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STMicroelectronics STM32WL33KCV6
- Part No.:
- STM32WL33KCV6
- Manufacturer:
- STMicroelectronics
- Category:
- RF Transceiver ICs
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
STM32WL33KCV6.pdf
- Description:
- VFQFPN 5X5X1.0 32L PITCH 0.5
- Quantity:
- Payment:
- Shipping:
Inventory:100
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Product details
Overview
STM32WL33KCV6 from STMicroelectronics is an ultra-low-power, multiprotocol sub-1 GHz wireless system-on-chip integrating an Arm® Cortex®-M0+ 32-bit MCU (64 MHz), 256 KB flash, 32 KB SRAM, and a certified RF transceiver supporting 2(G)FSK/4(G)FSK/OOK/ASK/D-BPSK/DSSS across 159–958 MHz bands. It delivers +20 dBm TX power, -132 dBm RX sensitivity at 300 bit/s (433 MHz OOK), and operates from 1.7–3.6 V in -40°C to +105°C for battery-powered LPWAN endpoints.
For engineers reviewing the STM32WL33KCV6 datasheet, STM32WL33KCV6 pinout, STM32WL33KCV6 application, or STM32WL33KCV6 equivalent, key selection criteria include verified sub-GHz modulation support (W-MBUS, Sigfox, Mioty), autonomous LPAWUR wake-up capability (-54 dBm, 4 µA), SMPS/LDO power architecture, and ECOPACK2-compliant VFQFPN48 packaging with 32 GPIOs and full retention.
Technical Context
The STM32WL33KCV6 integrates a single-core Arm Cortex-M0+ CPU with tightly coupled RF subsystem via AHB bus matrix, enabling concurrent protocol stack execution and radio operation without external co-processor. Its dual-SRAM architecture (SRAM0 always-on, SRAM1 configurable) and hardware sequencer support autonomous low-duty-cycle modes including Sniff, Frequency Hopping, and Listen-Before-Talk.
RF operation uses direct-modulation TX and low-IF RX with I/Q data access, polar TX control, and AGC-enabled interference resilience compliant with ETSI EN 300 220 Cat.1, FCC Part 15/90, and ARIB STD-T67/T108. The LPAWUR block operates independently on 32 kHz clock (LSI or LSE) with Manchester-encoded OOK frame detection and CRC-16 validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M0+, 64 MHz max - enables real-time LPWAN protocol stack execution with <10 µs interrupt latency |
| Flash / SRAM | 256 KB flash / 32 KB SRAM (dual-bank) - supports secure OTA updates and simultaneous application + radio firmware storage |
| RF Bands | 159–185 / 413–479 / 826–958 MHz - covers global ISM/SRD bands including 433, 868, and 915 MHz regions |
| RX Sensitivity | -132 dBm @ 300 bit/s (433 MHz OOK) - achieves >15 km range in rural LPWAN deployments with 0.1% packet loss |
| TX Power | +20 dBm programmable - enables long-range node-to-gateway links without external PA, reducing BOM cost |
| LPAWUR | -54 dBm sensitivity, 4 µA always-on - extends battery life to >10 years in Deepstop wake-up sensor applications |
| Power Modes | 14 nA Shutdown, 960 nA Deepstop, 1.3 mA WFI - optimized for intermittent sensing with sub-second wake-up latency |
Pinout & Package
VFQFPN48 (6 × 6 mm, 0.4 mm pitch) package with wettable flanks, ECOPACK2-compliant, rated for industrial temperature range (-40°C to +105°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDIO | Main digital supply | 1.7–3.6 V input; powers core, peripherals, and I/O banks with internal LDO regulation |
| VDD12, VFBSD | SMPS output | Configurable 1.2–2.4 V SMPS output; bypassable via BOF for improved RX sensitivity |
| PA10 / PB14 | TX_SEQUENCE | Dedicated RF activity signal for external antenna switch control during transmission |
| PA8 / PA11 | RX_SEQUENCE | Dedicated RF activity signal for external antenna switch control during reception |
| OSC_IN / OSC_OUT | HSE crystal interface | 48 MHz external crystal connection with integrated trimming capacitors for ±20 ppm stability |
| RTC_IN / RTC_OUT | LSE crystal interface | 32.768 kHz crystal connection for RTC and LPAWUR timing reference |
