Microchip Technology TC1303C-RD1EMF

Overview

TC1303C-RD1EMF from Microchip Technology is a dual-output power management IC integrating a 500 mA synchronous buck regulator and a 300 mA low-dropout linear regulator (LDO), with power-good monitoring of both outputs. It delivers 1.8 V @ 500 mA (buck) and 3.3 V @ 300 mA (LDO) from a 2.7–5.5 V input, features 2.0 MHz fixed-frequency PWM operation, 65 µA typical quiescent current, and operates across –40°C to +125°C junction temperature - used in portable medical instruments and USB-powered devices.

For engineers reviewing the TC1303C-RD1EMF datasheet, TC1303C-RD1EMF pinout, TC1303C-RD1EMF application, or TC1303C-RD1EMF equivalent, key selection criteria include independent shutdown control for each regulator, 300 ms power-good delay for processor reset coordination, adjustable or fixed-output configurations, and compatibility with 10-pin DFN/MSOP packages requiring minimal external components (e.g., single 1 µF ceramic capacitor on LDO output).

Technical Context

The TC1303C-RD1EMF implements a synchronous buck stage with PFM/PWM auto-transition at light loads and an internally compensated LDO stage - both regulated independently. Its power-good (PG) circuit monitors *both* VOUT1 and VOUT2 simultaneously with 94% threshold high and 89% threshold low, generating an open-drain output with 300 ms active delay.

It integrates undervoltage lockout (UVLO = 2.55 V nominal), thermal shutdown (165°C), overcurrent protection on both outputs, and uses separate SHDN1 (buck) and SHDN2 (LDO) logic inputs with 45%/15% VIN hysteresis. The buck stage employs integrated 450 mΩ P- and N-channel MOSFETs switching at 2.0 MHz ±20%.

Key Specifications

Pinout & Package

TC1303C-RD1EMF is housed in a 10-pin 3×3 mm DFN package with exposed thermal pad (EP) connected to AGND. Pin numbering follows standard DFN layout (pin 1 top-left, counterclockwise); EP is pin 11 and must be soldered to AGND plane for thermal performance and electrical stability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output PMIC applications.

Compared with TC1303B-RD1EMF, TC1303C-RD1EMF adds critical dual-rail PG monitoring for safety-critical boot sequences; versus TPS65023RGZR, it offers smaller size, lower IQ, and simpler layout - ideal for space-constrained dual-rail applications.

Availability

TC1303C-RD1EMF is available at Aetrix Electronics and suitable for portable medical instruments, USB-powered test equipment, and industrial handheld terminals requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for TC1303C-RD1EMF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a leading provider of microcontrollers, analog, and Flash-IP solutions, serving industrial, automotive, consumer, and communications markets with vertically integrated silicon and software.

The TC1303 family was designed specifically for space- and power-constrained portable electronics requiring tightly regulated dual supplies with minimal external components and robust fault protection.

FAQ

What output voltages does the TC1303C-RD1EMF provide?

The TC1303C-RD1EMF provides a fixed 1.8 V output from its synchronous buck regulator (VOUT1) and a fixed 3.3 V output from its low-dropout linear regulator (VOUT2), as indicated by the "RD1" suffix in the part number. Both outputs are factory-set and require no external feedback resistors - simplifying PCB layout and reducing bill-of-materials count.

Does the TC1303C-RD1EMF support independent enable control for each regulator?

Yes, the TC1303C-RD1EMF features two independent shutdown inputs: SHDN1 controls the buck regulator and SHDN2 controls the LDO. Each accepts active-high logic signals (>45% VIN) and can be driven separately - enabling flexible power sequencing, dynamic rail gating, and low-power sleep modes in battery-operated systems using TC1303C-RD1EMF.

How does the power-good (PG) function operate on the TC1303C-RD1EMF?

The TC1303C-RD1EMF's PG pin is an open-drain output that asserts low only when *both* VOUT1 and VOUT2 are within 94–96% of their nominal values. It includes a 300 ms delay after regulation is achieved before going high - providing reliable processor reset timing. This dual-rail monitoring distinguishes TC1303C-RD1EMF from TC1303A/B variants.

What package type and thermal considerations apply to the TC1303C-RD1EMF?

The TC1303C-RD1EMF is supplied in a 10-pin 3×3 mm DFN package with exposed thermal pad (EP). The EP must be soldered to an AGND copper pour with ≥4 thermal vias to maintain junction temperature within –40°C to +125°C limits. Thermal resistance θJA is 41°C/W on a 4-layer board - critical for sustained 500 mA buck operation.

Can the TC1303C-RD1EMF operate from a single 3.7 V Li-ion cell?

Yes, the TC1303C-RD1EMF supports input voltages from 2.7 V to 5.5 V, making it fully compatible with single-cell Li-ion (3.0–4.2 V) and Li-polymer batteries. Its 137 mV LDO dropout and 280 mV buck dropout at full load ensure stable 1.8 V/3.3 V outputs even as the battery discharges to 3.43 V - maximizing usable battery capacity in devices using TC1303C-RD1EMF.