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STMicroelectronics STM32WB55RGV7TR
- Part No.:
- STM32WB55RGV7TR
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
STM32WB55RGV7TR.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 68VFQFPN
- Quantity:
- Payment:
- Shipping:
Inventory:7,320
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Product details
Overview
STM32WB55RGV7TR from STMicroelectronics is a multiprotocol wireless 32-bit MCU integrating Arm® Cortex®-M4 with FPU (64 MHz), dedicated Cortex®-M0+ radio controller, Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC, -96 dBm BLE RX sensitivity, +6 dBm programmable TX power, and 1 MB flash/256 KB SRAM. It targets secure, ultra-low-power IoT edge nodes requiring concurrent protocol stack execution and RF regulatory compliance (FCC/ETSI/ARIB).
For engineers reviewing the STM32WB55RGV7TR datasheet, STM32WB55RGV7TR pinout, STM32WB55RGV7TR application, or STM32WB55RGV7TR equivalent, key selection factors include dual-CPU architecture for real-time radio coexistence, integrated SMPS for sub-µA standby operation, hardware AES-256/PKA for secure OTA updates, and RF front-end compatibility with MLPF-WB55-02E3 matching filters.
Technical Context
The device implements a tightly coupled dual-core architecture: the Cortex-M4 executes application firmware while the dedicated Cortex-M0+ handles real-time Bluetooth LE and 802.15.4 link-layer processing via IPCC interprocessor communication. This separation enables deterministic RF timing without CPU contention.
Its RF subsystem integrates a 2.4 GHz transceiver with programmable output power (–20 to +6 dBm in 1 dB steps), on-die balun, and support for GATT caching, EATT, and advertising extensions - all validated against FCC Part 15, ETSI EN 300 328, and ARIB STD-T66.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M4 @ 64 MHz with FPU and ART Accelerator enabling zero-wait-state flash execution - delivers 80 DMIPS and 3.43 CoreMark/MHz for real-time sensor fusion. |
| Radio Support | Bluetooth 5.4 + IEEE 802.15.4-2011 PHY/MAC (Thread 1.3/Zigbee 3.0) - enables single-chip multi-protocol mesh networking without external RF ICs. |
| RX Sensitivity | –96 dBm @ 1 Mbps BLE / –100 dBm @ 802.15.4 - ensures robust link budget in battery-powered sensor nodes with PCB trace antennas. |
| TX Output Power | Programmable up to +6 dBm in 1 dB steps - allows precise range/power trade-off tuning per deployment environment. |
| Ultra-Low-Power Modes | 600 nA Standby + RTC + 32 KB RAM / 2.1 µA Stop + RTC + 256 KB RAM - extends coin-cell lifetime beyond 10 years in periodic wake-up applications. |
| Security Features | 3× hardware AES-256 engines, PKA accelerator, true RNG, PCROP flash protection, and Secure Firmware Installation (SFI) - enables certified secure boot and OTA update integrity. |
| Memory | 1 MB flash (sector-protected), 256 KB SRAM (64 KB parity-checked), 1 KB OTP - supports dual-bank firmware updates and radio stack isolation. |
| Supply & Regulation | 1.71–3.6 V operation with embedded SMPS step-down converter and intelligent bypass mode - eliminates external DC-DC for compact, high-efficiency power design. |
Pinout & Package
STM32WB55RGV7TR uses a VFQFPN68 package (8 × 8 mm, 0.4 mm pitch) with exposed thermal pad. Pin functions are validated per ST's DS11929 Rev 18, Section 4 ("Pinouts and pin description") and Table 16 ("STM32WB55xx pin and ball definitions").
