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STMicroelectronics STTS424E02BDN3F
- Part No.:
- STTS424E02BDN3F
- Manufacturer:
- STMicroelectronics
- Category:
- Thermal Management
- Package:
- 8-WFDFN Exposed Pad
- Datasheet:
-
STTS424E02BDN3F.pdf
- Description:
- IC TEMP SENSOR 2KB EEPRM 8-TDFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,148
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Product details
Overview
STTS424E02 from STMicroelectronics is a JEDEC JC 42.4–compliant memory module temperature sensor integrated with a 2 Kb SPD EEPROM in a single TDFN8 package. It delivers 0.25 °C temperature resolution, ±1 °C accuracy from +75 °C to +95 °C, and operates from 2.7 V to 3.6 V - enabling compact thermal monitoring and SPD data storage for DDR SDRAM DIMMs in laptops and servers.
For engineers reviewing the STTS424E02 datasheet, STTS424E02 pinout, STTS424E02 application, or STTS424E02 equivalent, key selection considerations include SMBus/I²C address configurability (A0–A2), open-drain EVENT output behavior, SPD EEPROM write protection modes (SWP/CWP/PSWP), and DN-package thermal rating (–40 °C to +125 °C).
Technical Context
The device integrates two independent I²C/SMBus peripherals on a shared bus: a temperature sensor (DTI code 0011b) and a 2 Kb SPD EEPROM (DTI code 1010b), each with dedicated slave addresses. The sensor uses a bandgap-based 10-bit ADC with sigma-delta architecture and factory calibration, delivering digitized temperature values in °C without external components.
The EEPROM implements JEDEC-standard SPD functionality with byte/page write (≤16 bytes), self-timed 5 ms max write cycles, and dual-layer software write protection - permanently locking the upper 128 bytes (00h–7Fh) for critical DRAM configuration data while allowing flexible protection of the lower half via SWP/CWP/PSWP bits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temp resolution | 0.25 °C/LSB - enables fine-grained thermal throttling decisions in memory subsystems |
| Temp accuracy | ±1 °C @ +75–+95 °C - meets JEDEC JC 42.4 requirement for mobile DIMM thermal sensing |
| Supply voltage | 2.7 V to 3.6 V - compatible with standard DDR module VDDQ rails |
| EEPROM size | 2 Kb (256 × 8 bits) - stores full JEDEC SPD data block including timing, density, and vendor info |
| I²C speed | Up to 400 kHz - supports fast SPD read during system boot without bus contention |
| Operating temp | –40 °C to +125 °C (DN package) - qualified for server DIMM hot-spot monitoring |
| ADC conversion | 125 ms max - deterministic update interval for thermal event triggering |
Pinout & Package
TDFN8 package (DN variant): 2 mm × 3 mm footprint, 0.80 mm max height, JEDEC MO-229 WCED-3 compliant, RoHS/halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A2 | I²C address LSB select | Set to VDD/GND to configure one of eight unique slave addresses for EEPROM or sensor access |
| VSS | Ground reference | Common return path for both sensor and EEPROM; must be low-impedance for ADC stability |
| SDA | Open-drain serial data | Shared bidirectional bus line; requires external pull-up; supports SMBus timeout detection |
| SCL | Serial clock input | Master-generated clock; controls timing of all register reads/writes and EEPROM operations |
| EVENT | Open-drain alarm output | Active-low interrupt indicating temperature breach of programmable upper/lower/critical thresholds |
| VDD | Power supply | Single 2.7–3.6 V rail powers both sensor and EEPROM; 210 µA max standby current |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC JC 42.4 compliance | Guarantees interoperability with industry-standard memory controller thermal management firmware |
| Programmable hysteresis | 0, 1.5, 3, or 6.0 °C - prevents EVENT chatter during slow thermal transients near trip points |
| Dual-mode EVENT output | Configurable as comparator (thermostat) or interrupt (SMBus alert) - supports legacy and modern BIOS implementations |
| SPD EEPROM write protection | Permanent lock for upper 128 bytes + reversible SWP/CWP/PSWP for lower half - secures DIMM identity while allowing field updates |
| Factory-calibrated sensor | No external components required - reduces BOM count and layout area on DIMM PCB |
Applications
| Laptop DDR4 DIMM Thermal Monitoring | Server RDIMM SPD & Temperature Management |
|---|---|
Use Scenario: Real-time die temperature tracking of DDR4 modules in thin-and-light notebooks during sustained CPU/GPU load. IC Role / Device Role / Timing Role: Dual-function sensor/SPD IC providing calibrated temperature readings and JEDEC-compliant SPD data over SMBus at boot and runtime. Use Value: Enables dynamic memory frequency scaling based on actual module temperature, improving thermal headroom without requiring separate thermal sensors or EEPROMs. |
Use Scenario: High-density RDIMM modules in 2U rack servers where DIMM slot temperature exceeds 95 °C under full memory bandwidth load. IC Role / Device Role / Timing Role: Critical thermal watchdog and SPD data source; EVENT pin triggers platform-level throttling or alert logs when critical threshold is exceeded. Use Value: Reduces component count per DIMM by combining SPD and thermal sensing, lowering assembly cost and PCB routing complexity in space-constrained server modules. |
| Industrial Embedded Memory Subsystem | DDR5 Module Pre-Compliance Validation |
Use Scenario: Fanless industrial PCs operating in extended temperature environments (–40 °C to +85 °C ambient) with DDR4 SO-DIMMs. IC Role / Device Role / Timing Role: Primary temperature sensor feeding thermal control logic; SPD EEPROM stores vendor-specific timing parameters for custom memory initialization. Use Value: Single-chip solution eliminates inter-IC timing skew between discrete SPD and thermal ICs, ensuring deterministic boot sequence timing across temperature extremes. |
Use Scenario: DDR5 module development using early JEDEC SPD templates before final specification freeze. IC Role / Device Role / Timing Role: Reference SPD EEPROM with programmable temperature thresholds used to validate host memory controller's SMBus thermal response behavior. Use Value: Allows pre-silicon validation of thermal management firmware using production-grade SPD data structure and real-world temperature feedback loop. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar memory module thermal sensing and SPD EEPROM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTS2002 | Successor device; same footprint, improved ±0.5 °C accuracy over +75–+95 °C, lower 100 µA typical supply current | Recommended for new designs per ST's documentation; supports identical SPD functions and JEDEC JC 42.4 compliance | Select STTS2002 for new laptop/server DIMM designs requiring tighter thermal accuracy and lower power. |
| AT24C02D-SSHM-T | Standalone 2 Kb I²C EEPROM only - no integrated temperature sensor or EVENT output | Requires external thermal sensor (e.g., STLM20) and additional routing; lacks JEDEC JC 42.4 registers and SMBus timeout support | Use only if SPD-only functionality is needed and thermal sensing is handled separately via another IC. |
Compared with STTS424E02, STTS2002 offers higher thermal accuracy and lower quiescent current while maintaining pin and firmware compatibility; AT24C02D provides SPD-only capability but increases BOM count, board area, and firmware integration effort due to missing integrated sensor logic and JEDEC register map.
