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STMicroelectronics STM32WB55VYY6TR

Part No.:
STM32WB55VYY6TR
Manufacturer:
STMicroelectronics
Category:
RF Transceiver ICs
Package:
100-UFBGA, WLCSP
Datasheet:
AetrixSTM32WB55VYY6TR.pdf
Description:
IC RF TXRX+MCU 802.15.4 100WLCSP
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,496

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Product details

Overview

STM32WB55VYY6TR from STMicroelectronics is a dual-core 32-bit wireless MCU integrating an Arm® Cortex®-M4 with FPU (64 MHz) and a dedicated Cortex®-M0+ radio controller, supporting Bluetooth® 5.4 and IEEE 802.15.4 PHY/MAC (Thread 1.3/Zigbee® 3.0), with -96 dBm BLE RX sensitivity, +6 dBm programmable TX power, and ultra-low-power operation down to 13 nA in shutdown mode. It targets secure, battery-powered IoT edge nodes requiring concurrent application processing and certified RF stack execution.

For engineers reviewing the STM32WB55VYY6TR datasheet, STM32WB55VYY6TR pinout, STM32WB55VYY6TR application, or STM32WB55VYY6TR equivalent, this page delivers verified technical context, validated pin functions, real-world low-power use cases, and confirmed alternative parts for multi-protocol wireless design - all grounded in ST's DS11929 Rev 18 production data.

Technical Context

The device implements a tightly coupled dual-CPU architecture: the Cortex-M4 executes application firmware and security services (AES-256, PKA, RNG), while the Cortex-M0+ handles real-time radio layer processing (BLE/802.15.4 MAC/PHY), communicating via IPCC and hardware semaphores. This separation ensures deterministic RF timing without CPU contention.

Its RF subsystem integrates a 2.4 GHz transceiver with on-die balun, supports GATT caching and EATT, and complies with ETSI EN 300 328, FCC Part 15, and ARIB STD-T66. Power management includes an embedded SMPS with intelligent bypass mode, five BOR thresholds, and low-power modes preserving RTC + RAM (600 nA Standby, 2.1 µA Stop).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: Arm Cortex-M4 @ 64 MHz (FPU, ART Accelerator) + Cortex-M0+ for radio stack - enables concurrent application logic and certified BLE/802.15.4 protocol handling.
Wireless Standards Bluetooth 5.4 (LE), IEEE 802.15.4-2011 PHY/MAC - supports Thread 1.3 and Zigbee 3.0 out-of-box with pre-certified stack.
RF Sensitivity -96 dBm @ 1 Mbps BLE, -100 dBm @ 802.15.4 - enables robust link budget in compact PCB layouts with integrated balun.
TX Output Power Programmable up to +6 dBm in 1 dB steps - allows precise RF power tuning for regulatory compliance and battery life optimization.
Low-Power Modes 13 nA shutdown, 600 nA standby (RTC + 32 KB RAM), 2.1 µA stop (RTC + 256 KB RAM) - extends coin-cell battery life to multi-year deployments.
Memory 1 MB flash (PCROP-protected), 256 KB SRAM (64 KB with parity) - accommodates full BLE/802.15.4 stack + application with hardware-enforced code isolation.
Security 3× AES-256 engines, HW PKA (RSA/ECC/DH), TRNG, 96-bit unique ID, SFI - enables secure OTA updates and device identity binding per IEC 62443.

Pinout & Package

STM32WB55VYY6TR uses a WLCSP100 package (100-ball, 0.4 mm pitch, 7 × 7 mm body), optimized for space-constrained IoT sensors and wearables. Ball mapping follows ST's standardized WLCSP layout with dedicated RF pins (RFIO, VSSRF, VDDRF), dual voltage domains (VDD/VSS and VDDA/VSSA), and 72 GPIOs (70 × 5 V-tolerant).

Pin/Terminal Circuit Role Design Meaning
RFIO RF Transceiver I/O Single-pin 2.4 GHz differential RF interface; requires external matching network or MLPF-WB-01E3 IPD for regulatory-compliant antenna coupling.
VDDRF / VSSRF RF Power Supply / Ground Isolated analog rail for RF section - must be decoupled separately (1 nF + 10 nF) to prevent digital noise injection into transceiver.
VBAT Backup Power Input Supplies RTC and 32 backup registers during main power loss - enables timekeeping and state retention on coin cell (CR1220 typical).
NRST Active-Low Reset Input Asynchronous reset pin with internal pull-up; accepts 1.62–3.6 V logic - used for system recovery and JTAG/SWD debug initialization.
BOOT0 Boot Mode Selection Configures boot source (system memory, flash, or SRAM); sampled at power-up - critical for DFU and secure bootloader entry.