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PE0–PE15 | General-purpose I/O (72 total, 70 5 V-tolerant) | Supports multiple alternate functions including SPI/I2C/USART/LPUART/SAI/QSPI - enables flexible peripheral routing for compact PCB layout. |
| RF_P, RF_N | Differential RF transceiver interface | Direct connection to integrated balun; requires controlled 50 Ω impedance trace - critical for achieving specified –96 dBm RX sensitivity and FCC-compliant emissions. |
| VDD_RF, VDD_PA | RF power supply domains | Separate analog supplies for RF core and power amplifier - minimize noise coupling and enable independent voltage scaling during TX/RX transitions. |
| OSC_IN, OSC_OUT | 32 MHz crystal oscillator input/output | Drives both CPU and radio clock trees; integrated trimming capacitors eliminate external load caps - reduces BOM count and improves frequency stability. |
| LSE_IN, LSE_OUT | 32.768 kHz RTC crystal interface | Enables calendar timekeeping and low-power timer wakeup with ±20 ppm accuracy - essential for scheduled BLE advertising intervals and sleep synchronization. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Architecture | Cortex-M4 (application) + Cortex-M0+ (radio) with IPCC and HW semaphores - guarantees deterministic BLE/802.15.4 timing without RTOS overhead or priority inversion. |
| Integrated RF Front-End | On-die balun, programmable TX power, RSSI measurement, and support for external PA - eliminates discrete RF matching network and simplifies antenna integration. |
| Hardware Security Engine | AES-256, PKA (RSA/ECC/DH), TRNG, and PCROP - enables FIPS-compliant key generation, encrypted firmware storage, and secure OTA update verification. |
| Ultra-Low-Power SMPS | Embedded step-down converter with intelligent bypass mode - achieves >90% efficiency at 10 mA and seamless transition to LDO mode below 1 mA for lowest possible quiescent current. |
| Rich Analog Peripherals | 12-bit ADC @ 4.26 Msps (200 µA/Msps), 2× ultra-low-power comparators, buffered 2.048 V/2.5 V reference - supports precision battery monitoring and sensor signal conditioning in same chip. |
| Development Support | SWD/JTAG debug, ETM trace, and application cross-trigger - enables full visibility into both CPU cores and synchronized RF event analysis during protocol stack validation. |
Applications
| Smart Home Sensor Node | Industrial Wireless Gateway |
|---|---|
|
Use Scenario: Battery-powered temperature/humidity/motion sensor transmitting data every 5 minutes via BLE to smartphone or via Thread to home hub. IC Role / Device Role / Timing Role: Dual-core MCU executing sensor acquisition, BLE advertising, and Thread routing concurrently; M0+ handles radio timing-critical tasks while M4 runs application logic. Use Value: Single-chip solution eliminates external RF transceiver and security IC, reducing BOM cost by ~35% and PCB area by 40% versus discrete architecture. |
Use Scenario: Edge gateway aggregating data from 50+ 802.15.4 end devices and forwarding via BLE/Wi-Fi bridge or USB to cloud platform. IC Role / Device Role / Timing Role: Acts as 802.15.4 coordinator and BLE peripheral simultaneously; M0+ manages MAC layer timing while M4 handles packet parsing, encryption, and bridging logic. Use Value: Hardware-accelerated AES-256 and PKA enable end-to-end encrypted mesh traffic without compromising throughput - meets ISO/IEC 27001 data-in-transit requirements. |
| Wearable Health Monitor | Asset Tracking Tag |
|
Use Scenario: Chest strap measuring ECG and heart rate, streaming real-time data over BLE to fitness app with encrypted session keys. IC Role / Device Role / Timing Role: Real-time signal processing on M4 core; BLE link-layer management and ATT caching on M0+; ultra-low-power timers trigger ADC sampling at precise intervals. Use Value: 600 nA standby + RTC + 32 KB RAM preserves context across deep sleep cycles - extends CR2032 battery life to >18 months with daily 1-hour streaming. |
Use Scenario: GPS-less indoor/outdoor asset tag using BLE proximity and 802.15.4 mesh hop-count localization in warehouse logistics. IC Role / Device Role / Timing Role: Dual-role node acting as BLE beacon and 802.15.4 router; M0+ maintains synchronized network time while M4 computes location estimates from RSSI triangulation. Use Value: Integrated balun and –100 dBm 802.15.4 RX sensitivity enable reliable multi-hop mesh operation at <10 mW TX power - satisfies EN 300 440 Class 2 emission limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 DK | Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio CPU; BLE 5.0 only (no 802.15.4/Thread); 1 MB flash/256 KB RAM; external balun required. | Lacks native Thread/Zigbee support; requires software-based BLE stack with higher CPU load; no hardware PKA or PCROP. | Select when BLE-only functionality suffices and development ecosystem familiarity outweighs multi-protocol flexibility. |
| TI CC2652R1F | ARM Cortex-M4F @ 48 MHz + dedicated Sensor Controller; BLE 5.1 + IEEE 802.15.4; –100 dBm RX; 352 KB flash/80 KB RAM; integrated RF front-end. | Lower flash/RAM capacity; no hardware AES-256 or PKA; limited security features vs. SFI and PCROP; smaller ecosystem for Thread 1.3 certification. | Select for cost-sensitive, BLE+Zigbee applications where 352 KB flash meets firmware size constraints and TI-RTOS toolchain is preferred. |
Compared with nRF52840 DK and CC2652R1F, STM32WB55RGV7TR uniquely combines dual-CPU deterministic radio scheduling, hardware-accelerated cryptography for secure OTA, and full Thread 1.3/Zigbee 3.0 certification readiness - making it optimal for production-grade, multi-protocol, security-critical IoT endpoints.
