STMicroelectronics STTS3000B2DN3F

Overview

STTS3000B2DN3F from STMicroelectronics is a JEDEC TS3000-compliant 2.3 V digital temperature sensor for DDR memory modules, featuring programmable 9–12-bit ADC resolution (0.25 °C/LSB default), ±1 °C accuracy from +75 °C to +95 °C, and SMBus/I²C interface up to 400 kHz. It operates from –40 °C to +125 °C on 2.3–3.6 V supply with 160 µA typical current and integrates an open-drain EVENT pin for thermal alarm signaling in laptop DIMMs.

For engineers reviewing the STTS3000B2DN3F datasheet, STTS3000B2DN3F pinout, STTS3000B2DN3F application, or STTS3000B2DN3F equivalent, key selection criteria include JEDEC TS3000 compliance, TDFN8 package footprint compatibility, programmable hysteresis (0/1.5/3/6 °C), critical temperature interrupt capability, and factory-calibrated zero-component operation without external trimming.

Technical Context

The STTS3000B2DN3F implements a sigma-delta ADC architecture with user-accessible registers for temperature resolution (TRES), alarm thresholds (upper/lower/critical), and configuration control. Its logic diagram confirms dedicated comparator/interrupt modes for the EVENT pin, independent of SMBus timing.

It supports full SMBus protocol compliance-including timeout (25–35 ms), spike suppression filters, and voltage hysteresis per I²C specs-while avoiding clock stretching. Address selection via A0–A2 pins enables up to eight devices on one bus, essential for multi-DIMM server memory subsystems.

Key Specifications

Pinout & Package

STTS3000B2DN3F uses a 2 mm × 3 mm, 0.80 mm max height TDFN8 package (JEDEC MO-229 WCED-3 compliant), optimized for space-constrained DDR3/DDR4 DIMM PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar memory module temperature sensing applications.

Compared with MAX6603EUK+T and LM75BIMMX/NOPB, STTS3000B2DN3F uniquely delivers JEDEC TS3000 register alignment, critical temperature event signaling, and 0–6 °C hysteresis selection-enabling direct integration into DDR memory thermal management firmware without adaptation layers.

Availability

STTS3000B2DN3F is available at Aetrix Electronics and suitable for laptop DIMM thermal monitoring, server memory subsystems, industrial embedded memory modules, and telecom line card DDR applications requiring stable component supply and JEDEC-compliant thermal telemetry.

Supply support for STTS3000B2DN3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, sensors, power ICs, and automotive chips with emphasis on energy efficiency and system integration.

The STTS3000 product line targets JEDEC-compliant thermal sensing for DDR memory modules, specifically engineered to replace discrete thermistor solutions with calibrated, space-saving digital sensors for mobile and server platforms.

FAQ

What is the default SMBus address of STTS3000B2DN3F?

The default SMBus address is 0x18, determined by tying A0=A1=A2 to VSS (logic low). Each combination of A0–A2 sets a unique address from 0x18 to 0x1F, allowing up to eight devices on one bus without address conflict. This mapping is fixed in hardware and does not require register initialization.

Does STTS3000B2DN3F require external calibration components?

No. STTS3000B2DN3F is factory-calibrated across its full temperature range and requires no external resistors, capacitors, or trimming components. The sigma-delta ADC and temperature sensor elements are trimmed during production, enabling immediate use after power-up with guaranteed ±1 °C accuracy in the +75 °C to +95 °C range.

How is the EVENT pin configured for critical temperature shutdown?

The EVENT pin is configured for critical shutdown by writing the desired trip point to the Critical Register (address 0x04) and setting bit 7 of the Configuration Register (address 0x01) to '1'. When temperature exceeds this value, EVENT asserts low and remains latched until cleared via SMBus command or power cycle - providing hardware-level fail-safe response.

Can STTS3000B2DN3F operate at 2.5 V supply?

Yes. STTS3000B2DN3F is specified for continuous operation from 2.3 V to 3.6 V, making it fully compatible with 2.5 V memory interface rails. At 2.5 V, supply current remains within 160 µA typical, and all timing parameters-including 125 ms max ADC conversion and SMBus 400 kHz support-remain valid per datasheet specifications.