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STMicroelectronics STTS424BDN3F

Part No.:
STTS424BDN3F
Manufacturer:
STMicroelectronics
Category:
Thermal Management
Package:
8-WFDFN Exposed Pad
Datasheet:
AetrixSTTS424BDN3F.pdf
Description:
IC MEMORY MOD TEMP SENSOR 8-TDFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,089

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Product details

Overview

STTS424BDN3F from STMicroelectronics is a JEDEC JC42.4-compliant digital temperature sensor IC designed for DIMM module thermal monitoring in laptops and servers. It features 0.25°C typical resolution, ±1°C accuracy from +75°C to +95°C, 2.7–3.6 V supply operation, and an open-drain EVENT alert output for alarm window or critical trip detection.

For engineers reviewing the STTS424BDN3F datasheet, STTS424BDN3F pinout, STTS424BDN3F application, or STTS424BDN3F equivalent, this page delivers verified technical context, JEDEC-aligned register behavior, SMBus/I²C timing compliance, and DIMM-specific configuration capabilities - all grounded in the official STMicroelectronics specification.

Technical Context

The STTS424BDN3F integrates a bandgap-based temperature sensing element with a 10-bit sigma-delta ADC, delivering digitized temperature data in °C format with no external calibration required. Its pointer-register architecture supports read-only, write-only, and read/write registers including capability, configuration, temperature, and programmable trip-point registers (upper/lower alarm, critical).

It operates as an SMBus/I²C slave device with fixed DTI code '0011' and user-configurable A0–A2 address pins enabling up to eight devices on one bus. The device supports bus timeout (25 ms default), does not initiate clock stretching, and provides active-low open-drain EVENT output configurable in comparator or interrupt mode.

Key Specifications

Parameter Value and Actual Design Meaning
Temp resolution 0.25°C typical LSB - enables fine-grained thermal margining for memory module throttling decisions
Accuracy range ±1°C from +75°C to +95°C - meets JEDEC JC42.4 tight tolerance requirement for DIMM hot-spot monitoring
Supply voltage 2.7 V to 3.6 V - compatible with DDR3/DDR4 DIMM VDDQ rails and low-power mobile platforms
Max operating current 200 µA - minimizes self-heating impact and supports always-on thermal supervision in standby states
ADC conversion time 125 ms max - defines minimum polling interval for real-time temperature updates without bus contention
I²C/SMBus speed Up to 400 kHz - ensures compatibility with standard system management controllers and avoids timing bottlenecks
Hysteresis options 0, 1.5, 3, or 6.0°C - prevents chattering of EVENT output during thermal transitions near trip thresholds

Pinout & Package

STTS424BDN3F uses a 2 mm × 3 mm TDFN8 package (JEDEC MO-229 WCED-3 compliant) with maximum height of 0.80 mm, optimized for space-constrained DIMM PCB layouts.

Pin/Terminal Circuit Role Design Meaning
A0, A1, A2 I²C slave address LSBs Set device address (0x30–0x37) by tying to VDD or VSS - enables multi-sensor DIMM topology
VSS Ground reference System ground connection required for accurate ADC reference and noise immunity
SDA Serial data I/O Open-drain bidirectional line - requires external pull-up; shares bus with other SMBus peripherals
SCL Serial clock input Master-generated clock signal; device responds within SMBus/I²C AC timing limits (tHD:DAT ≥ 300 ns)
EVENT Alert interrupt output Open-drain active-low output - asserts when temperature exceeds programmed upper/lower/critical thresholds
VDD Power supply 2.7–3.6 V input - powers internal sensor, ADC, and logic; decoupling capacitor recommended per JEDEC layout guidelines

Key Features

Feature Design Value
JEDEC JC42.4 compliance Guarantees interoperability with industry-standard memory thermal management firmware and host controllers
User-programmable trip registers Independent upper/lower alarm and critical trip points allow flexible thermal policy implementation (e.g., throttling vs. shutdown)
Configurable EVENT output mode Selectable comparator or interrupt mode enables direct hardware response or software-driven event handling
Factory-calibrated sensor Eliminates need for external components or system-level calibration - reduces BOM cost and test complexity
SMBus timeout support Automatic bus recovery after 25 ms SCL hold - enhances system robustness against master lockup or bus contention

Applications

Laptop DDR4 DIMM Thermal Monitoring Server RDIMM Temperature Supervision

Use Scenario: Real-time ambient temperature tracking on DDR4 SO-DIMMs in ultrabooks with dynamic thermal throttling.

IC Role / Device Role / Timing Role: Primary JEDEC-compliant temperature sensor providing calibrated °C readings via SMBus to platform controller hub (PCH).

Use Value: Enables precise thermal margining at +75°C to +95°C where ±1°C accuracy directly impacts CPU frequency scaling decisions.

Use Scenario: Multi-point thermal monitoring across 8 RDIMMs in a dual-socket server, each hosting one STTS424BDN3F.

IC Role / Device Role / Timing Role: Slave device on shared SMBus segment, using A0–A2 address pins to ensure unique addressing per module.

Use Value: Supports simultaneous polling with 125 ms conversion time - maintains sub-second thermal update cycle across full memory subsystem.

