STMicroelectronics STTS2004B2DN3F

Overview

STTS2004B2DN3F from STMicroelectronics is a JEDEC TSE2004B2-compliant 2.2 V memory module temperature sensor with integrated 4 Kb SPD EEPROM, designed for DDR4 DIMM thermal monitoring and configuration storage in servers and laptops. It features programmable 9–12-bit temperature resolution (0.25 °C/LSB default), ±1 °C accuracy from +75 °C to +95 °C, and operates from –20 °C to +125 °C on a single 2.2–3.6 V supply.

For engineers reviewing the STTS2004B2DN3F datasheet, STTS2004B2DN3F pinout, STTS2004B2DN3F application, or STTS2004B2DN3F equivalent, key selection criteria include SPD EEPROM page write timing (≤5 ms), EVENT pin interrupt/comparator mode configurability, SMBus timeout compliance (25–35 ms), and TDFN8 package compatibility with JEDEC MO-229 W2030D landing patterns.

Technical Context

The device integrates two independent functional blocks: a sigma-delta ADC-based temperature sensor with user-programmable resolution and hysteresis (0/1.5/3/6 °C), and a 4 Kb SPD EEPROM organized as two 256-byte pages-each split into two 128-byte blocks with software-selectable write protection per block. Both subsystems share a single I²C interface but operate in parallel with distinct register maps.

It implements JEDEC TSE2004B2 protocol compliance via dedicated registers including capability, configuration, trip point, and resolution registers; supports I²C Fast Mode+ up to 1 MHz without clock stretching; and uses an open-drain EVENT pin configurable for critical overtemperature, alarm window, or comparator-mode thermostat output.

Key Specifications

Pinout & Package

STTS2004B2DN3F is housed in a 2 mm × 3 mm, 0.80 mm max height TDFN8 package (JEDEC MO-229 W2030D compliant), optimized for high-density DIMM PCB layouts with minimal footprint and thermal resistance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar memory module thermal sensing and SPD storage applications.

Compared with STTS2002B2DN3F, STTS2004B2DN3F adds 2 Kb SPD capacity and page-select capability essential for DDR4; versus AT24C04C-SSHM-T, it eliminates discrete sensor integration effort and guarantees JEDEC-aligned thermal response timing.

Availability

STTS2004B2DN3F is available at Aetrix Electronics and suitable for DDR4 server DIMMs, laptop SO-DIMMs, and industrial embedded memory modules requiring stable component supply, JEDEC-compliant SPD storage, and factory-calibrated thermal sensing.

Supply support for STTS2004B2DN3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader specializing in microcontrollers, sensors, power management, and memory solutions for automotive, industrial, and computing markets.

The STTS series targets DDR memory thermal management, combining JEDEC-compliant temperature sensing and SPD EEPROM in compact packages to reduce DIMM BOM cost and PCB area.

FAQ

What is the maximum I²C clock frequency supported by STTS2004B2DN3F?

The device supports I²C Fast Mode+ operation up to 1 MHz, verified per AC timing specifications in Table 33 of the datasheet. It does not initiate clock stretching, ensuring predictable bus latency in multi-device DIMM configurations. This speed enables full 512-byte SPD reads in under 5 ms with standard ACK polling.

How is EEPROM write protection implemented on STTS2004B2DN3F?

Write protection is applied per 128-byte block using a software-controlled sequence requiring VHV (≥2.7 V) on the A0 pin. Each block is locked/unlocked independently via specific I²C commands defined in Section 5.4.1. Protection persists through power cycles and requires VHV reapplication to modify lock state.

Can the EVENT pin be used for both interrupt and comparator functions simultaneously?

No-the EVENT pin operates in one of three mutually exclusive modes: interrupt (pulse on threshold breach), comparator (latched high/low based on hysteresis), or critical-only (asserts only above critical trip point). Mode selection is controlled via bits 2–1 in the Configuration Register (address 0x01), as detailed in Section 4.2.2–4.2.4.

What is the significance of the "B2" suffix in STTS2004B2DN3F?

The "B2" denotes compliance with JEDEC specification TSE2004B2, which defines updated thermal accuracy, hysteresis, and register mapping requirements for DDR4 memory modules. It distinguishes this variant from earlier TSE2004A2-compliant versions like STTS2004A2DN3F, particularly in trip point register layout and SMBus timeout behavior.