| NRST | Reset input | Active-low reset with internal pull-up; supports POR/PDR/BOR and PVD-triggered reset |
| BOOT0 | Boot mode select | Configures boot source (system memory, flash, or SRAM); required for UART bootloader entry |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Sub-GHz Transceiver | Single-die RF + MCU eliminates inter-chip timing skew and PCB layout complexity for certified LPWAN designs |
| Hardware Sequencer | Enables autonomous radio state transitions (e.g., RX→TX→Sleep) without CPU intervention, reducing active time by >40% |
| LPAWUR with Manchester OOK | Wake-up from Deepstop using standardized 56-bit payload + CRC-16 frame, eliminating need for external wake-up IC |
| SMPS with Bypass-on-the-Fly | Dynamic switching between SMPS (efficiency) and LDO (low-noise RX) improves receiver sensitivity by 3–5 dB |
| AES-128 + TRNG | On-the-fly encryption of over-the-air payloads and secure key generation for W-MBUS Class C and Sigfox security layers |
Applications
| Asset Tracking | Wireless Sensors |
|---|---|
Use Scenario: GPS-denied indoor/outdoor cargo monitoring with periodic location reporting via LoRaWAN-compatible gateways. IC Role / Device Role / Timing Role: Standalone LPWAN node controller handling GNSS data acquisition, AES-encrypted payload assembly, and adaptive 868 MHz FSK transmission. Use Value: 10-year battery life enabled by Deepstop + LPAWUR wake-up on motion trigger, eliminating external wake-up circuitry. | Use Scenario: Battery-powered temperature/humidity sensors deployed in HVAC ducts with 15-minute reporting intervals. IC Role / Device Role / Timing Role: Sensor fusion hub executing ADC sampling, LC-based flow metering, and 433 MHz OOK transmission under ETSI EN 300 220 Cat.1 compliance. Use Value: -132 dBm RX sensitivity ensures reliable reception in metal-enclosed environments with minimal transmit retries. |
| Industrial Monitoring | Smart Home Alarms |
Use Scenario: Wireless vibration and current monitoring on rotating machinery in factory settings with edge FFT analysis. IC Role / Device Role / Timing Role: Real-time signal processor running lightweight ML inference and 915 MHz 4-GFSK transmission at 600 kbit/s for high-throughput diagnostics. Use Value: Dual-SRAM architecture allows concurrent sensor buffering (SRAM1) and protocol stack execution (SRAM0) without DMA contention. | Use Scenario: Door/window contact sensors with tamper detection and encrypted alarm reporting to home gateway. IC Role / Device Role / Timing Role: Ultra-low-power endpoint managing reed switch inputs, AES-128 payload encryption, and 868 MHz 2-GFSK transmission with Listen-Before-Talk. Use Value: 14 nA Shutdown mode enables >15-year CR2032 battery life; PVD detects battery depletion before communication failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sub-GHz wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SX1280 + STM32L4 | Discrete RF + MCU architecture; no integrated LPAWUR or hardware sequencer; requires external matching network | Lacks autonomous radio sequencing and unified memory map; increases PCB area and certification effort | Select when legacy RF design reuse or multi-band flexibility beyond STM32WL33's fixed bands is required |
| CC1352P7 | Arm Cortex-M4F + dual-band (sub-GHz + 2.4 GHz); higher TX current (85 mA @ +20 dBm); no SMPS bypass capability | Supports Bluetooth LE coexistence but lacks ETSI Cat.1 adjacent channel selectivity and W-MBUS stack integration | Select when dual-band operation or BLE mesh gateway functionality is mandatory, not for pure sub-GHz LPWAN nodes |
Compared with SX1280+STM32L4 and CC1352P7, the STM32WL33KCV6 reduces system-level BOM count by 30%, cuts RF certification time by consolidating transceiver and MCU into one qualified die, and extends battery life through integrated LPAWUR and SMPS/LDO dynamic switching-critical for unattended sensor deployments.
Availability
STM32WL33KCV6 is available at Aetrix Electronics and suitable for asset tracking, wireless sensors, and industrial monitoring requiring stable component supply across automotive-grade temperature ranges and global regulatory certifications.
Supply support for STM32WL33KCV6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, delivering microcontrollers, analog ICs, and power solutions for industrial, automotive, and IoT markets with emphasis on energy efficiency and functional safety.
The STM32WL33xx product line targets certified, battery-operated LPWAN endpoints requiring integrated RF, ultra-low-power operation, and secure over-the-air updates-designed specifically for W-MBUS, Sigfox, and proprietary sub-GHz protocol stacks.
FAQ
What is the maximum certified TX power and corresponding current draw for STM32WL33KCV6?
The STM32WL33KCV6 supports up to +20 dBm TX power in TX+TXHP mode with 78 mA current draw at 3.3 V supply. This is validated per ETSI EN 300 220 and FCC Part 15.247 requirements. At +10 dBm, current drops to 8 mA, enabling optimal trade-off between range and battery life in most sensor applications.
Does STM32WL33KCV6 support hardware-accelerated AES encryption for secure firmware updates?
Yes, it integrates a dedicated AES-128 co-processor with DMA support and 16-bit TRNG for key generation. This enables authenticated, encrypted OTA updates compliant with W-MBUS Class C and Sigfox security profiles without CPU overhead-verified in ST's AN5289 application note and RM0511 reference manual section 45.4.
How does the LPAWUR block interface with the main MCU during wake-up events?
The LPAWUR generates a dedicated IRQ to the NVIC upon valid Manchester-encoded OOK frame detection, waking the entire SoC from Deepstop mode in <5 µs. Its analog front-end operates independently on LSI or LSE clock, with retained registers preserving configuration across wake cycles-detailed in DS14221 section 3.4.3 and RM0511 section 44.5.
Can STM32WL33KCV6 operate without the internal SMPS, and what are the implications?
Yes, it supports No SMPS, Static BOF, and Dynamic BOF configurations. In No SMPS mode, VFBSD must connect to external 1.2–2.4 V supply; in BOF modes, SMPS is disabled and replaced by internal switch or LDO. Dynamic BOF improves RX sensitivity by 3–5 dB but limits max TX power to +14 dBm in Static BOF mode-per DS14221 section 3.5.1.
STM32WL33KCV6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STM32WL33xx
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, General ISM < 1GHz
- Protocol:
- KNX, LPWAN, Sigfox, Zigbee®
- Modulation:
- 2-FSK, 4-FSK, 2-GFSK, 4-GFSK, ASK, DBPSK, DSSS, FSK, GFSK, OOK
- Frequency:
- 413MHz ~ 479MHz, 826MHz ~ 958MHz
- Data Rate (Max):
- 600kbps
- Power - Output:
- 20dBm
- Sensitivity:
- -132dBm
- Memory Size:
- 256kB Flash, 32kB SRAM
- Serial Interfaces:
- GPIO, I2C, I2S, IrDA, JTAG, PCM, PWM, SPI, UART, USART
- GPIO:
- 32
- Voltage - Supply:
- 1.7V ~ 3.6V
- Current - Receiving:
- 4mA
- Current - Transmitting:
- 10mA ~ 80mA
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 32-VFQFPN (5x5)
STM32WL33KCV6 FAQ
1.How can I place an order for STM32WL33KCV6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32WL33KCV6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32WL33KCV6 reliable?
The price and inventory of STM32WL33KCV6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32WL33KCV6 is usually 5 days.
3.What payment methods are accepted for STM32WL33KCV6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32WL33KCV6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32WL33KCV6?
STM32WL33KCV6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32WL33KCV6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32WL33KCV6?
For technical support, including STM32WL33KCV6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32WL33KCV6 requirements.
6.How does Aetrix verify that STM32WL33KCV6 is sourced from the original manufacturer or authorized distributors?
All STM32WL33KCV6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32WL33KCV6 meets industry standards.
7.What is the process for return or replacement of STM32WL33KCV6?
All STM32WL33KCV6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32WL33KCV6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32WL33KCV6 part is unused and in its original packaging.
Return procedure for STM32WL33KCV6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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