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STMicroelectronics STW82103BTR

Part No.:
STW82103BTR
Manufacturer:
STMicroelectronics
Category:
RF Mixers
Package:
44-VFQFN Exposed Pad
Datasheet:
AetrixSTW82103BTR.pdf
Description:
IC MIXER 2.3-2.7GHZ DWN CONV
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,238

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Product details

Overview

STW82103BTR from STMicroelectronics is a highly integrated RF down converter with embedded integer-N synthesizer, designed for cellular infrastructure receivers and digital PA linearization loops. It delivers 8 dB conversion gain, 10.5 dB noise figure, +25 dBm IIP3 linearity, and operates across 2300–2700 MHz RF and 70–400 MHz IF bands.

For engineers reviewing the STW82103BTR datasheet, STW82103BTR pinout, STW82103BTR application, or STW82103BTR equivalent, key selection criteria include dual VCO auto-calibration (LOA: 2200–2550 MHz, LOB: 2500–3000 MHz), SPI/I²C dual-bus control with 3-bit address (1101A₂A₁A₀), integrated DAC for PIN diode attenuation, and 44-pin VFQFPN 7×7 mm package with exposed thermal pad.

Technical Context

The STW82103BTR integrates a passive RF mixer, dual differential auto-calibrating VCOs, and an integer-N PLL with dual-modulus prescaler (16/17 or 19/20), programmable 10-bit reference divider, and digital lock detector. Its RF balun enables direct 50 Ω single-ended RF input, while IF outputs drive 200 Ω filters.

The embedded dual-output current DAC (I_PINDRV1/I_PINDRV2) provides precise analog attenuation control for external PIN diodes, and the device supports both standard and diversity modes - including same-LO and different-LO configurations - via configurable digital interface and calibration sequences.

Key Specifications

ParameterValue and Actual Design Meaning
RF Frequency Range2300–2700 MHz: Enables full-band LTE/TD-LTE receiver front-end coverage in base station applications.
IF Output Range70–400 MHz: Supports direct sampling by high-speed ADCs in IF-sampling architectures.
IIP3+25 dBm: Ensures robust interference rejection in dense multi-carrier cellular environments.
Noise Figure10.5 dB: Maintains high SNR in low-level signal reception critical for uplink sensitivity.
Conversion Gain8 dB: Reduces need for external IF amplification, simplifying signal chain design.
VCO CalibrationAutomatic center frequency calibration for LOA (2200–2550 MHz) and LOB (2500–3000 MHz): Eliminates manual tuning and improves production yield.
Phase Noise<−100 dBc/Hz @ 100 kHz offset (typical): Meets stringent EVM requirements for 64-QAM/256-QAM modulation.
Lock Time150 µs: Enables fast frequency hopping and TDD slot switching in time-critical systems.

Pinout & Package

The STW82103BTR is housed in a 44-lead VFQFPN package (7 × 7 × 1.0 mm) with exposed thermal pad for enhanced power dissipation in high-current operation.

Pin/TerminalCircuit RoleDesign Meaning
RF_IN (Pin 38)RF input portSingle-ended 50 Ω interface enabled by internal balun; no external matching required.
IF_OUTP / IF_OUTN (Pins 31–32)Differential IF outputOpen-collector outputs compatible with 200 Ω differential filters or ADC inputs.
I_PINDRV1 / I_PINDRV2 (Pins 43–44)DAC current outputsPMOS open-drain outputs driving external PIN diode attenuators for dynamic gain control.
REF_CLK (Pin 23)Reference clock inputAccepts CMOS-level reference; supports programmable division for flexible LO synthesis.
LOCK_DET (Pin 22)Digital lock indicatorCMOS output asserts high when PLL achieves phase lock - used for system synchronization.
SCL/CLK & SDA/DATA (Pins 27–28)I²C/SPI shared bus linesConfigurable via DBUS_SEL (Pin 25); support fast-mode I²C (400 kHz) and SPI (20 MHz).
VDD_DAC, VDD_VCO, VDD_IFAMP (Pins 1, 4, 33)Analog supply railsSeparate 3.3 V domains isolate noise-sensitive blocks (DAC, VCO, IF amp) for optimal performance.
OUTBUFP / OUTBUFN (Pins 16–17)Differential LO buffer outputOpen-collector outputs drive external mixers or LO distribution networks at 3.3 V logic level.

Key Features

FeatureDesign Value
Integrated RF balun with internal matchingEnables direct 50 Ω single-ended RF input without external components, reducing BOM count and layout area.
Dual auto-calibrating VCOs (LOA/LOB)Eliminates factory trimming and temperature drift compensation, ensuring stable LO generation across −40 to +85 °C.
Embedded dual-output current DACProvides two independent, digitally programmable current sources (I_PINDRV1/I_PINDRV2) for precise analog attenuation control.
Dual digital interface (SPI + I²C)Supports flexible host controller integration: SPI for high-speed configuration, I²C for compact wiring and multi-device addressing (3-bit address).
Mute-until-lock functionAutomatically silences RF path until PLL lock is confirmed, preventing spurious transmission during frequency settling.
Process technologyManufactured in ST's 0.35 µm SiGe BICMOS process - optimized for high-frequency linearity, low noise, and integration density.

Applications

Cellular Base Station ReceiverDigital Pre-Distortion (DPD) Loop

Use Scenario: Down-conversion of 2.6 GHz LTE signals to 150 MHz IF for digitization in macrocell BTS.

IC Role / Device Role / Timing Role: Primary RF-to-IF down converter with integrated LO synthesis and gain control.

Use Value: Replaces discrete mixer + VCO + PLL + DAC solution, cutting PCB area by >40% and improving amplitude/phase tracking between paths.

