STMicroelectronics STMPS2272TTR

Overview

STMPS2272TTR from STMicroelectronics is a dual-channel high-side power distribution switch featuring two 100 mΩ MOSFETs, 1000 mA continuous current per channel, active-high enable inputs, and independent overcurrent fault reporting via open-drain OC1/OC2 outputs. It operates from 2.7 V to 5.5 V, includes thermal shutdown at 135 °C, and delivers reverse current blocking - ideal for USB-powered peripherals and hot-swap-capable industrial I/O modules.

For engineers reviewing the STMPS2272TTR datasheet, STMPS2272TTR pinout, STMPS2272TTR application, or STMPS2272TTR equivalent, key selection criteria include its 1000 mA per-channel current limit, 10 ms fault blanking window, CMOS/TTL-compatible EN inputs, and SO-8 package compatibility with space-constrained PCB layouts.

Technical Context

This device integrates two independent high-side switches with dedicated current-sense and thermal protection circuitry. Each channel features programmable fault blanking (10 ms), undervoltage lockout (2.0–2.5 V threshold), and open-drain OCx outputs that assert low during overcurrent or thermal events - not during UVLO or transient load surges.

The internal architecture supports simultaneous or staggered channel control, with reverse current blocking when disabled and <2 µA output leakage at 125 °C. Rise/fall times are load- and capacitance-dependent, with typical turn-on time ≤5 ms into 100 µF/10 Ω loads.

Key Specifications

Pinout & Package

STMPS2272TTR is housed in an SO-8 surface-mount package (8-pin small outline integrated circuit) with standard 1.27 mm pitch, JEDEC MS-012AC compliant footprint, and thermal pad exposed on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual high-side power switch applications.

Compared with TPL92012RGER and TPS2051BDR, STMPS2272TTR uniquely delivers dual independent channels with thermal shutdown, 10 ms fault blanking, and open-drain OCx outputs - making it the only option among the three qualified for hot-swap-capable, high-reliability industrial power distribution.

Availability

STMPS2272TTR is available at Aetrix Electronics and suitable for USB peripheral design, industrial I/O protection, embedded power sequencing, and point-of-load distribution requiring stable component supply across production lifecycles.

Supply support for STMPS2272TTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, microcontrollers, and analog ICs for industrial, automotive, and consumer markets.

STMPS2272TTR belongs to ST's enhanced power distribution switch family, designed specifically for robust, high-density power rail control in systems exposed to frequent hot-swap events and short-circuit risks.

FAQ

What is the maximum capacitive load the STMPS2272TTR can safely drive?

The STMPS2272TTR is characterized for reliable operation with up to 470 µF output capacitance, as verified in datasheet Figures 25 and 31. Its 10 ms fault blanking window prevents false overcurrent triggering during inrush, and its 1000 mA current limit ensures controlled charge delivery without thermal stress under recommended operating conditions (VI = 5 V, TJ ≤ 85 °C).

Does STMPS2272TTR support reverse current blocking when powered down?

Yes - when IN = 0 V or the device is unpowered, the internal MOSFETs remain fully off and exhibit <2 µA reverse leakage (per Table 7) even if VO > 0 V. This behavior is confirmed in Section 3.3 "Reverse current blocking" and applies across the full ambient temperature range (–40 °C to 85 °C), ensuring no backfeed into the supply rail.

How does the 10 ms fault blanking interact with thermal shutdown?

Fault blanking applies only to overcurrent events; thermal shutdown triggers immediately upon reaching 135 °C junction temperature with no blanking delay. If a sustained overload causes both overcurrent limiting and thermal rise, OCx asserts after 10 ms (if still active), then the device shuts down completely within milliseconds of crossing the thermal threshold - as specified in Tables 6 and 8.

Can EN1 and EN2 be tied together for synchronous control?

Yes - EN1 and EN2 accept CMOS/TTL logic levels and may be driven by the same GPIO signal. Doing so configures the device as a dual-output switch with coordinated on/off timing. However, independent control preserves fault isolation: a fault on one channel leaves the other operational, as OC1 and OC2 report separately.