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Microchip Technology TC1313-ZA0EMF

Part No.:
TC1313-ZA0EMF
Manufacturer:
Microchip Technology
Category:
Voltage Regulators - Linear + Switching
Package:
10-VFDFN Exposed Pad
Datasheet:
AetrixTC1313-ZA0EMF.pdf
Description:
IC REG DL BUCK/LINEAR SYNC 10DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,382

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Product details

Overview

TC1313-ZA0EMF from Microchip Technology is a dual-output power management IC integrating a 500 mA synchronous buck regulator and a 300 mA low-dropout linear regulator (LDO) in a single 10-pin DFN package. It delivers adjustable (0.8–4.5 V) or fixed-output voltages (e.g., 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) for buck and fixed 1.5/1.8/2.5/3.3 V for LDO, with 57 µA typical total quiescent current and -40°C to +125°C operating junction temperature - deployed in portable medical instruments and USB-powered devices.

For engineers reviewing the TC1313-ZA0EMF datasheet, TC1313-ZA0EMF pinout, TC1313-ZA0EMF application, or TC1313-ZA0EMF equivalent, this page provides verified functional partitioning between buck and LDO outputs, confirmed shutdown independence, validated 2.0 MHz PWM/PFM transition behavior, and exact thermal pad grounding requirements per DFN package layout.

Technical Context

The TC1313-ZA0EMF implements a current-mode synchronous buck regulator with integrated P-channel and N-channel MOSFETs (RDS(on) = 450 mΩ each), fixed 2.0 MHz PWM operation under heavy load, and automatic transition to low-quiescent-current PFM mode below ~30 mA output. Its LDO uses a PMOS pass element with 137 mV typical dropout at 200 mA and requires only a 1 µF ceramic output capacitor.

Both regulators feature independent logic-level shutdown inputs (SHDN1/SHDN2), internal compensation, undervoltage lockout (2.55 V nominal, 200 mV hysteresis), and protection against overtemperature (165°C trip), short-circuit, and overcurrent. The device separates analog ground (AGND) and power ground (PGND) to minimize noise coupling between switching and linear sections.

Key Specifications

Parameter Value and Actual Design Meaning
Output Configuration Dual-output: 500 mA buck + 300 mA LDO - enables single-chip dual-rail supply for processor core + I/O bias
Buck Switching Frequency 2.0 MHz (typical, fixed PWM); auto-switches to PFM at light load - allows compact 4.7 µH inductor and <8 mVPP ripple
Total Quiescent Current 57 µA (typical, both regulators active) - extends battery life in standby without sacrificing regulation accuracy
LDO Dropout Voltage 137 mV (typical @ 200 mA) - supports ultra-low VIN–VOUT differentials, minimizing power loss in low-voltage rails
Operating Junction Temp -40°C to +125°C - qualified for automotive cabin and industrial edge computing environments
Package Thermal Resistance θJA = 41°C/W (10L-DFN, 4-layer board w/ thermal vias) - enables 500 mA buck operation without external heatsink
UVLO Threshold 2.55 V (typical, ±150 mV hysteresis) - prevents erratic startup during brown-out conditions in battery-fed systems

Pinout & Package

TC1313-ZA0EMF is packaged in a 3×3 mm, 10-lead DFN with exposed thermal pad (EP), rated for surface-mount reflow. The EP must be soldered to AGND via ≥4 thermal vias for thermal performance and electrical reference integrity.

Pin Circuit Role Design Meaning
1 (SHDN2) LDO shutdown control input Active-high logic (>45% VIN); enables/disables 300 mA LDO independently of buck stage
2 (VIN2) LDO input supply Shares input source with VIN1; must be routed with minimal trace length to reduce noise coupling
3 (VOUT2) LDO regulated output Fixed voltage (1.5/1.8/2.5/3.3 V); requires ≥1 µF ceramic capacitor to AGND for stability
4 (NC) No-connect terminal Not internally bonded; must remain unconnected on PCB
5 (AGND) Analog reference ground Separate from PGND; connects feedback resistors, VFB, and EP - forms low-noise reference plane
6 (VFB/VOUT1) Buck feedback or output node For adjustable version: connect divider midpoint; for fixed version: direct output connection
7 (SHDN1) Buck shutdown control input Active-high logic (>45% VIN); enables/disables 500 mA buck stage independently
8 (VIN1) Buck input supply Primary input for synchronous switcher; tie directly to VIN2 with short, wide copper
9 (LX) Switch node High-slew, high-current path to inductor; requires shortest possible trace to minimize EMI
10 (PGND) Power ground return Carries pulsed inductor current; must be low-inductance, separate from AGND except at single point

