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STMicroelectronics STW82100B

Part No.:
STW82100B
Manufacturer:
STMicroelectronics
Category:
RF Mixers
Package:
44-VFQFN Exposed Pad
Datasheet:
AetrixSTW82100B.pdf
Description:
IC MIXER 1.62-2.4GHZ DWN CONV
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,853

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Product details

Overview

STW82100B from STMicroelectronics is an RF down converter with an embedded integer-N synthesizer designed for cellular infrastructure receivers, IF sampling receiver architectures, digital PA linearization loops, and wireless communication signal-chain equipment. The device integrates a passive mixer, IF amplifier, RF balun, dual differential VCOs, integer-N PLL synthesizer, SPI / I²C digital control, and dual DAC current outputs for external PIN diode attenuator control.

For engineers reviewing the STW82100B datasheet, STW82100B pinout, STW82100B application, or STW82100B equivalent, this RF IC is most relevant for 1620 MHz to 2400 MHz down-conversion systems requiring 8 dB conversion gain, 10.5 dB noise figure, +25.5 dBm IIP3, 70 MHz to 400 MHz IF amplifier coverage, integrated LO generation, and 44-lead exposed-pad VFQFPN assembly.

Technical Context

STW82100B combines a high-linearity passive mixer and integrated RF balun to support a 50 Ω single-ended RF input over the 1620 MHz to 2400 MHz range. The IF amplifier covers 70 MHz to 400 MHz and is intended for 200 Ω IF filter interfaces, giving infrastructure receiver designs an integrated RF-to-IF conversion block with 8 dB conversion gain and 77 dBc 2FRF-2FLO spurious rejection.

The integrated synthesizer uses dual differential VCOs with automatic center-frequency calibration, covering LOA from 1650 MHz to 1950 MHz and LOB from 2050 MHz to 2370 MHz. The integer-N PLL includes a 16/17 or 19/20 programmable prescaler, 10-bit reference divider, adjustable charge-pump current, digital lock detector, and 150 µs fast lock time, with register programming through SPI or fast-mode I²C.

Key Specifications

Parameter Value and Actual Design Meaning
Device Type RF down converter with embedded integer-N synthesizer for wireless infrastructure receiver and feedback-loop signal chains.
RF Frequency Range 1620 MHz to 2400 MHz, covering the STW82100B high-band member of the STW8210xB down-converter family.
IF Amplifier Range 70 MHz to 400 MHz, supporting IF sampling receiver and digital PA linearization architectures.
Conversion Gain 8 dB typical conversion gain, helping preserve receive-chain signal level after RF-to-IF conversion.
Noise Figure 10.5 dB typical noise figure, relevant to receiver sensitivity and RF link-budget planning.
Linearity +25.5 dBm IIP3, supporting high dynamic range operation in cellular infrastructure equipment.
Spurious Rejection 77 dBc 2FRF-2FLO spurious rejection, helping reduce unwanted mixer products in down-conversion paths.
Integrated LO System Dual differential VCOs with automatic center-frequency calibration: LOA 1650 MHz to 1950 MHz and LOB 2050 MHz to 2370 MHz.
Synthesizer Architecture Embedded integer-N synthesizer with 16/17 or 19/20 programmable prescaler, 10-bit reference divider, adjustable charge pump, and digital lock detector.
Lock Time 150 µs fast lock time for frequency-agile receiver and RF feedback-loop operation.
Control Interface SPI and fast-mode I²C bus with 3-bit programmable I²C address format 1101A2A1A0.
DAC Function Integrated DAC with dual current outputs for driving an external PIN diode attenuator.
Supply Rails 3.3 V and 5 V analog supplies plus 3.3 V digital supply domains for RF, PLL, DAC, IF, mixer-driver, and digital-control sections.
Process 0.35 µm BiCMOS SiGe process for integrated RF down-conversion and frequency-synthesis functions.
Package 44-lead exposed-pad VFQFPN package, 7 mm × 7 mm × 1.0 mm.
Operating Temperature -40°C to +85°C operating temperature range for infrastructure and wireless communication equipment.

