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Microchip Technology T7024-PGQM 80
- Part No.:
- T7024-PGQM 80
- Manufacturer:
- Microchip Technology
- Category:
- RF Front End (LNA + PA)
- Package:
- 20-VQFN Exposed Pad
- Datasheet:
-
T7024-PGQM 80.pdf
- Description:
- BLUETOOTH FE 2.4GHZ 20QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,861
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Product details
Overview
T7024-PGQM 80 from Atmel (now Microchip) is a monolithic SiGe 2.4–2.5 GHz Bluetooth™/ISM front-end IC integrating power amplifier, low-noise amplifier, and T/R switch driver in a single QFN20 package. It delivers 23 dBm saturated output power with 35% power-added efficiency, 16 dB LNA gain, and 2.1 dB noise figure (QFN20), enabling compact, high-performance transceivers for TDMA wireless systems.
For engineers reviewing the T7024-PGQM 80 datasheet, T7024-PGQM 80 pinout, T7024-PGQM 80 application, or T7024-PGQM 80 equivalent, this device supports ramp-controlled TX power, biasing for external PIN diode T/R switches, standby current as low as 10 µA, and operates from a single 3-V supply - critical for battery-powered Bluetooth Class 2/3 modules and ISM-band IoT endpoints.
Technical Context
The T7024-PGQM 80 implements a fully integrated transmit/receive front-end architecture: its PA provides 30 dB typical gain and 23 dBm Psat with ramp-voltage-controlled output power (0.1–1.75 V), while the LNA delivers 16 dB gain and 2.1 dB NF at 2.4 GHz with adjustable gain via RX_ON voltage. The on-chip T/R switch driver supplies programmable current (up to 19 mA) to external PIN diodes using R_SWITCH and SWITCH_OUT pins.
Control logic decodes PU, RX_ON, and RAMP inputs to configure five operational modes including TX, RX, standby, and specialized combinations. All supply rails (V1_PA, V2_PA, V3_PA_OUT, VS_LNA) are independently routed for optimal RF isolation, and thermal resistance is 27 K/W (QFN20, slug soldered), supporting continuous-duty operation up to +85°C ambient.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2.4–2.5 GHz - matches Bluetooth Classic and 2.4 GHz ISM band requirements without external frequency tuning. |
| Saturation Output Power | 23 dBm (typ.) - enables Class 2 Bluetooth range (~10 m) with margin for PCB losses and antenna mismatch. |
| Power-Added Efficiency | 35% (QFN20, typ.) - reduces thermal load and extends battery life in portable 3-V systems. |
| LNA Noise Figure | 2.1 dB (QFN20, typ.) - preserves receiver sensitivity in low-SNR environments like crowded 2.4 GHz bands. |
| Supply Current (TX) | 165 mA (QFN20, typ., 3 V) - defines DC power budget for RF section during active transmission. |
| Standby Current | 10 µA - allows ultra-low-power sleep states between packet bursts in duty-cycled protocols. |
| Ramp Control Voltage Range | 0.1 V to 1.75 V - enables precise, linear output power adjustment (60 dB control range) for EIRP compliance. |
Pinout & Package
Package: QFN20 (5 mm × 5 mm, 0.5 mm pitch, exposed thermal slug). Pin assignment conforms to Figure 3 and Pin Description Table (QFN20 column) in datasheet 4533F–BLURF–09/04.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LNA_IN | LNA RF input | Connects to antenna or bandpass filter; requires 50 Ω matching network per Figure 25. |
| VS_LNA | LNA supply voltage | 2.7–5.5 V rail; decoupled with 1.8 pF capacitor (Figure 29); powers LNA and control logic. |
| RAMP | PA gain control input | Analog voltage (0.1–1.75 V) sets PA output power level; drives internal current source for linear ramping. |
| V1_PA / V2_PA / V3_PA_OUT | PA supply and output matching nodes | V1/V2: inductor-coupled bias rails; V3: PA RF output node requiring external matching to 50 Ω (VSWR < 1.5:1). |
| SWITCH_OUT / R_SWITCH | T/R switch driver output & current programming | SWITCH_OUT sinks current programmed by resistor from R_SWITCH to GND (1–19 mA range, Figure 7). |
| PU / RX_ON | Power-up and receive enable | Active-high digital controls: PU enables chip; RX_ON = high activates LNA and disables T/R switch driver in RX mode. |
Key Features
| Feature | Design Value |
|---|---|
| Ramp-controlled PA output | Enables precise EIRP regulation across temperature and voltage variation without digital feedback loop or DAC. |