Use Scenario: Feedback path in DPD-enabled remote radio head (RRH), capturing PA output for real-time correction.

IC Role / Device Role / Timing Role: High-linearity IF sampling front-end with calibrated LO and mute-until-lock for clean capture window alignment.

Use Value: +25 dBm IIP3 ensures accurate capture of distortion products; 150 µs lock time synchronizes with TDD frame boundaries.

Multi-Band Small Cell TransceiverWireless Backhaul IF Stage

Use Scenario: Dual-LO diversity receiver supporting simultaneous 2.3 GHz and 2.6 GHz band operation in pico/femtocell units.

IC Role / Device Role / Timing Role: Diversity mode down converter with independent LOA/LOB selection and automatic calibration per path.

Use Value: Eliminates need for two separate converters; integrated VCO calibration maintains path-to-path LO coherence within ±50 kHz.

Use Scenario: IF conditioning stage in point-to-point microwave backhaul operating at 320 MHz IF.

IC Role / Device Role / Timing Role: IF amplifier and LO driver with 70–400 MHz bandwidth and open-collector 200 Ω output drive.

Use Value: 8 dB conversion gain and 10.5 dB NF preserve SNR over long IF traces; differential outputs suppress common-mode noise on PCB.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF down converter with integrated synthesizer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ADRF6612ACPZ-R7Higher IF bandwidth (10–450 MHz), lower NF (9.5 dB), but no integrated DAC for PIN diode control.Requires external DAC + driver for gain control; better suited for wideband IF sampling than DPD feedback.Select when wider IF range or lower noise dominates over integrated attenuation capability.
MAX2112ETX+Fixed 2.1 GHz LO range, no dual-VCO architecture, lacks I²C interface (SPI only), smaller 32-pin QFN package.Limited to narrowband fixed-frequency applications; not suitable for multi-band cellular infrastructure.Choose only for cost-sensitive, single-band designs where LO flexibility and digital bus redundancy are unnecessary.

Compared with ADRF6612ACPZ-R7 and MAX2112ETX+, the STW82103BTR uniquely combines dual auto-calibrating VCOs, integrated DAC-driven attenuation, and dual-bus configurability - making it the only option qualified for cellular infrastructure diversity receivers requiring simultaneous band agility and closed-loop linearization.

Availability

STW82103BTR is available at Aetrix Electronics and suitable for cellular infrastructure equipment, digital pre-distortion (DPD) feedback loops, small cell transceivers, and wireless backhaul IF stages requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for STW82103BTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader specializing in automotive, industrial, and communications ICs, with deep expertise in RF and SiGe process technologies.

The STW82103BTR belongs to ST's high-performance RF front-end product line, engineered specifically for cellular infrastructure applications demanding high linearity, integrated LO synthesis, and digital calibration - targeting macrocell, small cell, and active antenna systems.

FAQ

What are the supported supply voltages for analog and digital domains?

The STW82103BTR requires two analog supplies: AVCC1 = 3.3 V (±4.5%) for DAC, VCO, IF amplifier, and PLL analog blocks; AVCC2 = 5 V (±5%) for mixer driver and RF ESD protection. The digital domain uses DVCC = 3.3 V (±4.5%) for I²C/SPI interface and control logic. All supplies must be independently decoupled per datasheet layout guidelines.

How does the dual-VCO architecture support diversity receiver operation?

The STW82103BTR implements two independent VCOs (LOA: 2200–2550 MHz, LOB: 2500–3000 MHz) with automatic center-frequency calibration. In diversity mode, one VCO serves the master path and the other the slave path, enabling simultaneous reception on different frequencies or bands - critical for MIMO and carrier aggregation without external LO routing.

Can the STW82103BTR operate without external loop filter components?

No. The STW82103BTR requires an external passive loop filter between ICP (Pin 19) and VCTRL (Pin 18) to stabilize the PLL. The filter topology (typically third-order passive) and component values depend on desired loop bandwidth and phase margin; recommended designs are provided in Section 12.2 of the datasheet (Doc ID 018517 Rev 2).

What is the function of the TEST_ALC, TEST1, and TEST2 pins?

TEST_ALC (Pin 36), TEST1 (Pin 35), and TEST2 (Pin 34) are dedicated test-only pins intended for factory calibration and wafer-level characterization. They must be connected to GND in all production designs. These pins have no functional role in normal operation and are not electrically connected to internal signal paths during active use.

STW82103BTR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
44-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
RF Type:
General Purpose
Frequency:
2.3GHz ~ 2.7GHz
Number of Mixers:
1
Gain:
8.5dB
Noise Figure:
10.5dB
Secondary Attributes:
Down Converter
Current - Supply:
160mA
Voltage - Supply:
3V ~ 5V
Mounting Type:
Surface Mount
Supplier Device Package:
44-VFQFPN (7x7)

STW82103BTR FAQ

1.How can I place an order for STW82103BTR through Aetrix?

Please submit a Request for Quotation (RFQ) for STW82103BTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STW82103BTR reliable?

The price and inventory of STW82103BTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STW82103BTR is usually 5 days.

3.What payment methods are accepted for STW82103BTR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STW82103BTR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STW82103BTR?

STW82103BTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STW82103BTR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STW82103BTR?

For technical support, including STW82103BTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STW82103BTR requirements.

6.How does Aetrix verify that STW82103BTR is sourced from the original manufacturer or authorized distributors?

All STW82103BTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STW82103BTR meets industry standards.

7.What is the process for return or replacement of STW82103BTR?

All STW82103BTR units undergo pre-shipment inspection (PSI). If there is an issue with STW82103BTR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STW82103BTR part is unused and in its original packaging.

Return procedure for STW82103BTR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STW82103BTR Tags

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