STMicroelectronics STM32WB55VGY6TR
- Part No.:
- STM32WB55VGY6TR
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 100-UFBGA, WLCSP
- Datasheet:
-
STM32WB55VGY6TR.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 100WLCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32WB55VGY6TR from STMicroelectronics is a dual-core 32-bit wireless MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ radio controller, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3/Zigbee® 3.0), with -96 dBm BLE RX sensitivity, +6 dBm programmable TX power, and integrated balun. It targets ultra-low-power IoT edge nodes such as smart locks and sensor hubs requiring secure OTA updates and concurrent protocol stack execution.
For engineers reviewing the STM32WB55VGY6TR datasheet, STM32WB55VGY6TR pinout, STM32WB55VGY6TR application, or STM32WB55VGY6TR equivalent, key selection considerations include dual-CPU architecture for real-time radio coexistence, RF regulatory compliance (FCC/ETSI/ARIB), SMPS efficiency in battery-powered designs, and hardware crypto acceleration (AES-256, PKA, RNG) for secure firmware installation.
Technical Context
The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 handles application logic and high-level protocol stacks, while the Cortex-M0+ executes time-critical radio layer firmware (BLE/802.15.4 MAC/PHY) with deterministic latency. Inter-processor communication occurs via IPCC and hardware semaphores to prevent resource contention.
RF subsystem includes a fully integrated 2.4 GHz transceiver with on-die balun, RSSI measurement, advertising extensions, EATT support, and GATT caching-enabling low-latency connection handling without host CPU intervention. Power management integrates an SMPS with intelligent bypass mode, enabling <53 µA/MHz active current and 600 nA standby with RTC + 32 KB RAM retained.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ @ 32 MHz (dedicated radio processing) |
| Wireless Protocols | Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC, Thread 1.3, Zigbee 3.0 - all supported concurrently in firmware |
| RF Performance | RX sensitivity: -96 dBm @ 1 Mbps BLE; TX output: programmable from -20 to +6 dBm in 1 dB steps |
| Memory | 1 MB flash (sector-protected PCROP), 256 KB SRAM (64 KB with parity), 1 KB OTP, Quad-SPI XIP interface |
| Power Modes | 13 nA shutdown; 600 nA standby + RTC + 32 KB RAM; 2.1 µA stop + RTC + 256 KB RAM |
| Security | 3× AES-256 engines, HW PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, secure firmware installation (SFI) for radio stacks |
| Analog Peripherals | 12-bit ADC @ 4.26 Msps (16-bit oversampling), 2× ultra-low-power comparators, buffered 2.048 V/2.5 V reference |
Pinout & Package
STM32WB55VGY6TR uses a WLCSP100 package (100-ball, 0.4 mm pitch, 7 × 7 mm body), optimized for compact IoT modules. Pin assignment aligns with ST's standardized STM32WB55xx ballout for RF integrity and thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_RF / VDD_PA | RF power supply | Dedicated 1.2 V supply for RF transceiver; enables independent regulation and noise isolation from digital domain |
| ANT | RF antenna interface | Differential RF output (balanced); connects directly to integrated balun or external matching network |
| OSC_IN / OSC_OUT | 32 MHz crystal oscillator | Provides precise clock for RF timing and CPU; internal trimming capacitors eliminate external load caps |
| LSE_IN / LSE_OUT | 32 kHz RTC crystal | Enables accurate real-time clock operation during ultra-low-power modes (e.g., 600 nA standby) |
| BOOT0 | Boot mode selection | Pulled low for main flash boot; critical for factory programming and recovery after failed OTA update |
| NRST | Reset input | Active-low asynchronous reset; supports external push-button or supervisor IC assertion |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Real-Time Radio Architecture | Separate M0+ core offloads BLE/802.15.4 link-layer processing, freeing M4 for application tasks without scheduling conflicts |
| Integrated RF Balun | Eliminates discrete matching components, reducing BOM count and PCB area while maintaining ETSI/FCC-compliant RF performance |
| Hardware Crypto Acceleration | AES-256, PKA, and TRNG enable full-stack security (pairing, encryption, signature) with sub-millisecond latency and zero software overhead |
| SMPS with Intelligent Bypass | Switches automatically to LDO mode at light loads, achieving 600 nA standby current while retaining RTC and RAM retention |
| GATT Caching & EATT Support | Reduces host-side BLE stack memory footprint and improves ATT transaction throughput for multi-characteristic reads/writes |
Applications
| Smart Lock System | Industrial Wireless Sensor Node |
|---|---|
Use Scenario: Battery-powered door lock with BLE provisioning, OTA firmware updates, and tamper detection. IC Role / Device Role / Timing Role: Dual-core MCU executes secure BLE stack (M0+) and access control logic (M4), with RTC-triggered periodic sensor polling and encrypted event logging. Use Value: 13 nA shutdown extends CR2032 battery life beyond 5 years; hardware AES ensures FIPS-compliant key derivation during pairing. |
Use Scenario: Self-powered vibration/temperature node in predictive maintenance system, transmitting data via Thread to border router. IC Role / Device Role / Timing Role: Acts as 802.15.4 end device with M0+ managing MAC timing and M4 running sensor fusion algorithm and TLS handshake. Use Value: -100 dBm 802.15.4 RX sensitivity enables reliable mesh networking in electrically noisy factory environments; SMPS efficiency sustains operation down to 1.71 V. |
| Medical Wearable Patch | Home Automation Hub |
Use Scenario: Disposable ECG patch with BLE streaming, motion artifact correction, and low-battery alert. IC Role / Device Role / Timing Role: M4 runs real-time DSP filtering and HRV analysis; M0+ manages BLE connection intervals and advertising extensions for fast reconnection. Use Value: 2.1 µA stop mode with 256 KB RAM retention preserves full context across sleep cycles; integrated 12-bit ADC achieves 110 dB SNR for biopotential acquisition. |