| Integrated T/R switch driver | Eliminates need for discrete transistor driver stage; supports wide-range PIN diode current (1–19 mA) via single external resistor. |
| Low-quiescent-current standby | 10 µA shutdown current allows seamless integration into low-duty-cycle Bluetooth packet protocols. |
| Single 3-V supply operation | Reduces BOM count by consolidating all analog and RF sections onto one regulated rail - no separate LNA/PA supplies required. |
| SiGe process performance | Delivers 2.1 dB NF and 35% PAE simultaneously - unattainable with standard CMOS at 2.4 GHz. |
Applications
| Bluetooth Headset Transceiver | Wireless Keyboard/Mouse RF Module |
|---|---|
|
Use Scenario: Compact, battery-powered audio peripheral transmitting voice packets and receiving control ACKs in 2.4 GHz ISM band. IC Role / Device Role / Timing Role: Front-end transceiver handling full TX/RX signal chain - PA amplifies BT baseband-modulated RF, LNA recovers weak ACK signals, T/R driver toggles antenna path. Use Value: 23 dBm Psat ensures reliable link margin over 10 m; 2.1 dB NF maintains SNR > 25 dB at -85 dBm RSSI; 10 µA standby extends coin-cell life beyond 6 months. |
Use Scenario: Ultra-low-power human interface device operating in burst-mode with <1% duty cycle and strict EMI limits. IC Role / Device Role / Timing Role: Integrated RF front-end providing ramp-controlled TX power for FCC/ETSI-compliant emissions and fast LNA turn-on for low-latency RX response. Use Value: RAMP pin enables dynamic power scaling to meet −30 dBc harmonic limits; 165 mA TX current aligns with CR2032 pulse-load capability; QFN20 footprint minimizes PCB area. |
| Industrial Sensor Beacon | Smart Home Zigbee-Compatible Node |
|
Use Scenario: Temperature/humidity sensor node reporting every 30 s in harsh factory environments with metal enclosures and RF interference. IC Role / Device Role / Timing Role: Robust 2.4 GHz front-end delivering stable output power despite supply droop and thermal drift, with LNA rejecting out-of-band interferers. Use Value: 35% PAE reduces self-heating under continuous TX test mode; 27 K/W thermal resistance sustains operation at +85°C; VSWR < 1.5:1 tolerance accommodates antenna detuning on metal surfaces. |
Use Scenario: Mesh-networked lighting controller requiring interoperability with Zigbee 3.0 PHY layer and coexistence with Wi-Fi/BT traffic. IC Role / Device Role / Timing Role: High-linearity front-end supporting OQPSK modulation with −30 dBc 2nd/3rd harmonics and IIP3 = −14 dBm for adjacent-channel rejection. Use Value: −14 dBm IIP3 prevents intermodulation distortion in dense 2.4 GHz deployments; 60 dB PA gain-control range enables adaptive power backoff near APs; QFN20 Pb-free/halogen-free compliance meets RoHS/REACH. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 2.4 GHz front-end applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RFM831B (Semtech) | Integrated crystal oscillator, lower PAE (28%), no ramp control - uses digital SPI for power setting. | Targets simpler star-topology remotes; lacks analog ramp for smooth EIRP sweep needed in certified BT designs. | Choose when system-level MCU handles closed-loop power calibration and board space permits larger SOIC package. |
| SKY65165-363LF (Skyworks) | Higher Psat (25 dBm), 3.3 V only, no LNA - requires external LNA and switch; 16-pin QFN. | Used in higher-power access points; not a drop-in replacement due to missing LNA and different pinout/control scheme. | Choose when TX power priority outweighs integration - e.g., hub devices needing extended range with external LNA optimization. |
Compared with RFM831B, T7024-PGQM 80 offers superior noise figure and analog ramp control for regulatory compliance; versus SKY65165-363LF, it trades raw PA output for full front-end integration and lower system-level BOM count - ideal for space-constrained, battery-operated endpoints.
Availability
T7024-PGQM 80 is available at Aetrix Electronics and suitable for Bluetooth headsets, wireless peripherals, industrial beacons, and smart home nodes requiring stable component supply, Pb-free/halogen-free compliance, and QFN20 thermal performance.
Supply support for T7024-PGQM 80 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology (formerly Atmel) is a global semiconductor provider specializing in microcontrollers, analog, and RF solutions for industrial, automotive, and consumer markets.
