STMicroelectronics STTS751-1DP3F
- Part No.:
- STTS751-1DP3F
- Manufacturer:
- STMicroelectronics
- Category:
- Analog and Digital Output
- Package:
- 6-UDFN
- Datasheet:
-
STTS751-1DP3F.pdf
- Description:
- SENSOR DIGITAL -40C-125C 6UDFN
- Quantity:
- Payment:

- Shipping:

Inventory:28,987
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Product details
Overview
STTS751-1DP3F from STMicroelectronics is a 2.25 V–3.6 V SMBus 2.0–compatible local digital temperature sensor in UDFN-6L (2 mm × 2 mm) package, delivering ±0.5 °C accuracy from –40 °C to +125 °C, programmable 9–12-bit resolution (0.0625–0.5 °C/LSB), and 21 ms typical 10-bit conversion time - deployed for thermal monitoring in SSDs, servers, and smart batteries.
For engineers reviewing the STTS751-1DP3F datasheet, STTS751-1DP3F pinout, STTS751-1DP3F application, or STTS751-1DP3F equivalent, key selection criteria include SMBus address configurability via Addr/Therm pull-up resistor (7.5 kΩ → 1001010b), EVENT open-drain alert output, standby current of 3 μA, and one-shot conversion mode for ultra-low-power thermal polling.
Technical Context
The STTS751-1DP3F implements a sigma-delta A/D converter with user-configurable resolution and conversion rate registers, enabling trade-offs between measurement precision (9–12 bits) and update frequency (0.0625–32 Hz). Its digital comparator continuously monitors temperature against programmable high/low limit registers and asserts the open-drain EVENT pin on threshold violation.
Address selection is implemented via resistor-pullup on the Addr/Therm pin, supporting four SMBus slave addresses per variant; STTS751-1DP3F uses 7.5 kΩ to select 1001010b (0x4A), distinct from STTS751-0DP3F's base address set. The device supports SMBus Alert Response Address (ARA) protocol and timeout recovery (25–35 ms), ensuring robust bus arbitration in multi-sensor systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.25 V to 3.6 V - enables direct interface with low-voltage SoCs and battery-powered systems without level-shifting. |
| Temperature Range | –40 °C to +125 °C - validated for operation in industrial-grade SSDs, server DIMMs, and telecom power modules. |
| Accuracy | ±0.5 °C (typ) over full range - eliminates need for system-level calibration in thermal throttling applications. |
| Resolution & LSB | Programmable 9–12 bit (0.5 °C to 0.0625 °C/LSB) - allows dynamic adjustment of thermal sensitivity vs. conversion latency. |
| Conversion Time | 21 ms (typ) at 10-bit - ensures responsive thermal feedback for CPU/GPU throttling loops with sub-50 ms latency. |
| Standby Current | 3 μA (typ) - extends battery life in portable electronics during idle thermal monitoring intervals. |
| SMBus Speed | Up to 400 kHz - supports high-throughput polling of up to eight STTS751 devices on shared bus without timing violation. |
Pinout & Package
UDFN-6L package (2.0 mm × 2.0 mm × 0.5 mm body, 0.5 mm pitch), wettable flank design for automated optical inspection (AOI) and solder joint reliability in high-volume SMT assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - SCL | SMBus clock input | Asynchronous edge-triggered input; does not support clock stretching - requires host-controlled timing compliance. |
| 2 - EVENT | Open-drain alert output | Asserts low on temperature limit breach; supports SMBus ARA protocol for automatic address reporting to host. |
| 3 - VDD | Power supply | Must be decoupled with ≥100 nF ceramic capacitor near pin; tolerates 2.25–3.6 V with monotonic operation. |
| 4 - Addr/Therm | Configurable address pin / thermal status output | Pull-up resistor selects one of four SMBus addresses; when driven low, enables fan control or CPU throttle signaling. |
| 5 - GND | Ground reference | Common return path for analog sensor core and digital interface; must be low-impedance connection to minimize noise coupling. |
| 6 - SDA | SMBus data I/O | Open-drain bidirectional line; requires external pull-up (typically 2.2–4.7 kΩ) to VDD for proper SMBus logic levels. |
Key Features
| Feature | Design Value |
|---|---|
| One-shot conversion mode | Enables single temperature reading from standby (3 μA), reducing average power in infrequent-monitoring applications like battery fuel gauging. |
| Four-address configurability | Uses single resistor on Addr/Therm to select among four SMBus addresses - simplifies multi-zone thermal layout without address jumpers or firmware reconfiguration. |
| SMBus timeout protection | Auto-resets bus lockup after 25–35 ms of SCL/SDA inactivity - prevents system hang in noisy industrial environments or during hot-plug events. |
| Thermal event response | EVENT pin assertion triggers immediate host interrupt; ARA response delivers device address without polling - cuts thermal fault detection latency to <100 μs. |
| Programmable hysteresis | Configurable THERM hysteresis register (default 10 °C) prevents oscillatory fan switching or throttling near trip thresholds. |
Applications
| Solid State Drives (SSDs) | Notebook Computers |
|---|---|
Use Scenario: Real-time NAND flash die temperature monitoring during sustained write operations. IC Role / Device Role / Timing Role: Local temperature sensor feeding thermal management firmware to throttle write speed before NAND junction exceeds 85 °C. Use Value: Prevents data retention loss and extends SSD lifespan by maintaining die temperature within JEDEC JESD22-A104 limits using ±0.5 °C accuracy and 21 ms conversion. | Use Scenario: CPU/GPU hotspot tracking adjacent to heat pipes and vapor chambers. IC Role / Device Role / Timing Role: SMBus-connected thermal monitor triggering fan PWM and DVFS adjustments via EC firmware. Use Value: Enables precise 0.25 °C/LSB resolution at 10-bit mode to detect 2 °C thermal gradients across CPU package, improving thermal responsiveness by 3× vs. legacy 1°C-step sensors. |
| Smart Batteries | Servers & Data Center Modules |
