SWD) and JTAG for both Cortex-M4 and Cortex-M0+ cores, plus cross-triggering between them. ST's STM32CubeWB ecosystem provides drivers, middleware, and examples for BLE/802.15.4, along with STM32CubeProgrammer for secure flashing and STM32CubeMonitor-RF for real-time RF analysis.
STM32WB55RGV7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 68-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 1MB Flash, 256kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 49
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 4.5mA ~ 7.9mA
- Current - Transmitting:
- 5.2mA ~ 12.7mA
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 68-VFQFPN (8x8)
STM32WB55RGV7 FAQ
1.How can I place an order for STM32WB55RGV7 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55RGV7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55RGV7 reliable?
The price and inventory of STM32WB55RGV7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55RGV7 is usually 5 days.
3.What payment methods are accepted for STM32WB55RGV7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55RGV7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB55RGV7?
STM32WB55RGV7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55RGV7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55RGV7?
For technical support, including STM32WB55RGV7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55RGV7 requirements.
6.How does Aetrix verify that STM32WB55RGV7 is sourced from the original manufacturer or authorized distributors?
All STM32WB55RGV7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55RGV7 meets industry standards.
7.What is the process for return or replacement of STM32WB55RGV7?
All STM32WB55RGV7 units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55RGV7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55RGV7 part is unused and in its original packaging.
Return procedure for STM32WB55RGV7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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