Industrial Memory Module Health Diagnostics Embedded Computing DIMM Safety Shutdown

Use Scenario: Long-term temperature logging in industrial control systems using DDR3L modules operating from –40°C to +85°C.

IC Role / Device Role / Timing Role: Standalone sensor feeding temperature history to FPGA-based health monitor via I²C interface.

Use Value: ±2°C accuracy over +40°C to +125°C ensures reliable early-warning detection before thermal derating thresholds are breached.

Use Scenario: Critical temperature-triggered power-down in ruggedized embedded computers with DDR4 ECC modules.

IC Role / Device Role / Timing Role: Event-driven safety component asserting active-low signal to PMIC upon crossing critical trip point.

Use Value: Hardware-level shutdown response eliminates software latency - EVENT pin activates within 125 ms of threshold breach.

Equivalent & Alternatives

The following parts are listed as comparable options for similar JEDEC JC42.4 temperature sensor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MAX6605AESA+ ±2°C accuracy over full –40°C to +125°C range; 12-bit resolution; 2.7–5.5 V supply Broader voltage range suits mixed-voltage systems but lacks JEDEC JC42.4 register map compatibility Prefer when non-JEDEC register access or wider supply range is needed; not drop-in for DIMM firmware
LM75BIMMX/NOPB ±2°C accuracy (–25°C to +100°C); 9-bit resolution; no programmable hysteresis; no EVENT pin Basic thermal alert only - no alarm window or critical trip functionality Use only for simple over-temperature indication where JEDEC compliance and advanced trip control are unnecessary

Compared with MAX6605AESA+ and LM75BIMMX/NOPB, STTS424BDN3F uniquely delivers JEDEC JC42.4 register alignment, ±1°C high-accuracy zone, and dual-mode EVENT output - making it the only choice for standards-compliant DIMM thermal management requiring firmware interoperability and hardware alert flexibility.

Availability

STTS424BDN3F is available at Aetrix Electronics and suitable for laptop memory modules, server RDIMMs, and industrial DDR3/DDR4 thermal monitoring applications requiring stable component supply and long-lifecycle support.

Supply support for STTS424BDN3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, sensors, power management, and automotive ICs.

STTS424BDN3F belongs to ST's JEDEC-compliant memory thermal sensor product line, engineered specifically to meet the accuracy, packaging, and register interface requirements of DDR3/DDR4 DIMM modules in computing and server platforms.

FAQ

What is the default I²C address of STTS424BDN3F and how is it configured?

The STTS424BDN3F has a fixed 4-bit Device Type Identifier (DTI) of '0011'. Its full 7-bit slave address is formed by appending the A2/A1/A0 pin states, yielding addresses from 0x30 to 0x37. All three address pins are hardwired inputs - no internal address register exists, and configuration occurs solely through external VDD/VSS connections.

Does STTS424BDN3F support clock stretching on the I²C bus?

No. STTS424BDN3F explicitly does not initiate clock stretching, as confirmed in Section 3.1 of the official datasheet. This ensures deterministic timing behavior and compatibility with hosts that do not support stretched clocks, such as many baseboard management controllers (BMCs) and microcontrollers with simplified I²C peripherals.

How is hysteresis implemented and what values are selectable?

Hysteresis is implemented in hardware and applied to the EVENT output to prevent oscillation near trip thresholds. Four discrete values are selectable via the Configuration Register: 0°C, 1.5°C, 3°C, or 6.0°C. The setting applies uniformly to upper alarm, lower alarm, and critical trip events - no per-threshold hysteresis configuration is supported.

Can STTS424BDN3F measure temperature in Fahrenheit natively?

No. The STTS424BDN3F outputs temperature exclusively in degrees Celsius, calibrated and formatted per JEDEC JC42.4. Fahrenheit conversion must be performed externally in host firmware using the formula °F = (°C × 9/5) + 32 or a precomputed lookup table - no onboard conversion logic or register option exists.

STTS424BDN3F Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
8-WFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Function:
Temp Monitoring System (Sensor)
Sensor Type:
Internal
Sensing Temperature:
-40°C ~ 125°C
Accuracy:
±3°C(Max)
Topology:
ADC (Sigma Delta), Register Bank
Output Type:
I2C/SMBus
Output Alarm:
Yes
Output Fan:
No
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-TDFN (2x3)

STTS424BDN3F FAQ

1.How can I place an order for STTS424BDN3F through Aetrix?

Please submit a Request for Quotation (RFQ) for STTS424BDN3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STTS424BDN3F reliable?

The price and inventory of STTS424BDN3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STTS424BDN3F is usually 5 days.

3.What payment methods are accepted for STTS424BDN3F?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STTS424BDN3F transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STTS424BDN3F?

STTS424BDN3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STTS424BDN3F order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STTS424BDN3F?

For technical support, including STTS424BDN3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STTS424BDN3F requirements.

6.How does Aetrix verify that STTS424BDN3F is sourced from the original manufacturer or authorized distributors?

All STTS424BDN3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STTS424BDN3F meets industry standards.

7.What is the process for return or replacement of STTS424BDN3F?

All STTS424BDN3F units undergo pre-shipment inspection (PSI). If there is an issue with STTS424BDN3F, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STTS424BDN3F part is unused and in its original packaging.

Return procedure for STTS424BDN3F:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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