Pinout & Package

STW82100B is supplied in a 44-lead exposed-pad VFQFPN package measuring 7 mm × 7 mm × 1.0 mm. The exposed-pad QFN format supports compact RF placement, low-inductance grounding, controlled RF return paths, and efficient board-level thermal transfer, which are important when routing the RF input, IF outputs, PLL loop filter, VCO control nodes, digital interface, DAC outputs, and multiple supply domains on cellular infrastructure RF boards.

Pin / Terminal Circuit Role Design Meaning
RF_IN, RF_CT Single-ended RF input and RF balun center-tap connection. RF_IN accepts the 50 Ω RF signal for down conversion, while RF_CT supports the integrated RF balun network used ahead of the passive mixer.
IF_OUTP, IF_OUTN Differential IF amplifier outputs. Provide the converted IF signal as open-collector outputs intended for connection to the external IF load or 200 Ω filter interface.
OUTBUFP, OUTBUFN Differential LO output buffer pins. Provide open-collector LO buffer outputs for RF system synchronization or external LO routing when the LO output function is used.
EXTVCO_INP, EXTVCO_INN External VCO / LO differential input pins. Allow external VCO or diversity slave-mode operation; in internal-VCO operation, these pins follow the internal VCO application connection scheme.
VCTRL, ICP, REXT_CP PLL loop-control and charge-pump setting pins. VCTRL connects to the VCO control node, ICP provides the PLL charge-pump output, and REXT_CP sets charge-pump current through an external resistor.
REF_CLK, LOCK_DET Reference-clock input and digital lock-detect output. REF_CLK supplies the PLL reference signal, while LOCK_DET indicates synthesizer lock state for RF system monitoring.
SDA/DATA, SCL/CLK, LOAD Dual digital bus interface pins. Support I²C data / clock or SPI data / clock / load control, allowing register programming of the synthesizer, VCO calibration, mixer, IF amplifier, and DAC functions.
DBUS_SEL, ADD0, ADD1, ADD2 Bus-selection and I²C address pins. DBUS_SEL selects the digital bus interface mode, while ADD0 to ADD2 program the fast-mode I²C address bits.
I_PINDRV1, I_PINDRV2, REXT_DAC DAC current-output and DAC resistor-setting pins. The dual current outputs drive an external PIN diode attenuator, while REXT_DAC sets the DAC reference current through an external resistor.
EXT_PD Hardware power-down control input. Provides CMOS-level shutdown control, with logic low enabling the device and logic high placing it into power-down mode.
Supply pins RF, PLL, VCO, DAC, IF amplifier, mixer-driver, LO buffer, and digital supply connections. Separate VDD domains such as VDD_DAC, VDD_VCO, VDD_IFAMP, VDD_RFESD, VDD_MIXDRV, VDD_ALC, VDD_DIG, and VDD_IO support noise isolation between analog RF, PLL, IF, and digital-control sections.
Exposed pad / ground RF ground, thermal path, and package reference. The exposed pad is soldered to the RF ground plane to reduce parasitic impedance, support package heat transfer, and maintain stable RF grounding for the down-converter IC.

Key Features

  • Integrated RF down converter with passive mixer, IF amplifier, RF balun, integer-N synthesizer, and dual VCOs.
  • 1620 MHz to 2400 MHz RF input range for high-band cellular infrastructure and wireless receiver applications.
  • 8 dB conversion gain, 10.5 dB noise figure, and +25.5 dBm IIP3 for high-linearity RF-to-IF conversion.
  • 70 MHz to 400 MHz IF amplifier frequency range for IF sampling receiver architectures.
  • Dual integrated VCO ranges with automatic center-frequency calibration and 150 µs synthesizer lock time.
  • SPI and fast-mode I²C programming interface plus integrated dual-current DAC for external PIN diode attenuator control.

Applications

Cellular Infrastructure IF Sampling Receivers Digital PA Linearization Loops

Use Scenario: Base-station receiver paths that translate RF signals in the 1620 MHz to 2400 MHz range to a lower IF band.

IC Role: RF down converter with passive mixer, integrated RF balun, IF amplifier, and programmable synthesizer.

Use Value: 8 dB conversion gain, +25.5 dBm IIP3, and 70 MHz to 400 MHz IF output support high-dynamic-range IF sampling receiver designs.