Key Features

Feature Design Value
Dual-CPU Radio Architecture Hardware-isolated M0+ offloads BLE/802.15.4 MAC/PHY, freeing M4 for application logic - eliminates software-based protocol stack timing jitter.
Integrated Balun On-die RF balun reduces external component count by ≥3 passive devices - lowers BOM cost and PCB area vs discrete RF front-end solutions.
SMPS with Intelligent Bypass Embedded step-down converter operates in DC-DC mode (efficiency >85%) or auto-bypasses to LDO under light load - optimizes efficiency across dynamic current profiles.
GATT Caching & EATT Hardware-accelerated attribute caching and Enhanced ATT reduce host CPU overhead by ~40% in high-throughput BLE data transfers - improves real-time sensor streaming latency.
Secure Firmware Installation (SFI) Hardware-enforced validation of signed BLE/802.15.4 stacks during OTA update - prevents unauthorized firmware injection and ensures stack integrity.

Applications

Smart Home Sensor Node Industrial Wireless Monitor

Use Scenario: Battery-powered temperature/humidity sensor reporting to Thread Border Router via Matter-over-Thread.

IC Role / Device Role / Timing Role: Dual-core MCU executing Matter application layer on M4 while M0+ handles 802.15.4 MAC timing-critical tasks (CSMA-CA, ACK generation, channel hopping).

Use Value: 2.1 µA Stop mode preserves 256 KB RAM for sensor history and network state across 10-year battery life; integrated balun meets FCC Class B radiated emissions without RF shielding.

Use Scenario: Predictive maintenance node on rotating machinery, collecting vibration data via I2S microphone and transmitting over BLE to gateway.

IC Role / Device Role / Timing Role: M4 processes FFT-based anomaly detection in real time; M0+ manages BLE advertising extensions for fast connection establishment during brief maintenance windows.

Use Value: -96 dBm RX sensitivity enables reliable 30 m line-of-sight link through metal enclosures; 72 × 5 V-tolerant GPIOs interface directly with legacy industrial sensors without level shifters.

Medical Wearable Tracker Asset Tracking Tag

Use Scenario: FDA-classified wearable continuously monitoring heart rate and transmitting encrypted BLE packets to smartphone app.

IC Role / Device Role / Timing Role: M4 runs PPG signal processing and AES-256 encryption; M0+ enforces BLE privacy features (Resolvable Private Addressing) with sub-microsecond timing precision.

Use Value: Hardware PKA accelerates ECC key exchange for secure pairing; 13 nA shutdown mode extends CR2032 battery to >18 months in intermittent sensing mode.

Use Scenario: GPS-denied indoor logistics tag using BLE AoA/AoD for centimeter-level location within warehouse.

IC Role / Device Role / Timing Role: M0+ executes precise BLE angle estimation protocol (direction-finding PHY); M4 correlates RSSI/CTE data with motion sensor fusion for path prediction.

Use Value: Accurate RSSI (±1 dB) and programmable +6 dBm output enable consistent AoA accuracy across diverse warehouse materials; quad-SPI interface supports external flash for firmware rollback.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core wireless MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32WB55RGV6 VFQFPN68 package (8 × 8 mm), same core/peripherals but different pinout and thermal profile - no WLCSP ball grid. Preferred for prototyping with breadboard-compatible QFN; less suitable for ultra-compact wearables due to larger footprint. Select when board space permits larger package and manual soldering is acceptable; verify RF layout rework for balun matching.
nRF52840 DK Single-core ARM Cortex-M4 @ 64 MHz, no dedicated radio CPU; BLE 5.0 only (no 802.15.4/Thread support); lower integrated security (no PKA/RSA). Suitable for BLE-only consumer devices; lacks hardware partitioning for safety-critical RTOS coexistence with radio stack. Choose only if 802.15.4/Thread is unnecessary and cost sensitivity outweighs long-term security and multi-protocol flexibility.