The T7024 product line was designed specifically for highly integrated, low-power 2.4 GHz TDMA front-ends - targeting Bluetooth and ISM-band applications where size, efficiency, and regulatory-ready RF performance are critical.
FAQ
What is the maximum allowable supply voltage for T7024-PGQM 80?
The absolute maximum supply voltage for pins V1_PA, V2_PA, and V3_PA_OUT is 6 V, but the recommended operating range is 2.7–4.6 V. For VS_LNA, the max is 5.5 V with recommended range 2.7–5.5 V. Exceeding these limits risks permanent damage per Absolute Maximum Ratings table in datasheet 4533F–BLURF–09/04. Always operate T7024-PGQM 80 within its specified 3.0 V nominal supply for optimal PAE and reliability.
Does T7024-PGQM 80 support Bluetooth 5.x PHY layers?
T7024-PGQM 80 supports the 2.4 GHz ISM band and was characterized for Bluetooth Classic (v1.2–v4.2) TDMA operation. While its 2.4–2.5 GHz frequency range overlaps Bluetooth 5.x, it does not implement LE Coded PHY or LE 2M PHY features - those require baseband-level support outside the scope of T7024-PGQM 80. The IC remains compatible with Bluetooth 5.x controllers when used in legacy BR/EDR mode, as confirmed in the device description and operating range specifications.
How is thermal management implemented for T7024-PGQM 80 in QFN20 package?
T7024-PGQM 80 uses an exposed thermal slug on the QFN20 bottom surface, requiring direct soldering to a large copper pour on the PCB. Datasheet-recommended land pattern (Figure 30) specifies a 3.1 mm × 3.1 mm slug pad with eight 1 mm vias spaced 1.6 mm apart. This achieves 27 K/W junction-to-ambient thermal resistance when properly implemented - critical for sustaining 165 mA TX current at +85°C ambient. Thermal design must avoid covering the slug with solder mask.
Can T7024-PGQM 80 operate without an external PIN diode?
No - T7024-PGQM 80 requires an external PIN diode for antenna switching. Its SWITCH_OUT and R_SWITCH pins are designed to bias and drive such a diode; the IC itself contains no integrated RF switch. The block diagram (Figure 1) and Pin Description confirm SWITCH_OUT is a current-sinking output, not a solid-state switch. Omitting the PIN diode leaves the antenna path undefined, preventing functional TX/RX isolation. Reference Figure 28 and Figure 29 for typical external diode implementation.
What is the function of the PU and RX_ON pins on T7024-PGQM 80?
PU (Power-Up) is an active-high enable that powers up the entire IC - when low, T7024-PGQM 80 enters standby mode drawing only 10 µA. RX_ON is a separate active-high control that enables the LNA and configures the T/R switch driver for receive mode. Both pins are CMOS-compatible (ViH ≥ 2.4 V, ViL ≤ 0.5 V) and must be driven synchronously with system timing to avoid undefined states. Their combined logic defines operational mode per Table on page 5 of datasheet 4533F–BLURF–09/04.
T7024-PGQM 80 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- Bluetooth, TDMA, WDCT
- Frequency:
- 2.4GHz ~ 2.5GHz
- Features:
- -
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 20-QFN (5x5)
T7024-PGQM 80 FAQ
1.How can I place an order for T7024-PGQM 80 through Aetrix?
Please submit a Request for Quotation (RFQ) for T7024-PGQM 80 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for T7024-PGQM 80 reliable?
The price and inventory of T7024-PGQM 80 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for T7024-PGQM 80 is usually 5 days.
3.What payment methods are accepted for T7024-PGQM 80?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for T7024-PGQM 80 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for T7024-PGQM 80?
T7024-PGQM 80 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your T7024-PGQM 80 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for T7024-PGQM 80?
For technical support, including T7024-PGQM 80 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your T7024-PGQM 80 requirements.
6.How does Aetrix verify that T7024-PGQM 80 is sourced from the original manufacturer or authorized distributors?
All T7024-PGQM 80 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that T7024-PGQM 80 meets industry standards.
7.What is the process for return or replacement of T7024-PGQM 80?
All T7024-PGQM 80 units undergo pre-shipment inspection (PSI). If there is an issue with T7024-PGQM 80, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The T7024-PGQM 80 part is unused and in its original packaging.
Return procedure for T7024-PGQM 80:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
T7024-PGQM 80 Tags
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