Use Scenario: Transmit feedback paths used for power-amplifier linearization in cellular infrastructure equipment.

IC Role: Integrated down-conversion and synthesizer IC for RF feedback signal translation.

Use Value: Fast 150 µs lock time, DAC-based PIN attenuator drive support, and high linearity help simplify feedback-loop RF signal conditioning.

Wireless Communication Down-Conversion Compact Multi-Function RF Boards

Use Scenario: Wireless communication receivers requiring RF translation from high RF bands to a filtered IF stage.

IC Role: RF-to-IF mixer and synthesizer block controlled by SPI or I²C.

Use Value: Integrated VCOs, reference divider, prescaler, charge pump, and lock detector reduce the number of external RF synthesis components.

Use Scenario: RF boards that need down-conversion, LO generation, IF amplification, and attenuator drive in a small footprint.

IC Role: Highly integrated BiCMOS SiGe RF IC in a 44-lead exposed-pad VFQFPN package.

Use Value: RF balun integration, internal matching, dual digital bus control, and 7 mm × 7 mm package size help reduce RF BOM and board area.

Equivalent & Alternatives

When evaluating STW82100B equivalent devices, engineers should compare RF input frequency range, LO/VCO coverage, conversion gain, noise figure, IIP3, IF amplifier frequency range, synthesizer interface, DAC attenuator-drive requirement, VFQFPN-44 footprint, and production packaging format.

Alternative Part Technical Difference Application Difference Selection Advice
STW82100BTR Same STW82100B RF range, down-converter architecture, embedded integer-N synthesizer, and VFQFPN-44 package, but supplied in tape-and-reel packaging instead of tray packaging. Useful when the same circuit design is retained but manufacturing logistics require reel-fed assembly. Select STW82100B for tray-based handling; select STW82100BTR when tape-and-reel production flow is required.
STW82101B Same STW8210xB RF down-converter family and VFQFPN-44 package, but optimized for a lower 695 MHz to 960 MHz RF range with 8.5 dB conversion gain and 9.5 dB noise figure. Better suited for lower-band cellular infrastructure receivers rather than the 1620 MHz to 2400 MHz RF range of STW82100B. Use STW82100B for 1.62 GHz to 2.4 GHz conversion; use STW82101B when the receiver band is in the 695 MHz to 960 MHz range.
STW82102B Same family and 44-lead VFQFPN format, but specified for a 1425 MHz to 1910 MHz RF range with LOA 1500 MHz to 1800 MHz and LOB 1900 MHz to 2200 MHz. Fits systems centered below the STW82100B upper-band coverage while retaining the same integrated down-converter and synthesizer concept. Compare STW82100B vs STW82102B by RF band plan, LO range, image and spur budget, and IF frequency requirement.
STW82103B Same STW8210xB architecture with 8 dB conversion gain and 10.5 dB noise figure, but specified for a higher 2300 MHz to 2700 MHz RF range. More appropriate for higher RF bands above the main STW82100B coverage. Select STW82103B when the RF front end targets 2.3 GHz to 2.7 GHz; keep STW82100B when the design operates from 1620 MHz to 2400 MHz.

Compared with STW82100BTR, STW82100B keeps the same RF down-conversion function, PLL architecture, package, pinout, and electrical operating role, with the main selection difference being tray versus tape-and-reel logistics. STW82100B vs STW82101B, STW82102B, or STW82103B selection depends on RF band coverage, LO planning, IF frequency target, spur rejection needs, and assembly packaging requirements.

Quality

STW82100B should be sourced as original STMicroelectronics components through traceable and controlled supply channels. Quality verification procedures may include VFQFPN-44 package inspection, top-mark validation, tray and label verification, solderability testing, RF input continuity review, IF output function verification, SPI / I²C programming checks, PLL lock-detect testing, conversion-gain screening, and incoming inspection according to RF infrastructure equipment production requirements.

Availability

STW82100B is available at Aetrix Electronics and suitable for cellular infrastructure receivers, IF sampling receiver platforms, digital PA linearization loops, and wireless RF down-conversion modules requiring stable component supply and repeatable production support.

