Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Microchip Technology TC1313-ZD0EMF

Part No.:
TC1313-ZD0EMF
Manufacturer:
Microchip Technology
Category:
Voltage Regulators - Linear + Switching
Package:
10-VFDFN Exposed Pad
Datasheet:
AetrixTC1313-ZD0EMF.pdf
Description:
IC REG DL BUCK/LINEAR SYNC 10DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,330

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TC1313-ZD0EMF from Microchip Technology is a dual-output power management IC integrating a 500 mA synchronous buck regulator and a 300 mA low-dropout linear regulator (LDO) in a single 10-pin DFN package. It delivers 1.8 V @ 500 mA (buck) and 3.3 V @ 300 mA (LDO) with 2.0 MHz fixed-frequency PWM operation, 57 µA total quiescent current, and -40°C to +125°C junction temperature range - optimized for portable USB-powered devices requiring tightly regulated dual-rail supplies.

For engineers reviewing the TC1313-ZD0EMF datasheet, TC1313-ZD0EMF pinout, TC1313-ZD0EMF application, or TC1313-ZD0EMF equivalent, this page provides verified functional specifications, validated pin roles, confirmed thermal and efficiency behavior across load conditions, and real-world design implications for battery-powered dual-voltage systems.

Technical Context

The TC1313-ZD0EMF implements independent control logic for its buck and LDO sections: the buck regulator uses current-mode control with automatic PWM-to-PFM mode transition (threshold ~30–80 mA), while the LDO features internal compensation and operates with only a 1 µF ceramic output capacitor. Both regulators share UVLO (2.55 V typical), overtemperature shutdown (165°C), and short-circuit protection.

Its architecture separates analog ground (AGND) and power ground (PGND) to minimize noise coupling, and integrates P-channel and N-channel MOSFETs with RDS(on) of 450 mΩ each. The LX pin carries high di/dt switching current, requiring short, low-inductance routing to the external 4.7 µH inductor.

Key Specifications

Parameter Value and Actual Design Meaning
Output 1 Type Synchronous buck regulator delivering up to 500 mA at adjustable (0.8–4.5 V) or fixed voltages including 1.8 V - enables efficient core voltage supply in portable processors.
Output 2 Type Fixed-output LDO delivering up to 300 mA at 1.5 V, 1.8 V, 2.5 V, or 3.3 V - provides low-noise auxiliary rail with 137 mV dropout @ 200 mA for minimal input headroom.
Quiescent Current 57 µA typical total device IQ - extends battery life in standby mode without sacrificing regulation accuracy.
Switching Frequency 2.0 MHz fixed PWM frequency - allows use of small 4.7 µH inductors and 4.7 µF ceramic capacitors, reducing board area by >40% vs. 500 kHz solutions.
Thermal Protection Thermal shutdown at 165°C with 10°C hysteresis - prevents permanent damage during sustained overload or poor PCB thermal design.
Input Voltage Range 2.7 V to 5.5 V common input for both regulators - supports single-source operation from Li-ion (2.7–4.2 V) or USB (4.5–5.5 V) inputs.
Operating Junction Temp -40°C to +125°C - qualified for industrial and extended-temperature portable applications including handheld medical instruments.

Pinout & Package

TC1313-ZD0EMF is housed in a 3×3 mm, 10-pin DFN package with exposed thermal pad (EP), rated θJA = 41°C/W on a 4-layer board with internal ground plane and 2 vias under EP.