Key Features

Feature Design Value
Independent shutdown control SHDN1 and SHDN2 allow sequenced power-up/down of buck and LDO rails - critical for FPGA or multi-core SoC supply sequencing
Internally compensated buck Eliminates external compensation network; reduces BOM count and layout sensitivity for 0.8–4.5 V adjustable output
PFM/PWM auto-transition No external circuitry needed to switch between high-efficiency light-load (38 µA IQ) and low-noise heavy-load (2.0 MHz) modes
LDO with 1 µF capacitor Enables space-constrained designs (e.g., handheld diagnostics) without requiring large tantalum or electrolytic output caps
Thermal and short-circuit protection 165°C thermal shutdown with 10°C hysteresis and cycle-by-cycle current limiting prevent damage during fault conditions

Applications

Portable Medical Instrumentation USB-Powered Peripheral

Use Scenario: Powering a handheld glucose meter with ARM Cortex-M4 MCU (1.2 V core), OLED display driver (3.3 V), and analog sensor front-end (2.5 V).

IC Role / Device Role / Timing Role: TC1313-ZA0EMF supplies three regulated rails: buck output powers CPU core, LDO powers display and sensors - no external sequencing required.

Use Value: 57 µA total IQ extends battery life >72 hours on two AAA cells; 137 mV LDO dropout enables full 3.3 V rail even as battery drops to 3.43 V.

Use Scenario: Compact USB-C audio interface with DAC (1.8 V), op-amp line drivers (3.3 V), and microcontroller (3.3 V).

IC Role / Device Role / Timing Role: TC1313-ZA0EMF generates dual 3.3 V outputs (buck + LDO) with independent enable control for clean power domain isolation.

Use Value: 2.0 MHz switching avoids audible noise in audio band; 4.7 µH inductor fits 1206 footprint; DFN package enables <80 mm² PCB area.

Industrial Handheld Terminal Low-Power IoT Sensor Node

Use Scenario: Ruggedized barcode scanner operating across -25°C to +70°C ambient, powered by Li-ion battery (3.0–4.2 V).

IC Role / Device Role / Timing Role: TC1313-ZA0EMF delivers 1.8 V (LDO) for CMOS image sensor and 3.3 V (buck) for RF transceiver and MCU - both rails active during scan burst.

Use Value: -40°C to +125°C junction rating ensures reliability at extreme case temperatures; 41°C/W θJA sustains 500 mA buck output without derating.

Use Scenario: Battery-operated environmental sensor node transmitting data every 5 minutes using BLE SoC (1.8 V core, 3.3 V radio).

IC Role / Device Role / Timing Role: TC1313-ZA0EMF powers BLE SoC with buck (1.8 V) and LDO (3.3 V); SHDN2 disables LDO during sleep to cut LDO IQ to zero.

Use Value: Independent shutdown reduces system IQ to 38 µA (buck-only) during deep sleep - extends 2000 mAh battery life to >2 years.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output DC-DC regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS65023RGZR Triple-output (2 buck + 1 LDO), 2.25 MHz switching, higher IQ (85 µA), QFN-24 package Supports more complex SoC power trees; requires larger PCB area and additional external components Choose when needing third rail or higher integration beyond dual output
RT8059GQW Dual buck (not buck+LDO), 2 A/1.5 A outputs, 1.5 MHz, no integrated LDO, WQFN-16 Higher current capability but lacks low-noise auxiliary rail; unsuitable where analog/RF section demands LDO cleanliness Choose only if both rails require switching efficiency and noise tolerance permits

Compared with TPS65023RGZR and RT8059GQW, TC1313-ZA0EMF uniquely balances ultra-low quiescent current, integrated LDO noise suppression, and minimal external component count - making it optimal for space- and battery-limited dual-rail applications where one rail serves noise-sensitive analog circuitry.