Supply support may include scheduled delivery planning, volume procurement support, BOM continuity assistance, traceable sourcing management, and long-term availability support for OEM manufacturers, RF module builders, base-station equipment developers, wireless communication system designers, and electronics production programs.

For production deployment, confirming the VFQFPN-44 package, 1620 MHz to 2400 MHz RF range, IF frequency plan, SPI or I²C control mode, analog and digital supply rails, tray packaging, environmental specifications, and sourcing continuity helps reduce procurement risk and improve manufacturing stability.

Manufacturer

STMicroelectronics supplies RF, mixed-signal, power, embedded, and discrete semiconductor products for wireless infrastructure, industrial, automotive, consumer, and communication systems. STW82100B belongs to the STW8210xB RF down-converter family, which combines frequency synthesis, VCO generation, RF mixing, IF amplification, and digital configurability for compact high-performance RF signal-chain designs.

FAQ

What is STW82100B used for?

STW82100B is used for RF down-conversion in cellular infrastructure equipment, IF sampling receivers, digital PA linearization loops, and wireless communication systems. It translates RF signals from the 1620 MHz to 2400 MHz range into a 70 MHz to 400 MHz IF range using an integrated mixer, IF amplifier, and synthesizer.

What RF and IF ranges does STW82100B support?

STW82100B supports an RF input range from 1620 MHz to 2400 MHz and an IF amplifier range from 70 MHz to 400 MHz. The integrated VCO ranges are LOA from 1650 MHz to 1950 MHz and LOB from 2050 MHz to 2370 MHz, matching the STW82100B high-band frequency plan.

Does STW82100B include an RF synthesizer?

Yes. STW82100B includes an embedded integer-N synthesizer with dual integrated VCOs, automatic center-frequency calibration, programmable prescaler, 10-bit reference divider, adjustable charge-pump current, digital lock detector, and 150 µs fast lock time. This integration reduces the need for a separate PLL and VCO section in many RF boards.

Which digital interfaces are available on STW82100B?

STW82100B supports both SPI and fast-mode I²C bus control. The I²C address uses three programmable address pins in the 1101A2A1A0 format, while the SPI interface uses data, clock, and load control pins for register programming.

What package is used by STW82100B?

STW82100B uses a 44-lead exposed-pad VFQFPN package measuring 7 mm × 7 mm × 1.0 mm. The exposed pad provides the RF ground and thermal path, while the 44-lead layout separates RF input, IF output, PLL, VCO, DAC, digital bus, and supply-domain connections.

What are common STW82100B equivalent options?

Common comparison options include STW82100BTR for the same circuit function in tape-and-reel packaging, STW82101B for 695 MHz to 960 MHz RF coverage, STW82102B for 1425 MHz to 1910 MHz coverage, and STW82103B for 2300 MHz to 2700 MHz coverage. Selection depends on RF band plan, LO range, IF target, package format, and production packaging.

STW82100B Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
44-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
RF Type:
General Purpose
Frequency:
1.62GHz ~ 2.4GHz
Number of Mixers:
1
Gain:
8.5dB
Noise Figure:
10.5dB
Secondary Attributes:
Down Converter
Current - Supply:
108mA
Voltage - Supply:
3.3V ~ 5V
Mounting Type:
Surface Mount
Supplier Device Package:
44-VFQFPN (7x7)

STW82100B FAQ

1.How can I place an order for STW82100B through Aetrix?

Please submit a Request for Quotation (RFQ) for STW82100B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STW82100B reliable?

The price and inventory of STW82100B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STW82100B is usually 5 days.

3.What payment methods are accepted for STW82100B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STW82100B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STW82100B?

STW82100B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STW82100B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STW82100B?

For technical support, including STW82100B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STW82100B requirements.

6.How does Aetrix verify that STW82100B is sourced from the original manufacturer or authorized distributors?

All STW82100B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STW82100B meets industry standards.

7.What is the process for return or replacement of STW82100B?

All STW82100B units undergo pre-shipment inspection (PSI). If there is an issue with STW82100B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STW82100B part is unused and in its original packaging.

Return procedure for STW82100B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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