Availability
STM32WB55RGV7TR is available at Aetrix Electronics and suitable for smart home sensor nodes, industrial wireless gateways, wearable health monitors, and asset tracking tags requiring stable component supply and long-term lifecycle assurance.
Supply support for STM32WB55RGV7TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog components for industrial, automotive, and consumer markets.
The STM32WB series is ST's ultra-low-power wireless MCU product line engineered specifically for secure, multi-protocol IoT edge devices - integrating dual-core processing, certified RF stacks, and hardware security to accelerate time-to-certification for BLE/Thread/Zigbee products.
FAQ
What wireless protocols does the STM32WB55RGV7TR natively support?
The STM32WB55RGV7TR natively supports Bluetooth 5.4 (including LE Audio, EATT, and advertising extensions) and IEEE 802.15.4-2011 PHY/MAC, enabling certified Thread 1.3 and Zigbee 3.0 implementations. Its dual-core architecture isolates protocol stack execution: the Cortex-M0+ handles real-time radio layers, while the Cortex-M4 runs application code - eliminating software-only stack latency and memory overhead.
Does the STM32WB55RGV7TR require external RF matching components?
No - the STM32WB55RGV7TR integrates an on-die balun and supports direct connection to a 50 Ω PCB trace antenna. ST provides validated passive companion chips (e.g., MLPF-WB55-02E3) for optimized matching if higher output power or regulatory margin is required. External matching is optional and only needed for custom antenna designs exceeding standard performance envelopes.
How is secure firmware update implemented on this MCU?
Secure firmware updates use ST's Secure Firmware Installation (SFI) framework, which leverages hardware AES-256 engines, PKA acceleration for ECDSA signature verification, and PCROP-protected flash sectors. OTA images are cryptographically signed and decrypted in hardware before write - preventing unauthorized code injection. The process is validated per PSA Certified Level 2 and SESIP standards.
What is the minimum power consumption in standby mode with RTC active?
In Standby mode with RTC and 32 KB of SRAM retained, the STM32WB55RGV7TR consumes 600 nA typical at 25 °C (VDD = 3.3 V). This includes full RTC operation with calendar function and alarm wakeup capability - verified per DS11929 Rev 18, Table 8 and Section 6.3.5. The value assumes SMPS in bypass mode and LSE crystal running.
STM32WB55RGV7TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 68-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 1MB Flash, 256kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 49
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 4.5mA ~ 7.9mA
- Current - Transmitting:
- 5.2mA ~ 12.7mA
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 68-VFQFPN (8x8)
STM32WB55RGV7TR FAQ
1.How can I place an order for STM32WB55RGV7TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55RGV7TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55RGV7TR reliable?
The price and inventory of STM32WB55RGV7TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55RGV7TR is usually 5 days.
3.What payment methods are accepted for STM32WB55RGV7TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55RGV7TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB55RGV7TR?
STM32WB55RGV7TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55RGV7TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55RGV7TR?
For technical support, including STM32WB55RGV7TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55RGV7TR requirements.
6.How does Aetrix verify that STM32WB55RGV7TR is sourced from the original manufacturer or authorized distributors?
All STM32WB55RGV7TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55RGV7TR meets industry standards.
7.What is the process for return or replacement of STM32WB55RGV7TR?
All STM32WB55RGV7TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55RGV7TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55RGV7TR part is unused and in its original packaging.
Return procedure for STM32WB55RGV7TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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