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STMicroelectronics STM32WB55VCQ6

Part No.:
STM32WB55VCQ6
Manufacturer:
STMicroelectronics
Category:
RF Transceiver ICs
Package:
129-UFBGA
Datasheet:
AetrixSTM32WB55VCQ6.pdf
Description:
IC RF TXRX+MCU 802.15.4 129UFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,505

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Product details

Overview

STM32WB55VCQ6 from STMicroelectronics is a dual-core, multiprotocol wireless 32-bit MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ radio controller. It supports Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3/Zigbee® 3.0), delivers -96 dBm RX sensitivity at 1 Mbps BLE, +6 dBm programmable TX power, and operates from 1.71–3.6 V across -40 °C to 105 °C. It targets secure, ultra-low-power IoT edge nodes such as smart sensors and wireless gateways.

For engineers reviewing the STM32WB55VCQ6 datasheet, STM32WB55VCQ6 pinout, STM32WB55VCQ6 application, or STM32WB55VCQ6 equivalent, key selection criteria include dual-CPU real-time radio coexistence, integrated SMPS for sub-µA standby (600 nA), hardware AES-256/ECDSA/RNG security, and RF regulatory compliance (FCC/ETSI/ARIB).

Technical Context

The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 handles application logic and high-speed peripherals (USB, SAI, QSPI), while the Cortex-M0+ exclusively manages real-time Bluetooth LE and 802.15.4 protocol stacks via IPCC interprocessor messaging. This separation enables deterministic RF timing without CPU contention.

Its RF subsystem integrates a 2.4 GHz transceiver with on-die balun, supports 2 Mbps BLE data rate and advertising extensions, and includes EATT (Enhanced ATT) and GATT caching for reduced latency in connected devices. The embedded SMPS with intelligent bypass mode dynamically optimizes efficiency across active and low-power modes.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz (dedicated radio stack execution)
Wireless Protocols Bluetooth 5.4 (LE only), IEEE 802.15.4-2011 PHY/MAC - enabling Thread 1.3 and Zigbee 3.0 certified implementations
RF Performance RX sensitivity: -96 dBm (BLE 1 Mbps), -100 dBm (802.15.4); TX output: programmable up to +6 dBm in 1 dB steps
Power Modes 600 nA Standby (RTC + 32 KB RAM), 2.1 µA Stop (RTC + 256 KB RAM), <53 µA/MHz active (RF + SMPS enabled)
Memory 512 KB flash (sector PCROP protection), 256 KB SRAM (64 KB with hardware parity), 1 KB OTP, Quad-SPI XIP interface
Security 3× AES-256 engines, PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, secure firmware installation (SFI) for radio stack
Package UFQFPN48 (7 × 7 mm, 0.5 mm pitch), 48-pin, RoHS-compliant ECOPACK2

Pinout & Package

STM32WB55VCQ6 is housed in a 48-pin UFQFPN (Ultra Thin Fine Pitch Quad Flat No-lead) package measuring 7 × 7 mm with 0.5 mm pitch. The package supports reflow soldering and provides 72 fast I/Os (70 of which are 5 V-tolerant), including dedicated RF pins (RFIO, RFVSS, RFVDD) and dual crystal oscillator inputs (HSE 32 MHz, LSE 32 kHz).

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VDDRF Power supply domains Separate analog (VDDA), RF (VDDRF), and digital (VDD) rails enable noise isolation and optimized power sequencing
RFIO RF transceiver antenna interface Differential RF input/output terminal; requires external matching network or IPD (e.g., MLPF-WB55-02E3) for 50 Ω impedance
HSE_IN / HSE_OUT Main system clock source 32 MHz crystal oscillator pair for CPU and radio timing; integrated trimming capacitors reduce BOM count
LSE_IN / LSE_OUT Real-time clock reference 32 kHz crystal oscillator input for RTC accuracy and low-power wake-up timing
BOOT0 Boot mode selection Configures boot source (system memory, flash, or SRAM); pulled low by default for main application execution
NRST Active-low reset input Asynchronous reset pin compatible with standard push-button or supervisor IC assertion

