STMicroelectronics STP16CP596TTR

Overview

STP16CP596TTR from STMicroelectronics is a 16-bit constant-current LED sink driver in TSSOP-24 exposed-pad package, designed for LED panel displays. It delivers adjustable 3–50 mA per channel via external R_EXT, supports 25 MHz serial data clocking, and operates from 3.0–5.5 V supply with 16 V output voltage capability.

For engineers reviewing the STP16CP596TTR datasheet, STP16CP596TTR pinout, STP16CP596TTR application, or STP16CP596TTR equivalent, key selection criteria include output current adjustability, thermal performance of the exposed-pad TSSOP, latch-controlled parallel output timing, and compatibility with 3.3 V microcontrollers in high-density LED systems.

Technical Context

The device integrates a 16-bit serial-in/parallel-out shift register cascaded to a D-type storage register, enabling synchronized latching of LED drive states. Output stage uses sixteen matched current sources with ±1% typical inter-channel accuracy at 40–50 mA and ±2% at 3–10 mA (V_DD = 5 V).

Control logic features active-low output enable (OE), positive-edge clock (CLK), and latch-enable (LE) that propagates data to outputs only when LE is high; SDO toggles on CLK falling edge for daisy-chaining. Thermal resistance is reduced to 37.5 °C/W (junction-to-ambient) due to soldered exposed pad.

Key Specifications

Pinout & Package

TSSOP-24 with exposed thermal pad (electrically unconnected); requires PCB soldering of pad to ground plane for optimal thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LED sink driver applications.

Compared with STP16CP05PTR, STP16CP596TTR delivers 2.3× better thermal performance for higher sustained current; versus TLC59283RTJR, it offers simpler current-setting via resistor but lacks per-channel PWM, making it ideal for cost-sensitive, uniform-brightness LED arrays.

Availability

STP16CP596TTR is available at Aetrix Electronics and suitable for LED video walls, industrial HMIs, automotive interior lighting, and architectural LED strips requiring stable component supply and high thermal reliability.

Supply support for STP16CP596TTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for industrial, automotive, and consumer markets.

The STP16CP596 belongs to ST's LED driver product line, engineered specifically for high-density, thermally constrained LED panel applications where uniform current matching and compact packaging are critical.

FAQ

What is the function of the exposed thermal pad on the STP16CP596TTR package?

The exposed pad is electrically isolated but must be soldered to a PCB copper pour connected to GND for optimal thermal conduction. It reduces junction-to-ambient thermal resistance from 85 °C/W (standard TSSOP) to 37.5 °C/W, enabling 50 mA per channel operation without derating at +85°C ambient.

How does the R-EXT pin set output current, and what resistor value gives 20 mA per channel?

R-EXT sets current via I_OUT ≈ 12.5 V / R_EXT. For 20 mA, use R_EXT = 12.5 V / 0.02 A = 625 Ω. The datasheet confirms 1 kΩ yields 19.6–20.4 mA at V_DD = 3.3 V, so 620 Ω metal-film resistor achieves nominal 20 mA with ±1% tolerance.

Can STP16CP596TTR drive LEDs with forward voltages exceeding 5 V per string?

Yes - its 16 V absolute maximum output voltage rating allows driving up to five 3.2 V blue/white LEDs (16 V / 3.2 V ≈ 5) in series per channel. At 50 mA, total power per channel is ≤800 mW, requiring thermal design attention but remaining within safe operating area when the exposed pad is properly soldered.

What is the timing relationship between CLK, LE, and OE for reliable output updating?

Data shifts in on CLK rising edges; LE must go high *after* final bit arrives to latch the 16-bit word to outputs. OE low enables outputs; if OE is high during latching, outputs remain off. Minimum LE pulse width is 20 ns at V_DD = 3.3 V, and OE must stay low ≥400 ns before/after LE transition to avoid glitches.