Use Scenario: Multi-protocol gateway bridging BLE peripherals (thermostats, lights) to Thread/Zigbee mesh networks. IC Role / Device Role / Timing Role: Concurrent BLE central + 802.15.4 coordinator; M4 handles IP translation and cloud MQTT; M0+ maintains synchronized channel hopping. Use Value: Dedicated radio CPU prevents BLE/Thread timing collisions; hardware semaphores ensure safe shared peripheral access (e.g., QSPI flash for OTA storage). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 DK | Single-core ARM Cortex-M4F @ 64 MHz; no dedicated radio CPU - BLE/802.15.4 handled in software stack | Higher CPU load during concurrent connections; lacks hardware GATT caching and EATT support | Preferred when BLE-only operation suffices and cost-sensitive design tolerates higher firmware complexity |
| TI CC2652RB | Arm Cortex-M4F + integrated RF BAW resonator (no external crystal needed); supports BLE 5.0 and Zigbee only | No native Thread 1.3 or Bluetooth 5.4 features (e.g., advertising extensions, LE Audio readiness) | Selected for crystal-free designs where BAW stability outweighs protocol flexibility requirements |
Compared with STM32WB55VGY6TR, the nRF52840 requires more M4 resources for radio tasks and lacks hardware-accelerated Thread support, while the CC2652RB trades protocol breadth for BAW integration-making the STM32WB55VGY6TR optimal for multi-protocol, security-critical, and regulatory-compliant IoT endpoints.
Availability
STM32WB55VGY6TR is available at Aetrix Electronics and suitable for smart lock systems, industrial sensor nodes, medical wearables, and home automation hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for global production.
Supply support for STM32WB55VGY6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, analog ICs, power management, and MEMS sensors for industrial, automotive, and consumer markets.
The STM32WB series is ST's ultra-low-power wireless MCU product line designed specifically for secure, multi-protocol IoT edge devices requiring concurrent BLE and 802.15.4 operation with minimal external components and certified RF performance.
FAQ
What wireless protocols does STM32WB55VGY6TR support natively in hardware?
STM32WB55VGY6TR supports Bluetooth 5.4 (including LE Audio readiness features like EATT and advertising extensions) and IEEE 802.15.4-2011 PHY/MAC in hardware, enabling Thread 1.3 and Zigbee 3.0 protocol stacks. The dedicated Cortex-M0+ core executes the radio layer firmware, ensuring deterministic timing and concurrent operation without CPU resource contention.
Does STM32WB55VGY6TR require external RF matching components?
No. STM32WB55VGY6TR integrates a balun on-die, allowing direct connection of a 50 Ω antenna or simple pi-network matching. This eliminates external baluns and reduces BOM count by up to three passive components while maintaining FCC/ETSI-compliant RF performance (-96 dBm RX, +6 dBm TX).
How is secure firmware installation (SFI) implemented on this MCU?
SFI leverages hardware AES-256 engines, PKA (for ECC signature verification), and TRNG to authenticate and decrypt OTA updates before flashing. The process validates cryptographic signatures of radio stack binaries using pre-provisioned public keys stored in protected OTP, preventing unauthorized firmware injection during BLE or 802.15.4 updates.
What is the lowest power consumption state with RTC and RAM retention?
The lowest power state with full RTC operation and RAM retention is Standby mode: 600 nA at 25°C with 32 KB of SRAM retained and RTC running from the LSE oscillator. This mode supports wake-up via external interrupt, RTC alarm, or BLE connection request-enabling multi-year battery life in intermittent-sensing applications.
STM32WB55VGY6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WB
- Package/Case:
- 100-UFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.3, Thread, Zigbee®
- Modulation:
- GFSK
- Frequency:
- 2.405GHz ~ 2.48GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 6dBm
- Sensitivity:
- -100dBm
- Memory Size:
- 1MB Flash, 256kB SRAM
- Serial Interfaces:
- ADC, I2C, SPI, UART, USART, USB
- GPIO:
- 72
- Voltage - Supply:
- 1.71V ~ 3.6V
- Current - Receiving:
- 4.5mA
- Current - Transmitting:
- 5.2mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-WLCSP (4.4x4.38)
STM32WB55VGY6TR FAQ
1.How can I place an order for STM32WB55VGY6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WB55VGY6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WB55VGY6TR reliable?
The price and inventory of STM32WB55VGY6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55VGY6TR is usually 5 days.
3.What payment methods are accepted for STM32WB55VGY6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55VGY6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WB55VGY6TR?
STM32WB55VGY6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WB55VGY6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WB55VGY6TR?
For technical support, including STM32WB55VGY6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55VGY6TR requirements.
6.How does Aetrix verify that STM32WB55VGY6TR is sourced from the original manufacturer or authorized distributors?
All STM32WB55VGY6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55VGY6TR meets industry standards.
7.What is the process for return or replacement of STM32WB55VGY6TR?
All STM32WB55VGY6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55VGY6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WB55VGY6TR part is unused and in its original packaging.
Return procedure for STM32WB55VGY6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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