Availability
STTS424E02 is available at Aetrix Electronics and suitable for laptop DDR4 DIMM manufacturing, server RDIMM thermal management systems, and industrial embedded memory subsystems requiring stable component supply despite its "not recommended for new design" status.
Supply support for STTS424E02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, analog ICs, MEMS, and power management solutions for automotive, industrial, and consumer markets.
The STTS424E02 belongs to ST's memory interface sensor product line, designed specifically to consolidate thermal monitoring and SPD data storage into a single JEDEC-compliant device for DDR memory modules.
FAQ
What is the maximum operating temperature range for the STTS424E02 in the DN package?
The DN package (TDFN8) is rated for –40 °C to +125 °C operation, as confirmed in Section 1 of the datasheet (Doc ID 13448 Rev 8, page 2). This rating applies to both the temperature sensor and SPD EEPROM functions, making it suitable for high-temperature server DIMM hot spots.
How does the EVENT pin behave in comparator mode versus interrupt mode?
In comparator mode, EVENT asserts low when temperature crosses a programmed threshold and remains latched until cleared by host software via register write. In interrupt mode, EVENT pulses low for 100 ms upon threshold crossing and auto-clears, signaling the host without requiring immediate register access - supporting legacy SMBus Alert Response Protocol.
Can the upper 128 bytes of the SPD EEPROM be unlocked after permanent write protection is enabled?
No. Permanent software write protection (PSWP) for the upper 128 bytes (00h–7Fh) is irreversible - once set, those locations cannot be rewritten even after power cycle or reset. This ensures JEDEC SPD configuration data remains tamper-proof throughout the DIMM's lifetime.
What I²C address offsets are used for the temperature sensor versus the SPD EEPROM?
The temperature sensor responds to I²C addresses with DTI code 0011b (e.g., 0x90–0x96 depending on A0–A2), while the SPD EEPROM uses DTI code 1010b (e.g., 0xA0–0xA6). These distinct DTI codes prevent register conflicts and allow simultaneous addressing on the same bus without arbitration issues.
STTS424E02BDN3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-WFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Temp Monitoring System (Sensor)
- Sensor Type:
- Internal
- Sensing Temperature:
- -40°C ~ 125°C
- Accuracy:
- ±3°C(Max)
- Topology:
- ADC (Sigma Delta), Register Bank
- Output Type:
- I2C/SMBus
- Output Alarm:
- Yes
- Output Fan:
- No
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TDFN (2x3)
STTS424E02BDN3F FAQ
1.How can I place an order for STTS424E02BDN3F through Aetrix?
Please submit a Request for Quotation (RFQ) for STTS424E02BDN3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STTS424E02BDN3F reliable?
The price and inventory of STTS424E02BDN3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STTS424E02BDN3F is usually 5 days.
3.What payment methods are accepted for STTS424E02BDN3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STTS424E02BDN3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STTS424E02BDN3F?
STTS424E02BDN3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STTS424E02BDN3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STTS424E02BDN3F?
For technical support, including STTS424E02BDN3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STTS424E02BDN3F requirements.
6.How does Aetrix verify that STTS424E02BDN3F is sourced from the original manufacturer or authorized distributors?
All STTS424E02BDN3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STTS424E02BDN3F meets industry standards.
7.What is the process for return or replacement of STTS424E02BDN3F?
All STTS424E02BDN3F units undergo pre-shipment inspection (PSI). If there is an issue with STTS424E02BDN3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STTS424E02BDN3F part is unused and in its original packaging.
Return procedure for STTS424E02BDN3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STTS424E02BDN3F Tags
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EMC2101-ACZL-TR
Microchip Technology
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MCP9844T-BE/MNY
Microchip Technology
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EMC2101-R-ACZL-TR
Microchip Technology
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MCP98244T-BE/MNY
Microchip Technology
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TC670ECHTR
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SE98ATP,547
NXP Semiconductors
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AMC6821SDBQR
Texas Instruments
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MAX6604AATA+T
Analog Devices Inc./Maxim Integrated
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ADT7475ARQZ-REEL
onsemi
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MAX6643LBBAEE+
Analog Devices Inc./Maxim Integrated
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MAX6684ESA+T
Analog Devices Inc./Maxim Integrated
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MAX6639AEE+
Analog Devices Inc./Maxim Integrated
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