Use Scenario: Cell pack temperature supervision during fast charging cycles in Li-ion battery packs. IC Role / Device Role / Timing Role: Low-power local sensor providing periodic temperature samples to battery management system (BMS) microcontroller. Use Value: 3 μA standby current extends battery runtime between measurements; one-shot mode reduces average current to <1 μA at 1 sample/sec - critical for always-on BMS monitoring. | Use Scenario: DIMM slot thermal monitoring in dual-socket Xeon platforms with 24+ memory channels. IC Role / Device Role / Timing Role: Distributed temperature node on memory riser card, reporting to BMC via shared SMBus segment. Use Value: Eight unique SMBus addresses (via STTS751-0/1 variants + resistor selection) allow unambiguous polling of all DIMM slots without address conflict or bus contention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM75BIMM/NOPB | Fixed 9-bit resolution (0.5 °C/LSB); no programmable conversion rate or one-shot mode; 3.0–5.5 V supply only. | Lacks resolution flexibility and low-power modes - suitable only for basic ambient monitoring, not precision thermal throttling. | Select only if cost-sensitive, wide-supply legacy designs require pin-compatible drop-in with no firmware updates. |
| MAX31826ATM+ | 12-bit resolution with parasitic power mode; supports 1-Wire interface (not SMBus); ±2 °C accuracy above 85 °C. | Requires 1-Wire host stack; higher error at high temp - better for distributed sensor networks than dense SMBus buses. | Choose for mixed-sensor systems already using 1-Wire infrastructure or where parasitic power eliminates VDD routing. |
Compared with LM75BIMM/NOPB and MAX31826ATM+, STTS751-1DP3F uniquely combines SMBus address configurability, sub-1°C accuracy across full industrial range, and sub-μA average power in one-shot mode - making it optimal for space-constrained, multi-node thermal management in SSDs and servers.
Availability
STTS751-1DP3F is available at Aetrix Electronics and suitable for solid state drives, notebook computers, and smart batteries requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for STTS751-1DP3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, MEMS, and power management solutions for automotive, industrial, and consumer markets.
The STTS751 belongs to ST's precision analog temperature sensor product line, engineered specifically for SMBus-based thermal monitoring in high-density computing and storage systems where accuracy, low power, and multi-device addressability are critical.
FAQ
What SMBus address does STTS751-1DP3F use with a 7.5 kΩ pull-up on Addr/Therm?
With a 7.5 kΩ ±5% pull-up resistor on the Addr/Therm pin, STTS751-1DP3F configures to SMBus slave address 1001010b (0x4A). This is distinct from STTS751-0DP3F's corresponding address (0x48) and enables eight total unique addresses across both variants when combined with other resistor values.
How does the EVENT pin behave during temperature limit violations?
The EVENT pin is an open-drain output that pulls low when the measured temperature exceeds the programmed high limit or falls below the low limit. It remains asserted until the condition clears and the status register is read, and supports SMBus Alert Response Address (ARA) protocol so the host can identify the asserting device without polling.
Can STTS751-1DP3F operate in standalone mode without SMBus communication?
No - STTS751-1DP3F has no local display, analog output, or autonomous alarm functionality. All configuration (resolution, limits, conversion rate), temperature reading, and status access require SMBus commands. The Addr/Therm pin can drive external circuitry (e.g., fan control) only after being configured via SMBus.
What is the maximum allowable capacitance on the Addr/Therm pin?
The total capacitance on the Addr/Therm pin must be less than 100 pF to ensure reliable address latching at power-up and stable Therm output switching. Exceeding this value may cause incorrect SMBus address selection or degraded fan/CPU throttle response time due to RC delay.
STTS751-1DP3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 6-UDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- SMBus
- Voltage - Supply:
- 2.25V ~ 3.6V
- Resolution:
- 11 b
- Features:
- One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Standby Mode
- Accuracy - Highest (Lowest):
- ±1.5°C (±2.5°C)
- Test Condition:
- 0°C ~ 85°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 6-UDFN (2x2)
STTS751-1DP3F FAQ
1.How can I place an order for STTS751-1DP3F through Aetrix?
Please submit a Request for Quotation (RFQ) for STTS751-1DP3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STTS751-1DP3F reliable?
The price and inventory of STTS751-1DP3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STTS751-1DP3F is usually 5 days.
3.What payment methods are accepted for STTS751-1DP3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STTS751-1DP3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STTS751-1DP3F?
STTS751-1DP3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STTS751-1DP3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STTS751-1DP3F?
For technical support, including STTS751-1DP3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STTS751-1DP3F requirements.
6.How does Aetrix verify that STTS751-1DP3F is sourced from the original manufacturer or authorized distributors?
All STTS751-1DP3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STTS751-1DP3F meets industry standards.
7.What is the process for return or replacement of STTS751-1DP3F?
All STTS751-1DP3F units undergo pre-shipment inspection (PSI). If there is an issue with STTS751-1DP3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STTS751-1DP3F part is unused and in its original packaging.
Return procedure for STTS751-1DP3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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