Key Features

Feature Design Value
Dual-CPU IPC Inter-Processor Communication Controller (IPCC) enables zero-copy message passing between M4 and M0+, eliminating polling overhead in BLE/802.15.4 stack handoff
Integrated SMPS Embedded step-down converter with automatic bypass mode reduces external component count and improves efficiency across 10 µA–100 mA load range
Hardware Security On-chip PKA accelerator accelerates ECC key generation (P-256) in <10 ms; AES-256 engines support simultaneous encryption/decryption for OTA updates
Low-Power RF 4.5 mA RX / 5.2 mA TX (0 dBm) current draw enables battery-powered operation >5 years in sensor beacon use cases
RF Regulatory Compliance Pre-certified for ETSI EN 300 328, FCC Part 15.247, and ARIB STD-T66 - eliminates need for full RF retesting in end equipment

Applications

Smart Industrial Sensor Node BLE Mesh Lighting Controller

Use Scenario: Wireless temperature/humidity/pressure node in factory automation, transmitting data every 5 seconds to gateway.

IC Role / Device Role / Timing Role: Dual-core MCU executes sensor fusion algorithm (M4) while M0+ handles BLE advertising and connection management with sub-100 µs interrupt latency.

Use Value: 600 nA standby + 2.1 µA stop mode extends CR2032 battery life beyond 7 years; integrated balun cuts RF BOM cost by $0.15/unit.

Use Scenario: Self-healing lighting control node supporting Bluetooth Mesh provisioning and group commands in commercial buildings.

IC Role / Device Role / Timing Role: M0+ runs certified Mesh stack (v1.1), M4 manages local dimming logic and DALI bridge interface; GATT caching reduces command response time to <20 ms.

Use Value: EATT support enables concurrent multi-attribute writes; +6 dBm TX ensures reliable 30 m indoor mesh hop distance without external PA.

Secure Asset Tracker Zigbee 3.0 Smart Home Hub

Use Scenario: GPS-enabled logistics tracker reporting location via BLE to smartphone app and 802.15.4 to cloud gateway.

IC Role / Device Role / Timing Role: M4 processes GPS NMEA parsing and motion-triggered wake-up; M0+ switches RF protocol context between BLE and 802.15.4 in <150 µs.

Use Value: Hardware RNG + AES-256 + secure boot prevents cloning/firmware tampering; 96-bit unique ID enables cryptographic device binding.

Use Scenario: Multi-protocol hub bridging Zigbee 3.0 end devices (thermostats, door locks) to Wi-Fi cloud infrastructure.

IC Role / Device Role / Timing Role: M0+ hosts Zigbee PRO stack (ZBOSS), M4 runs TLS 1.3 over USB/Wi-Fi interface; IPCC synchronizes attribute reports across protocols.

Use Value: 256 KB SRAM accommodates full Zigbee stack + application; Quad-SPI XIP allows direct execution from external flash, reducing internal memory pressure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core wireless MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32WB55RGV6 Same die, VFQFPN68 package (68-pin, 8 × 8 mm); adds 2x more GPIOs and extra ADC channels Better suited for designs requiring >48 I/Os or additional analog sensing (e.g., multi-sensor hubs) Select when board layout allows larger footprint and higher pin count is needed for expansion
Nordic nRF52840 DK Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio CPU - BLE/802.15.4 handled in software stack Higher CPU load during RF activity; lacks hardware-accelerated ECC/PKA and SMPS integration Choose for simpler BLE-only designs where cost sensitivity outweighs security/low-power requirements

Compared with STM32WB55VCQ6, the RG variant offers scalability in I/O and analog resources within the same ecosystem, while the nRF52840 trades deterministic RF timing and integrated power management for lower unit cost and broader SDK adoption in pure BLE use cases.