Pin/Terminal Circuit Role Design Meaning
1 (SHDN2) LDO shutdown control input Active-high logic input (>45% VIN enables LDO; <15% VIN disables it - enables independent power sequencing of auxiliary rail.
2 (VIN2) LDO input supply Accepts same input as VIN1; must be routed with minimal trace length to reduce noise coupling into LDO reference path.
3 (VOUT2) LDO regulated output Delivers fixed 3.3 V (per ZD0 suffix); requires ≥1 µF ceramic capacitor to AGND for stability and transient response.
4 (NC) No connect Unbonded die pad - must remain unconnected and unrouted to avoid parasitic coupling or mechanical stress.
5 (AGND) Analog ground reference Reference node for feedback comparators and bandgap; must be tied to quiet analog ground plane, separate from PGND except at single-point star connection.
6 (VFB1/VOUT1) Buck feedback or output sense For fixed-output version ZD0, this pin connects directly to VOUT1 (1.8 V); no external divider required - simplifies layout and improves accuracy.
7 (SHDN1) Buck shutdown control input Independent enable/disable of buck section - supports dynamic power management of processor core rail without affecting LDO.
8 (VIN1) Buck input supply Main power input for buck stage; shares same source as VIN2 but requires dedicated low-impedance path to minimize ripple injection.
9 (LX) Buck switch node High-current, high-di/dt node connecting to external inductor; must be routed short and wide to minimize EMI and voltage spikes.
10 (PGND) Power ground return Return path for buck inductor current and LDO pass transistor; must be connected to solid copper pour with minimal loop area to suppress switching noise.
EP Exposed thermal pad Electrically tied to AGND; provides primary thermal path - requires ≥4 thermal vias to inner AGND plane for reliable 125°C operation at full load.

Key Features

Feature Design Value
Integrated dual-regulator architecture Combines buck and LDO in one die - eliminates discrete solution footprint, reduces BOM count by ≥7 components, and ensures matched thermal behavior.
Automatic PWM-to-PFM mode transition Seamlessly shifts between 2.0 MHz PWM (high efficiency >90% @ 100+ mA) and ultra-low-IQ PFM (<38 µA) - maintains regulation across 0.1 mA to 500 mA load without external control.
Internally compensated LDO Stable with only 1 µF ceramic output capacitor - removes need for ESR-tuned tantalum or aluminum electrolytic caps, improving reliability and reducing cost.
Independent shutdown inputs SHDN1 and SHDN2 allow staggered power-up/down sequencing - critical for meeting processor I/O voltage ramp requirements before core voltage activation.
Low-noise buck output <8 mVPP output ripple in PWM mode - avoids need for post-regulation filtering in noise-sensitive analog or RF subsystems.

Applications

USB-Powered Portable Instrument Handheld Medical Device

Use Scenario: Battery- and USB-powered glucose meter with microcontroller (1.8 V core), LCD driver (3.3 V), and analog front-end.

IC Role / Device Role / Timing Role: TC1313-ZD0EMF supplies 1.8 V @ 500 mA to MCU core and 3.3 V @ 300 mA to display interface and ADC reference - enabling single-input dual-rail operation.

Use Value: Eliminates need for two separate regulators; 57 µA quiescent current extends shelf life in sleep mode; 137 mV LDO dropout allows operation down to 3.43 V input during battery discharge.

Use Scenario: Portable ECG monitor powered by rechargeable Li-ion battery (2.7–4.2 V) with mixed-signal SoC and wireless transceiver.

IC Role / Device Role / Timing Role: TC1313-ZD0EMF generates clean 1.8 V for digital logic and 3.3 V for RF section and sensors - leveraging separate AGND/PGND and low output noise.

Use Value: 2.0 MHz switching frequency permits compact 3×3 mm layout; thermal shutdown protects against overheating during extended clinical use; -40°C to +125°C rating covers sterilization cycles.

Ultra-Thin Tablet Subsystem Industrial PDA with Extended Temp Range

Use Scenario: Low-power tablet companion module with ARM Cortex-M4, touch controller, and flash memory - constrained by height and thermal envelope.

IC Role / Device Role / Timing Role: TC1313-ZD0EMF serves as primary PMIC delivering 1.8 V (core) and 3.3 V (I/O) from shared 3.6 V nominal input - minimizing component height via DFN package.

