STMicroelectronics STM6503REAADG6F

Overview

STM6503REAADG6F from STMicroelectronics is a dual push-button Smart Reset IC with user-adjustable setup delay, factory-programmed VCC monitoring threshold (2.925 V typ.), 2/6/10 s selectable tSRC delay via TSR pin, and open-drain active-low RST output in TDFN8 package. It prevents spurious resets in portable electronics by requiring sustained button press before asserting reset.

For engineers reviewing the STM6503REAADG6F datasheet, STM6503REAADG6F pinout, STM6503REAADG6F application, or STM6503REAADG6F equivalent, key selection criteria include programmable reset delay timing, industrial temperature range (–40 °C to +85 °C), low ICC (<2 µA at 25 °C), VCC monitoring accuracy (±1.5% over temp), and compatibility with dual-button mechanical interface designs.

Technical Context

The STM6503 implements dual-input Smart Reset logic where SR0 and SR1 must both be held low for ≥tSRC (2/6/10 s min.) to trigger RST assertion. The TSR pin selects tSRC via DC voltage level: grounded = 2 s, floating = 6 s, VCC-connected = 10 s - all minimum guaranteed values.

Reset generation includes power-on reset (POR) and undervoltage detection: RST asserts when VCC falls below factory-set VRST (2.925 V typ., ±1.5% over –40 °C to +85 °C), holding for tREC (200 ms typ.) after VCC recovers above VRST. The RST output is open-drain, requiring external pull-up.

Key Specifications

Pinout & Package

TDFN8 (DG) package: 2 mm × 2 mm body, 0.5 mm pitch, exposed thermal pad (not electrically connected), RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual push-button reset applications.

Compared with MAX6326TUT+T and TPS3808G12DBVR, STM6503REAADG6F uniquely delivers dual-button coordination, three-step tSRC selection without external components, and factory-trimmed VCC threshold - making it the only solution that satisfies mechanical reset safety requirements in EN 62366-1-compliant portable medical and consumer devices.

Availability

STM6503REAADG6F is available at Aetrix Electronics and suitable for smartphone system reset, e-reader power management, portable GPS navigation, and MP3 player recovery requiring stable component supply across extended production lifecycles.

Supply support for STM6503REAADG6F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and consumer markets.

The STM65xx Smart Reset family targets portable electronics requiring robust, low-power, mechanical push-button reset with immunity to ESD and contact bounce - specifically engineered for EN 62366-1 usability compliance in handheld devices.

FAQ

What is the function of the TSR pin on STM6503REAADG6F?

The TSR pin is a three-state DC input that selects the Smart Reset setup delay (tSRC): grounded = 2 s minimum, floating = 6 s minimum, connected to VCC = 10 s minimum. It requires no external passive components and must be stabilized with a 0.1 µF capacitor to VSS if left floating to prevent noise-induced misconfiguration.

Does STM6503REAADG6F provide battery monitoring capability?

No. Battery monitoring (VBAT input and BLD output) is exclusive to STM6505. STM6503 supports only VCC monitoring for power-on reset and brownout detection. For battery-aware designs, STM6505 or external supervisor ICs with VBAT comparators must be used.

Can SR0 and SR1 be used independently on STM6503REAADG6F?

No. STM6503 requires both SR0 and SR1 to be asserted low simultaneously for the duration of tSRC to trigger RST. This dual-input AND logic prevents false resets from single-button glitches or ESD events - unlike STM6504, which offers independent SR0 (delayed) and SRE (instant) inputs.

What is the recommended decoupling for STM6503REAADG6F?

A 0.1 µF X7R ceramic capacitor must be placed between VCC and VSS, as close as possible to the device pins. If TSR is left floating, an additional 0.1 µF capacitor is required between TSR and VSS to ensure noise immunity and stable tSRC selection - per STMicroelectronics layout guidelines in Doc ID 16101 Rev 6.