Availability

STM32WB55VCQ6 is available at Aetrix Electronics and suitable for industrial sensor networks, smart building controllers, and secure asset tracking systems requiring stable component supply through 2030 and beyond.

Supply support for STM32WB55VCQ6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, and wireless solutions for industrial, automotive, and IoT markets.

The STM32WB series is ST's flagship multiprotocol wireless MCU product line, designed specifically for secure, battery-operated IoT endpoints requiring simultaneous BLE and 802.15.4 connectivity with minimal external components.

FAQ

What wireless certifications does STM32WB55VCQ6 support out-of-the-box?

The STM32WB55VCQ6 is pre-qualified for ETSI EN 300 328 (Europe), FCC CFR47 Part 15.247 (USA), and ARIB STD-T66 (Japan) at the module level when used with ST-recommended matching networks (e.g., MLPF-WB55-02E3). Full end-product certification still requires system-level testing, but RF design effort and risk are significantly reduced.

How does the dual-CPU architecture improve real-time wireless performance?

The Cortex-M0+ core is hardwired to the RF subsystem and executes only the Bluetooth LE and 802.15.4 protocol stacks - isolating timing-critical radio operations from application tasks running on the M4. This eliminates jitter from OS scheduling or interrupt latency, ensuring sub-100 µs response to RF events like packet reception or timer expiration.

Can STM32WB55VCQ6 operate without an external crystal?

No - the device requires both a 32 MHz HSE crystal (for CPU and radio clock) and a 32 kHz LSE crystal (for RTC and low-power timing). Internal RC oscillators (MSI, LSI) are insufficient for BLE/802.15.4 compliance due to frequency stability requirements (<±20 ppm for BLE, <±40 ppm for 802.15.4), and the datasheet explicitly mandates crystal use for RF operation.

What development tools are officially supported for firmware deployment?

ST provides STM32CubeWB firmware package, STM32CubeMX configuration tool, and ST-LINK/V2-1 debugger. Over-the-air (OTA) updates are supported via BLE and 802.15.4 using ST's certified bootloader. Third-party IDEs including Keil MDK, IAR EWARM, and GCC-based toolchains (e.g., PlatformIO) are fully supported with CMSIS-Pack integration.

STM32WB55VCQ6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STM32WB
Package/Case:
129-UFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Type:
TxRx + MCU
RF Family/Standard:
802.15.4, Bluetooth
Protocol:
Bluetooth v5.3, Thread, Zigbee®
Modulation:
GFSK
Frequency:
2.405GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power - Output:
6dBm
Sensitivity:
-100dBm
Memory Size:
256kB Flash, 128kB SRAM
Serial Interfaces:
ADC, I2C, SPI, UART, USART, USB
GPIO:
30
Voltage - Supply:
1.71V ~ 3.6V
Current - Receiving:
4.5mA ~ 7.9mA
Current - Transmitting:
5.2mA ~ 12.7mA
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
129-UFBGA (7x7)

STM32WB55VCQ6 FAQ

1.How can I place an order for STM32WB55VCQ6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32WB55VCQ6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32WB55VCQ6 reliable?

The price and inventory of STM32WB55VCQ6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55VCQ6 is usually 5 days.

3.What payment methods are accepted for STM32WB55VCQ6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55VCQ6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32WB55VCQ6?

STM32WB55VCQ6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32WB55VCQ6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32WB55VCQ6?

For technical support, including STM32WB55VCQ6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55VCQ6 requirements.

6.How does Aetrix verify that STM32WB55VCQ6 is sourced from the original manufacturer or authorized distributors?

All STM32WB55VCQ6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55VCQ6 meets industry standards.

7.What is the process for return or replacement of STM32WB55VCQ6?

All STM32WB55VCQ6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55VCQ6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32WB55VCQ6 part is unused and in its original packaging.

Return procedure for STM32WB55VCQ6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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