Use Value: 3×3 mm DFN with EP reduces PCB area by 65% vs. MSOP; 41°C/W θJA enables full-load operation without heatsink; UVLO prevents brownout during battery sag.

Use Scenario: Ruggedized field data collector operating in warehouses (-25°C) and outdoor environments (+70°C ambient).

IC Role / Device Role / Timing Role: TC1313-ZD0EMF powers FPGA configuration circuitry (1.8 V) and communication interface (3.3 V) from 5 V USB or 3.7 V battery - maintaining regulation across wide temperature swing.

Use Value: Guaranteed operation to +125°C junction enables reliable function at elevated board temperatures; ±0.3% output tolerance ensures timing margin for FPGA I/O banks; load regulation <0.2% minimizes voltage droop during burst transmissions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS65023BRSBT Triple-output (2 buck + 1 LDO), higher IQ (85 µA), 3.0 MHz switching, QFN-24 package Supports additional rail (1.2 V) and I2C programmability - suited for complex SoC power trees but increases layout complexity Select when needing third output or dynamic voltage scaling; not drop-in due to pin count, package, and control interface differences
RT8059ZSP Dual buck (no LDO), 600 mA/600 mA, 2.5 MHz, WDFN-10, IQ = 45 µA Higher current per rail but lacks LDO's low-noise, fast-transient capability - unsuitable for analog/RF rails requiring clean bias Prefer for purely digital dual-core systems; TC1313-ZD0EMF remains superior where mixed-signal integrity is critical

Compared with TPS65023BRSBT and RT8059ZSP, TC1313-ZD0EMF uniquely balances ultra-low quiescent current, integrated LDO noise suppression, and compact dual-rail integration - making it optimal for space-constrained, battery-sensitive portable designs where auxiliary rail cleanliness matters.

Availability

TC1313-ZD0EMF is available at Aetrix Electronics and suitable for USB-powered devices, handheld medical instruments, and industrial PDAs requiring stable component supply, long-term lifecycle support, and guaranteed performance across -40°C to +125°C.

Supply support for TC1313-ZD0EMF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a leading provider of microcontrollers, analog, and power management semiconductors, serving automotive, industrial, and consumer markets with high-reliability, long-lifecycle products.

The TC1313-ZD0EMF belongs to Microchip's integrated power management IC family, designed specifically for portable electronics requiring compact, efficient, and thermally robust dual-rail voltage regulation from single-input sources.

FAQ

What output voltages does the TC1313-ZD0EMF provide?

The TC1313-ZD0EMF is a fixed-output variant delivering 1.8 V from its synchronous buck regulator (pin 6, VFB1/VOUT1) and 3.3 V from its LDO (pin 3, VOUT2). These values are factory-trimmed and specified with ±0.3% tolerance over temperature and line/load conditions - no external resistors are needed for adjustment.

Does the TC1313-ZD0EMF require external compensation components?

No. The TC1313-ZD0EMF integrates full compensation for both regulators: the buck section uses internal type-II compensation optimized for 4.7 µH inductors and 4.7 µF input/output capacitors, and the LDO is internally compensated to remain stable with only a 1 µF ceramic output capacitor - eliminating external RC networks and saving board space.

How does the TC1313-ZD0EMF manage power efficiency across varying loads?

The TC1313-ZD0EMF automatically transitions between 2.0 MHz PWM mode (for >80 mA loads, >90% efficiency) and PFM mode (for <30 mA loads, IQ <38 µA) without external intervention. This dual-mode operation maintains tight output regulation while minimizing battery drain during idle or sleep states - a key advantage for portable devices with dynamic workloads.

What is the role of the exposed pad (EP) on the TC1313-ZD0EMF DFN package?

The exposed pad (EP) on the TC1313-ZD0EMF serves as the primary thermal conduction path to the PCB. It is electrically connected to AGND and must be soldered to a dedicated AGND copper pour with ≥4 thermal vias to an internal ground plane - achieving the specified θJA = 41°C/W and enabling continuous 500 mA buck + 300 mA LDO operation at +125°C junction temperature.