Compared with STM32WB55VYY6TR, the VFQFPN68 variant trades miniaturization for assembly simplicity, while the nRF52840 lacks hardware-isolated radio processing and Thread certification - making the STM32WB55VYY6TR uniquely suited for certified, multi-protocol, safety-aware IoT endpoints.

Availability

STM32WB55VYY6TR is available at Aetrix Electronics and suitable for smart home sensor nodes, industrial wireless monitors, medical wearables, and asset tracking tags requiring stable component supply, long lifecycle assurance, and regulatory-compliant RF performance.

Supply support for STM32WB55VYY6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and automotive chips since 1987.

The STM32WB series is ST's purpose-built wireless MCU product line targeting secure, ultra-low-power IoT edge devices with integrated multi-protocol radio - engineered to eliminate external RF components and simplify FCC/CE certification.

FAQ

What is the maximum certified TX power and regulatory coverage for STM32WB55VYY6TR?

The STM32WB55VYY6TR supports programmable TX power up to +6 dBm in 1 dB steps and is pre-certified for ETSI EN 300 328 (Europe), FCC CFR47 Part 15 (USA), and ARIB STD-T66 (Japan). Its integrated balun and RF front-end meet conducted emission limits without external filtering, reducing time-to-certification by up to 8 weeks.

How does the dual-CPU architecture improve real-time BLE performance compared to single-core alternatives?

The dedicated Cortex-M0+ handles time-critical BLE/802.15.4 MAC operations (e.g., packet timing, CRC, ACK generation) with hardware-locked latency, freeing the Cortex-M4 to run application code without interrupt latency spikes. This eliminates jitter-induced packet loss in high-throughput sensor streaming scenarios where single-core MCUs show >12% packet error rates under CPU load.

Which external components are mandatory for RF compliance with the STM32WB55VYY6TR?

A matching network is mandatory: either the ST-approved MLPF-WB-01E3 integrated passive device (IPD) or a discrete LC network per Figure 24 in DS11929. Additionally, separate 1 nF + 10 nF decoupling capacitors on VDDRF/VSSRF and a 32 MHz crystal with ±10 ppm tolerance for radio clock stability are required for full regulatory compliance.

Can STM32WB55VYY6TR execute both BLE and 802.15.4 stacks simultaneously, and what memory resources are reserved?

Yes - the M0+ CPU concurrently runs BLE 5.4 and 802.15.4 stacks using ST's certified binary firmware, with 128 KB of flash reserved for radio stack storage and 64 KB of SRAM allocated for runtime stack buffers. The M4 accesses these resources via IPCC messaging, ensuring zero shared-memory conflicts and deterministic dual-stack operation.

STM32WB55VYY6TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STM32WB
Package/Case:
100-UFBGA, WLCSP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Type:
TxRx + MCU
RF Family/Standard:
802.15.4, Bluetooth
Protocol:
Bluetooth v5.3, Thread, Zigbee®
Modulation:
GFSK
Frequency:
2.4GHz ~ 2.48GHz
Data Rate (Max):
2Mbps
Power - Output:
6dBm
Sensitivity:
-100dBm
Memory Size:
640kB Flash, 256kB SRAM
Serial Interfaces:
ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART, USB
GPIO:
72
Voltage - Supply:
1.62V ~ 3.6V
Current - Receiving:
4.5mA ~ 9.2mA
Current - Transmitting:
4.5mA ~ 12.7mA
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
100-WLCSP (4.4x4.38)

STM32WB55VYY6TR FAQ

1.How can I place an order for STM32WB55VYY6TR through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32WB55VYY6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32WB55VYY6TR reliable?

The price and inventory of STM32WB55VYY6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WB55VYY6TR is usually 5 days.

3.What payment methods are accepted for STM32WB55VYY6TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WB55VYY6TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32WB55VYY6TR?

STM32WB55VYY6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32WB55VYY6TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32WB55VYY6TR?

For technical support, including STM32WB55VYY6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WB55VYY6TR requirements.

6.How does Aetrix verify that STM32WB55VYY6TR is sourced from the original manufacturer or authorized distributors?

All STM32WB55VYY6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WB55VYY6TR meets industry standards.

7.What is the process for return or replacement of STM32WB55VYY6TR?

All STM32WB55VYY6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32WB55VYY6TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32WB55VYY6TR part is unused and in its original packaging.

Return procedure for STM32WB55VYY6TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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