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STMicroelectronics STM32WB55VCY6TR
- Part No.:
- STM32WB55VCY6TR
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 100-UFBGA, WLCSP
- Datasheet:
-
STM32WB55VCY6TR.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 100WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:14,838
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Product details
Overview
STM32WB55VCY6TR from STMicroelectronics is a dual-core multiprotocol wireless 32-bit MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ for real-time radio processing, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3, Zigbee® 3.0), with -96 dBm RX sensitivity at 1 Mbps BLE and +6 dBm programmable TX power. It operates from 1.71–3.6 V, delivers 80 DMIPS, and includes 512 KB flash and 256 KB SRAM - deployed in smart locks, industrial sensor nodes, and medical wearables requiring secure over-the-air updates.
For engineers reviewing the STM32WB55VCY6TR datasheet, STM32WB55VCY6TR pinout, STM32WB55VCY6TR application, or STM32WB55VCY6TR equivalent, key selection criteria include dual-CPU architecture for concurrent application/radio execution, integrated SMPS for ultra-low-power operation (2.1 µA Stop mode + RTC + 256 KB RAM), RF regulatory compliance (FCC/ETSI/ARIB), and hardware security features including AES-256, PKA, and secure firmware installation (SFI).
Technical Context
The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 handles application logic and high-performance computation, while the Cortex-M0+ exclusively manages time-critical Bluetooth Low Energy and 802.15.4 protocol stacks via IPCC interprocessor communication. This separation enables deterministic RF timing and eliminates software-induced radio latency.
RF subsystem integration includes an on-die balun, programmable output power in 1 dB steps (–20 to +6 dBm), support for 2 Mbps data rate, EATT (Enhanced ATT), advertising extensions, and GATT caching - all compliant with FCC Part 15, ETSI EN 300 328, and ARIB STD-T66 regulations without external RF front-end components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz for radio stack - enables concurrent application and protocol processing without resource contention. |
| Wireless Protocols | Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC - supports Thread 1.3 and Zigbee 3.0 out-of-box; no external protocol stack required. |
| RF Performance | RX sensitivity: –96 dBm (BLE 1 Mbps), –100 dBm (802.15.4); TX output: up to +6 dBm in 1 dB steps - meets link budget requirements for 100+ m range in typical indoor environments. |
| Power Modes | 2.1 µA Stop mode + RTC + 256 KB RAM; 600 nA Standby + RTC + 32 KB RAM - enables multi-year battery life in coin-cell-powered IoT endpoints. |
| Memory | 512 KB flash (sector protection/PCROP), 256 KB SRAM (64 KB with parity) - sufficient for dual-stack firmware plus application code with secure OTA update capability. |
| Security | 3× AES-256 accelerators, PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, SFI for secure radio stack installation - satisfies PSA Level 2 and SESIP certification prerequisites. |
| Analog Peripherals | 12-bit ADC @ 4.26 Msps (16-bit oversampling), 2× ultra-low-power comparators, buffered 2.048 V/2.5 V reference - supports precision sensor interfacing with sub-µA active current. |
Pinout & Package
STM32WB55VCY6TR is housed in a WLCSP100 package (0.4 mm pitch, 7 × 7 mm body), optimized for space-constrained wearable and portable designs. The package integrates 100 solder balls with defined RF, power, and digital I/O domains per ST's official pin definition table (DS11929 Rev 18, Table 16).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PA0 | GPIO / LSE_OUT | Configurable as low-speed external oscillator output or general-purpose I/O; critical for RTC clock accuracy when using 32.768 kHz crystal. |
| PA13 / PA14 | SWDIO / SWCLK | Dedicated Serial Wire Debug interface pins - enable non-intrusive debugging and programming without JTAG overhead. |
| PA15 / PB3 / PB4 | JTDI / JTDO / JTCK | Optional JTAG debug pins - usable only if SWD is disabled; not required for standard development flow. |
| RF_IO | RF Transceiver I/O | Single-pin RF interface supporting both TX and RX paths via internal switch; connects directly to matching network or IPD (e.g., MLPF-WB55-02E3). |
| VDD_RF / VDD_PA | RF Power Supplies | Separate 1.2 V (VDD_RF) and 1.8 V (VDD_PA) rails - isolate sensitive RF circuitry from digital noise and enable independent power gating. |
| VSS | Digital Ground | Primary digital reference plane; must be connected to solid ground plane with low-inductance vias to minimize switching noise coupling into RF section. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Radio Architecture | Hardware-isolated Cortex-M0+ handles BLE/802.15.4 MAC/PHY in real time, freeing M4 for application tasks - eliminates software scheduling jitter in time-sensitive radio operations. |
| Integrated RF Front-End | On-die balun and RF switch reduce BOM count by ≥3 passive components and eliminate layout sensitivity in 2.4 GHz matching networks. |
| Ultra-Low-Power SMPS | Embedded step-down converter with intelligent bypass mode achieves >90% efficiency across 10 µA–100 mA loads - extends battery life while maintaining stable core voltage during RF bursts. |
| Secure Firmware Installation (SFI) | Hardware-enforced authentication and encryption of radio stack binaries during OTA update - prevents unauthorized or corrupted stack loading into protected memory regions. |
| Hardware Crypto Acceleration | Dedicated AES-256, PKA (ECC/RSA), and TRNG engines offload cryptographic operations from CPU - reduce BLE connection setup time by >40% and enable secure key exchange in <10 ms. |
Applications
| Smart Locks | Industrial Sensor Nodes |
|---|---|
Use Scenario: Battery-powered door lock with BLE provisioning, remote access, and tamper detection. IC Role / Device Role / Timing Role: Primary system-on-chip managing BLE connectivity, motor control, accelerometer-based intrusion sensing, and secure key storage. Use Value: Dual-core isolation ensures BLE advertising remains uninterrupted during motor actuation; 2.1 µA Stop mode enables >3-year CR2477 battery life. | Use Scenario: Wireless temperature/humidity node in factory automation, reporting via Thread to border router. IC Role / Device Role / Timing Role: Edge intelligence hub executing sensor fusion, 802.15.4 MAC layer, and Thread 1.3 stack with deterministic packet timing. Use Value: Integrated RF front-end and –100 dBm 802.15.4 sensitivity ensure reliable mesh networking in electrically noisy industrial environments. |
| Medical Wearables | Asset Trackers |
Use Scenario: ECG patch transmitting raw biosignals via BLE to smartphone with local preprocessing. IC Role / Device Role / Timing Role: Real-time signal acquisition (ADC @ 4.26 Msps), FIR filtering (M4), and low-latency BLE streaming (M0+). Use Value: Hardware oversampling (to 16-bit) and 64 KB SRAM with parity enable clinical-grade signal fidelity without external memory. | Use Scenario: GPS-less indoor asset tracker using BLE AoA/AoD and RSSI-based location estimation. IC Role / Device Role / Timing Role: High-accuracy RSSI measurement engine (+/-1 dB linearity) synchronized with BLE advertising events. Use Value: On-chip RSSI calibration and dedicated RF timer reduce location error to <2 m in dense office environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 DK | Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio CPU - BLE/802.15.4 stack runs on same core, increasing interrupt latency under load. | Lacks hardware-accelerated Thread/Zigbee support; requires external 802.15.4 PHY for full Thread 1.3 compliance. | Prefer when BLE-only use case dominates and cost sensitivity outweighs deterministic RF timing needs. |
| TI CC2652R1 | Arm Cortex-M4F @ 48 MHz + dedicated Sensor Controller Engine (SCE); RF sensitivity –100 dBm (BLE), but no native 802.15.4 MAC support. | Requires TI's proprietary BLE stack; Thread/Zigbee require external host MCU or custom porting effort. | Choose for legacy TI ecosystem integration or where ultra-low active current (<4.2 mA RX) is prioritized over multi-protocol flexibility. |
Compared with Nordic nRF52840 and TI CC2652R1, STM32WB55VCY6TR uniquely delivers hardware-isolated dual-CPU execution for concurrent BLE and 802.15.4 stacks, integrated Thread 1.3/Zigbee 3.0 support without external components, and PSA-certifiable security primitives - making it optimal for certified multi-protocol edge devices requiring long battery life and regulatory compliance.
Availability
STM32WB55VCY6TR is available at Aetrix Electronics and suitable for smart lock systems, industrial sensor networks, medical wearables, and asset tracking solutions requiring stable component supply, long-term lifecycle assurance, and full regulatory documentation.
Supply support for STM32WB55VCY6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog chips for industrial, automotive, and consumer markets.
The STM32WB series targets secure, low-power wireless edge devices - combining dual-core processing, multi-protocol RF, and hardware crypto to accelerate development of certified IoT endpoints without compromising on battery life or security.
FAQ
What is the maximum operating temperature range for STM32WB55VCY6TR?
The STM32WB55VCY6TR is rated for industrial operation from –40 °C to +105 °C ambient temperature. This extended range is validated per ST's DS11929 Rev 18 specification and enables deployment in harsh environments such as factory floors, outdoor gateways, and automotive cabin modules without thermal derating.
Does STM32WB55VCY6TR support over-the-air (OTA) firmware updates for both application and radio stack?
Yes - the device supports secure OTA updates for both application firmware and the Bluetooth Low Energy/802.15.4 radio stack via its built-in bootloader. Updates are authenticated using hardware public-key acceleration (PKA) and encrypted with AES-256, ensuring integrity and confidentiality without external security co-processors.
Can STM32WB55VCY6TR operate without an external crystal oscillator?
No - the device requires a 32 MHz crystal for main system clock and RF timing accuracy, and a 32.768 kHz crystal for RTC functionality. While internal RC oscillators exist (e.g., 16 MHz ±1%), they lack the stability needed for BLE/802.15.4 radio compliance and are not qualified for RF transmission.
What companion chip is recommended for RF matching with STM32WB55VCY6TR?
ST recommends the MLPF-WB55-02E3 integrated passive device (IPD) for optimized 2.4 GHz matching. This single-component solution replaces discrete balun + matching network, reduces PCB area by >50%, and maintains RF performance across process/voltage/temperature variations per ST Application Note AN5165.
STM32WB55VCY6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 100-UFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 256kB Flash, 128kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 72
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 4.5mA ~ 7.9mA
- Current - Transmitting:
- 5.2mA ~ 12.7mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-WLCSP (4.4x4.38)
STM32WB55VCY6TR FAQ
1.How can I place an order for STM32WB55VCY6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55VCY6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55VCY6TR reliable?
The price and inventory of STM32WB55VCY6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55VCY6TR is usually 5 days.
3.What payment methods are accepted for STM32WB55VCY6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55VCY6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB55VCY6TR?
STM32WB55VCY6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55VCY6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55VCY6TR?
For technical support, including STM32WB55VCY6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55VCY6TR requirements.
6.How does Aetrix verify that STM32WB55VCY6TR is sourced from the original manufacturer or authorized distributors?
All STM32WB55VCY6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55VCY6TR meets industry standards.
7.What is the process for return or replacement of STM32WB55VCY6TR?
All STM32WB55VCY6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55VCY6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55VCY6TR part is unused and in its original packaging.
Return procedure for STM32WB55VCY6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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