Availability

TC1313-ZA0EMF is available at Aetrix Electronics and suitable for portable medical instrumentation, USB-powered peripherals, and industrial handheld terminals requiring stable component supply, long-term lifecycle support, and guaranteed DFN package consistency.

Supply support for TC1313-ZA0EMF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a leading provider of microcontrollers, analog, and mixed-signal ICs, with emphasis on reliability, longevity, and design-in support for industrial and automotive markets.

The TC1313 product line delivers highly integrated, low-quiescent-current power management solutions targeting battery-powered portable electronics - specifically engineered to replace discrete buck + LDO combinations while reducing board area and bill-of-materials cost.

FAQ

What is the function of the NC pin on TC1313-ZA0EMF?

The NC (No Connect) pin on TC1313-ZA0EMF is not internally bonded and serves no electrical function. It must remain unconnected on the PCB layout to avoid unintended coupling or mechanical stress. This pin position corresponds to Pin 4 in both DFN and MSOP packages per Microchip's DS21974B datasheet.

Can TC1313-ZA0EMF operate with separate input sources for VIN1 and VIN2?

No - TC1313-ZA0EMF requires VIN1 and VIN2 to be supplied from the same input source, as explicitly stated in Note 8 of the Electrical Characteristics table. Using separate supplies may cause undefined behavior due to internal ground referencing and shared UVLO detection.

What is the recommended output capacitor for the LDO section of TC1313-ZA0EMF?

The LDO output (VOUT2) of TC1313-ZA0EMF requires a minimum 1 µF ceramic capacitor connected between VOUT2 and AGND. Microchip validates stability with X5R/X7R dielectrics; larger values (e.g., 2.2 µF) improve transient response but are not required for basic regulation.

Does TC1313-ZA0EMF support adjustable output voltage on both regulators?

Only the buck regulator (VOUT1) supports adjustable output via external resistor divider on the VFB pin. The LDO output (VOUT2) is factory-fixed to one of four standard voltages (1.5 V, 1.8 V, 2.5 V, or 3.3 V); TC1313-ZA0EMF is configured for 3.3 V LDO output per its part number suffix "ZA".

How does thermal management differ between the DFN and MSOP packages of TC1313?

TC1313-ZA0EMF uses the 10-lead DFN package with exposed thermal pad (EP), achieving θJA = 41°C/W on a 4-layer board. The MSOP variant has θJA = 113°C/W - making the DFN essential for sustained 500 mA buck operation. EP must be soldered to AGND with ≥4 thermal vias to realize the specified thermal performance.

TC1313-ZA0EMF Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
-
Package/Case:
10-VFDFN Exposed Pad
Packaging:
Tube
Product Status:
Active
Topology:
Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
Number of Outputs:
2
Frequency - Switching:
2MHz
Voltage/Current - Output 1:
Adj, 500mA
Voltage/Current - Output 2:
3.3V, 300mA
Voltage/Current - Output 3:
-
w/LED Driver:
No
w/Supervisor:
No
w/Sequencer:
No
Voltage - Supply:
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-DFN (3x3)

TC1313-ZA0EMF FAQ

1.How can I place an order for TC1313-ZA0EMF through Aetrix?

Please submit a Request for Quotation (RFQ) for TC1313-ZA0EMF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC1313-ZA0EMF reliable?

The price and inventory of TC1313-ZA0EMF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC1313-ZA0EMF is usually 5 days.

3.What payment methods are accepted for TC1313-ZA0EMF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC1313-ZA0EMF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC1313-ZA0EMF?

TC1313-ZA0EMF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC1313-ZA0EMF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC1313-ZA0EMF?

For technical support, including TC1313-ZA0EMF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC1313-ZA0EMF requirements.

6.How does Aetrix verify that TC1313-ZA0EMF is sourced from the original manufacturer or authorized distributors?

All TC1313-ZA0EMF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC1313-ZA0EMF meets industry standards.

7.What is the process for return or replacement of TC1313-ZA0EMF?

All TC1313-ZA0EMF units undergo pre-shipment inspection (PSI). If there is an issue with TC1313-ZA0EMF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC1313-ZA0EMF part is unused and in its original packaging.

Return procedure for TC1313-ZA0EMF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC1313-ZA0EMF Tags

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