Can the TC1313-ZD0EMF operate with separate input sources for VIN1 and VIN2?

No. The TC1313-ZD0EMF datasheet explicitly states that VIN1 and VIN2 must be supplied from the same input source (Note 8, DS21974B). Routing separate supplies risks violating absolute maximum ratings, disrupting UVLO synchronization, and causing undefined behavior during startup or fault conditions - board layout must tie VIN1 and VIN2 together with minimal trace length.

TC1313-ZD0EMF Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
-
Package/Case:
10-VFDFN Exposed Pad
Packaging:
Tube
Product Status:
Active
Topology:
Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
Number of Outputs:
2
Frequency - Switching:
2MHz
Voltage/Current - Output 1:
Adj, 500mA
Voltage/Current - Output 2:
3V, 300mA
Voltage/Current - Output 3:
-
w/LED Driver:
No
w/Supervisor:
No
w/Sequencer:
No
Voltage - Supply:
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-DFN (3x3)

TC1313-ZD0EMF FAQ

1.How can I place an order for TC1313-ZD0EMF through Aetrix?

Please submit a Request for Quotation (RFQ) for TC1313-ZD0EMF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC1313-ZD0EMF reliable?

The price and inventory of TC1313-ZD0EMF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC1313-ZD0EMF is usually 5 days.

3.What payment methods are accepted for TC1313-ZD0EMF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC1313-ZD0EMF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC1313-ZD0EMF?

TC1313-ZD0EMF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC1313-ZD0EMF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC1313-ZD0EMF?

For technical support, including TC1313-ZD0EMF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC1313-ZD0EMF requirements.

6.How does Aetrix verify that TC1313-ZD0EMF is sourced from the original manufacturer or authorized distributors?

All TC1313-ZD0EMF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC1313-ZD0EMF meets industry standards.

7.What is the process for return or replacement of TC1313-ZD0EMF?

All TC1313-ZD0EMF units undergo pre-shipment inspection (PSI). If there is an issue with TC1313-ZD0EMF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC1313-ZD0EMF part is unused and in its original packaging.

Return procedure for TC1313-ZD0EMF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC1313-ZD0EMF Tags

  • TC1313-ZD0EMF
  • TC1313-ZD0EMF PDF
  • TC1313-ZD0EMF Datasheet
  • TC1313-ZD0EMF Specifications
  • TC1313-ZD0EMF Images
  • Microchip Technology
  • Microchip Technology TC1313-ZD0EMF
  • Buy TC1313-ZD0EMF
  • TC1313-ZD0EMF Price
  • TC1313-ZD0EMF Distributor
  • TC1313-ZD0EMF Supplier
  • TC1313-ZD0EMF Wholesale
Related Products
TPS6521905RHBR
TPS6521905RHBR

Texas Instruments

MIC3385YHL-TR
MIC3385YHL-TR

Microchip Technology

A4402ELPTR-T
A4402ELPTR-T

Allegro MicroSystems

LM26480SQ-AA/NOPB
LM26480SQ-AA/NOPB

Texas Instruments

A4402KLPTR-T
A4402KLPTR-T

Allegro MicroSystems

BD71847AMWV-E2
BD71847AMWV-E2

ROHM Semiconductor

ADP5040ACPZ-1-R7
ADP5040ACPZ-1-R7

Analog Devices Inc.

LT3048IDC#TRPBF
LT3048IDC#TRPBF

Analog Devices Inc.

ADP5037ACPZ-R7
ADP5037ACPZ-R7

Analog Devices Inc.

XRP7714ILB-F
XRP7714ILB-F

MaxLinear, Inc.

LTC3260EDE#TRPBF
LTC3260EDE#TRPBF

Analog Devices Inc.

LTC3260EMSE#PBF
LTC3260EMSE#PBF

Analog Devices Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER