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STMicroelectronics STM32WB55VGQ6
- Part No.:
- STM32WB55VGQ6
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 129-UFBGA
- Datasheet:
-
STM32WB55VGQ6.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 129UFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,648
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Product details
Overview
STM32WB55VGQ6 from STMicroelectronics is a dual-core 32-bit wireless MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ radio controller, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3, Zigbee® 3.0), with -96 dBm RX sensitivity at 1 Mbps BLE, +6 dBm programmable TX power, and ultra-low-power operation down to 13 nA in shutdown mode. It targets secure, battery-powered IoT edge nodes requiring concurrent application processing and certified RF stack execution.
For engineers reviewing the STM32WB55VGQ6 datasheet, STM32WB55VGQ6 pinout, STM32WB55VGQ6 application, or STM32WB55VGQ6 equivalent, key selection criteria include dual-CPU isolation for real-time radio coexistence, integrated SMPS with bypass mode, hardware AES-256 and PKA acceleration, PCROP-protected flash for secure OTA updates, and RF regulatory compliance (FCC/ETSI/ARIB).
Technical Context
The device implements a tightly coupled dual-CPU architecture: the M4 executes application firmware while the M0+ handles time-critical Bluetooth LE and 802.15.4 link-layer operations via IPCC interprocessor messaging and hardware semaphores. Radio subsystem includes integrated balun, RSSI-based TX power control, and support for external PA or IPD matching filters (e.g., MLPF-WB55-02E3).
Power management features an embedded SMPS step-down converter with intelligent bypass mode, five-level BOR, and seven low-power modes - including Stop mode with RTC + 256 KB RAM at 2.1 µA - enabling multi-year battery life in sensor nodes. Clock system combines 32 MHz crystal (radio/CPU), 32 kHz LSE (RTC), and auto-trimmed internal oscillators for robust timing across operating conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz (dedicated radio layer) |
| Wireless Protocols | Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC, Thread 1.3, Zigbee 3.0 - all supported concurrently in single-chip solution |
| RF Performance | RX sensitivity: -96 dBm (BLE 1 Mbps), -100 dBm (802.15.4); TX output: programmable up to +6 dBm in 1 dB steps |
| Memory | 1 MB flash (sector PCROP protection), 256 KB SRAM (64 KB with parity), 1 KB OTP, 20×32-bit backup registers |
| Power Consumption | 13 nA shutdown, 600 nA standby + RTC + 32 KB RAM, 2.1 µA stop + RTC + 256 KB RAM, <53 µA/MHz active (RF + SMPS on) |
| Security | 3× hardware AES-256 engines, PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, secure firmware installation (SFI) for radio stacks |
| Package | UFQFPN48 (7 × 7 mm, 0.4 mm pitch), 48-pin, lead-free, ECOPACK2 compliant |
Pinout & Package
STM32WB55VGQ6 uses a 48-pin Ultra-Fine Pitch Quad Flat No-lead (UFQFPN48) package with 0.4 mm pitch and 7 × 7 mm body size. The package supports reflow soldering and provides 72 fast I/Os (70 of which are 5 V-tolerant), with dedicated RF pins (RFIO, VSSRF, VDDRF) routed to minimize noise coupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Main power supply and ground | Core logic and analog domain supply (1.71–3.6 V); decoupling required per datasheet layout guidelines |
| VDDRF, VSSRF | RF power and ground | Isolated RF supply domain; mandatory separation from digital VDD to ensure EMI immunity and RF performance |
| RFIO | RF transceiver I/O | Differential RF port; connects directly to integrated balun or external matching network for 2.4 GHz operation |
| HSE_IN / HSE_OUT | 32 MHz crystal oscillator interface | Drives both CPU and radio clock domains; internal trimming capacitors eliminate need for external load caps |
| LSE_IN / LSE_OUT | 32.768 kHz RTC crystal interface | Enables precise real-time clock operation during low-power modes; supports external crystal or internal RC fallback |
| BOOT0 | Boot mode selection | Configures boot source (system memory, flash, or SRAM); pulled low by default for main application execution |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU IPC | Inter-Processor Communication Controller (IPCC) enables deterministic, low-latency message passing between M4 and M0+ without shared memory contention |
| Hardware Security | Three independent AES-256 accelerators allow parallel encryption of application data, BLE stack, and 802.15.4 frames - critical for end-to-end secure mesh networks |
| Ultra-Low-Power RF | Integrated balun reduces external component count; RSSI accuracy ±3 dB enables closed-loop TX power adaptation for regulatory-compliant emissions |
| Smart Power Management | Embedded SMPS with automatic bypass mode dynamically switches between switching and LDO regulation based on load current - optimizing efficiency across sleep/active transitions |
| Secure OTA Updates | PCROP-protected flash sectors isolate radio stack from application code, enabling authenticated over-the-air updates without compromising stack integrity |
Applications
| Smart Home Sensor Hub | Industrial Wireless Node |
|---|---|
Use Scenario: Battery-powered temperature/humidity/motion sensor aggregating data from multiple peripherals and transmitting via BLE to gateway and via 802.15.4 to Thread border router. IC Role / Device Role / Timing Role: Dual-core MCU acts as concurrent BLE peripheral and 802.15.4 router; M0+ handles radio timing-critical tasks while M4 runs sensor fusion and local decision logic. Use Value: Single-chip solution eliminates external radio IC and interconnect latency; PCROP-secured flash ensures trusted radio stack execution during long-term field deployment. | Use Scenario: Predictive maintenance node monitoring motor vibration and ambient temperature in factory setting, transmitting encrypted telemetry via BLE to handheld tool and via Thread to cloud-connected infrastructure. IC Role / Device Role / Timing Role: Acts as secure edge endpoint with hardware-accelerated AES-256 and PKA for certificate-based authentication; RTC + backup RAM retains state across brownouts. Use Value: 2.1 µA Stop mode + RTC + full 256 KB RAM preserves context during intermittent power loss; SMPS bypass mode extends battery life under variable load conditions. |
| Medical Wearable | Asset Tracking Tag |
Use Scenario: Disposable ECG patch transmitting continuous waveform data via BLE to smartphone app and periodic status reports via 802.15.4 to hospital mesh network. IC Role / Device Role / Timing Role: M4 processes raw ADC samples and applies digital filtering; M0+ manages BLE connection intervals and 802.15.4 beacon scheduling with sub-millisecond jitter. Use Value: 12-bit ADC at 4.26 Msps with hardware oversampling delivers clinical-grade signal fidelity; 13 nA shutdown mode enables multi-year shelf life before activation. | Use Scenario: GPS-denied indoor logistics tag using BLE for proximity detection and 802.15.4 for multi-hop location reporting in warehouse environment. IC Role / Device Role / Timing Role: Functions as dual-role BLE advertiser and 802.15.4 end-device; leverages GATT caching and EATT for efficient attribute exchange during high-density scanning. Use Value: Advertising extension support allows transmission of longer payload in single packet; integrated balun ensures consistent RF performance across production units without tuning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 | Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio CPU - BLE/802.15.4 stack runs on same core with RTOS scheduling overhead | Limited concurrent protocol handling; requires software arbitration for BLE + Thread coexistence | Preferred when cost-sensitive designs accept higher firmware complexity and reduced real-time determinism |
| TI CC2652R | Dual-core (M3 + proprietary radio CPU); supports BLE 5.0 and 802.15.4 but lacks Thread 1.3/Zigbee 3.0 certification out-of-box | Requires TI's SimpleLink SDK and proprietary stack licensing; no native hardware AES-256 acceleration | Suitable for legacy TI ecosystem projects where migration to ST's open Mbed-OS support is not required |
Compared with nRF52840 and CC2652R, STM32WB55VGQ6 offers hardware-isolated radio processing, built-in Thread 1.3 and Zigbee 3.0 certification, and three independent AES engines - reducing firmware development effort and improving security posture for certified IoT deployments.
Availability
STM32WB55VGQ6 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial wireless nodes, medical wearables, and asset tracking tags requiring stable component supply and long-term lifecycle assurance.
Supply support for STM32WB55VGQ6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs with strong focus on energy efficiency and security.
The STM32WB series is ST's ultra-low-power wireless MCU product line designed specifically for secure, battery-operated IoT endpoints requiring concurrent multi-protocol wireless connectivity and robust firmware isolation.
FAQ
What wireless certifications does STM32WB55VGQ6 support out-of-the-box?
STM32WB55VGQ6 supports pre-certified Bluetooth 5.4 and IEEE 802.15.4 PHY/MAC layers compliant with FCC CFR47 Part 15, ETSI EN 300 328, EN 300 440, and ARIB STD-T66. Thread 1.3 and Zigbee 3.0 protocol stacks are qualified and provided by ST - eliminating need for third-party certification testing of the radio subsystem itself.
How is dual-CPU security enforced between the Cortex-M4 and Cortex-M0+ cores?
Security is enforced through hardware-enforced memory isolation: the M0+ has exclusive access to radio-specific peripherals (RF registers, IPCC), while the M4 accesses only application-facing resources. Inter-core communication occurs exclusively via IPCC mailboxes with configurable access rights, and PCROP protects flash sectors containing the radio stack from unauthorized read/write access by the M4 application code.
Does STM32WB55VGQ6 require external RF matching components?
No external balun is required due to the integrated balun. However, an external matching network is needed for optimal 2.4 GHz performance: ST recommends companion IPD chips such as MLPF-WB55-02E3 for simplified layout and guaranteed EMI compliance. The RFIO pin is designed for direct connection to these passive filters.
What development tools are officially supported for STM32WB55VGQ6 firmware development?
ST officially supports STM32CubeWB (including HAL drivers and middleware), STM32CubeIDE (Eclipse-based IDE with debugger integration), and STM32CubeProgrammer for flashing. The device is fully compatible with Arm Mbed OS and Zephyr RTOS, and ST provides reference implementations for BLE, Thread, and Zigbee on Nucleo-WB55RG and Discovery kits - all with production-ready stack binaries.
STM32WB55VGQ6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 129-UFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 1MB Flash, 256kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 72
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 4.5mA ~ 7.9mA
- Current - Transmitting:
- 5.2mA ~ 12.7mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 129-UFBGA (7x7)
STM32WB55VGQ6 FAQ
1.How can I place an order for STM32WB55VGQ6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55VGQ6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55VGQ6 reliable?
The price and inventory of STM32WB55VGQ6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55VGQ6 is usually 5 days.
3.What payment methods are accepted for STM32WB55VGQ6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55VGQ6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB55VGQ6?
STM32WB55VGQ6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55VGQ6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55VGQ6?
For technical support, including STM32WB55VGQ6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55VGQ6 requirements.
6.How does Aetrix verify that STM32WB55VGQ6 is sourced from the original manufacturer or authorized distributors?
All STM32WB55VGQ6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55VGQ6 meets industry standards.
7.What is the process for return or replacement of STM32WB55VGQ6?
All STM32WB55VGQ6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55VGQ6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55VGQ6 part is unused and in its original packaging.
Return procedure for STM32WB55VGQ6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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