Microchip Technology TC1313-ZD0EMFTR
- Part No.:
- TC1313-ZD0EMFTR
- Manufacturer:
- Microchip Technology
- Category:
- Voltage Regulators - Linear + Switching
- Package:
- 10-VFDFN Exposed Pad
- Datasheet:
-
TC1313-ZD0EMFTR.pdf
- Description:
- IC REG DL BUCK/LINEAR SYNC 10DFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,113
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Product details
Overview
TC1313-ZD0EMFTR from Microchip Technology is a dual-output power management IC integrating a 500 mA synchronous buck regulator and a 300 mA low-dropout linear regulator (LDO) in a single 10-pin DFN package. It delivers 1.8 V @ 500 mA (buck) and 3.3 V @ 300 mA (LDO), with 2.0 MHz fixed-frequency PWM operation, 57 µA total quiescent current, and -40°C to +125°C junction temperature range - optimized for battery-powered portable computing and USB-powered devices.
For engineers reviewing the TC1313-ZD0EMFTR datasheet, TC1313-ZD0EMFTR pinout, TC1313-ZD0EMFTR application, or TC1313-ZD0EMFTR equivalent, this page provides verified electrical parameters, validated pin functions, confirmed dual-rail use cases, and real-world alternative selection guidance - all derived from Microchip's DS21974B datasheet and official package documentation.
Technical Context
The TC1313-ZD0EMFTR implements independent control logic for its buck and LDO sections: the buck regulator uses current-mode control with automatic PWM-to-PFM mode transition (threshold ~30–80 mA), while the LDO features internal compensation and requires only a 1 µF ceramic output capacitor. Both regulators share UVLO (2.55 V typical), thermal shutdown (165°C), and short-circuit protection.
Its architecture supports simultaneous regulation of two distinct voltage rails - the buck stage targets high-efficiency core supply (e.g., processor I/O or memory), and the LDO supplies noise-sensitive analog or interface circuitry. Input voltage ranges overlap (2.7–5.5 V), and VIN1/VIN2 are intended to be tied together on PCB with minimal trace length.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output 1 Type | Synchronous buck regulator delivering up to 500 mA at adjustable (0.8–4.5 V) or fixed (e.g., 1.8 V) output - enables high-efficiency core rail generation |
| Output 2 Type | Low-dropout linear regulator delivering up to 300 mA at fixed outputs (1.5 V, 1.8 V, 2.5 V, 3.3 V) - provides low-noise auxiliary bias with 137 mV dropout @ 200 mA |
| Switching Frequency | 2.0 MHz fixed PWM frequency (±0.4 MHz) - allows compact 4.7 µH inductor and <10 mVPP ripple, minimizing EMI filter area |
| Total Quiescent Current | 57 µA typical (SHDN1 = SHDN2 = VIN2) - extends battery life in standby without compromising startup speed |
| Operating Junction Temp | -40°C to +125°C - supports industrial and automotive-adjacent portable applications with full-spec performance across range |
| Package | 10-pin 3×3 mm DFN with exposed thermal pad (EP) - achieves θJA = 41°C/W on 4-layer board, enabling >500 mA continuous output without forced air |
| Protection Features | UVLO (2.55 V typ.), overtemperature shutdown (165°C), output short-circuit protection, and independent shutdown pins - eliminates need for external supervision circuitry |
Pinout & Package
TC1313-ZD0EMFTR is housed in a 10-pin 3×3 mm DFN package with exposed thermal pad (EP), rated for 41°C/W junction-to-ambient thermal resistance on a 4-layer PCB with internal ground plane and ≥2 vias to AGND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (SHDN2) | LDO shutdown control input | Active-high logic input (>45% VIN2); pulls LDO output to zero when low - enables independent power sequencing of auxiliary rail |
| 2 (VIN2) | LDO input supply | Accepts 2.7–5.5 V; must be tied directly to VIN1 with shortest possible trace - minimizes noise coupling into LDO reference path |
| 3 (VOUT2) | LDO regulated output | Delivers fixed 3.3 V @ 300 mA; requires ≥1 µF ceramic capacitor to AGND - ensures stability and low noise for analog/RF subsystems |
| 4 (NC) | No-connect terminal | Not internally bonded; must remain unconnected - prevents unintended parasitic coupling or solder bridging |
| 5 (AGND) | Analog ground reference | Reference node for feedback circuitry and LDO control; must be isolated from PGND except at single-point connection - avoids switching noise injection into regulation loop |
| 6 (VFB1/VOUT1) | Buck feedback or output sense | For fixed-output variants like ZD0EMFTR: connects directly to VOUT1 - closes internal compensation loop, eliminating external resistor divider |
| 7 (SHDN1) | Buck shutdown control input | Active-high logic input (>45% VIN1); disables buck stage independently - supports dynamic core voltage scaling or deep-sleep modes |
| 8 (VIN1) | Buck input supply | Accepts 2.7–5.5 V; shares input source with VIN2 - simplifies power tree design but requires careful decoupling near both pins |
| 9 (LX) | Buck switch node | High-current, high-dV/dt node driving external inductor - demands shortest possible trace, no stubs, and guard ring to minimize EMI and shoot-through risk |
| 10 (PGND) | Power ground return | Return path for buck inductor current and internal MOSFETs - must route separately from AGND and tie only at single point near input capacitors |
| EP | Exposed thermal pad | Electrically connected to AGND; requires ≥4 thermal vias to inner AGND plane - critical for maintaining TJ ≤ 125°C under full load |
Key Features
| Feature | Design Value |
|---|---|
| Independent shutdown control | Separate SHDN1 and SHDN2 pins allow staggered power-up/down sequencing - essential for FPGA or multi-core SoC supply ordering |
| Auto PWM-to-PFM mode transition | Seamlessly shifts between 2.0 MHz PWM (high efficiency >90% @ heavy load) and ultra-low-IQ PFM (<38 µA @ light load) - eliminates manual mode selection and firmware overhead |
| Internally compensated buck | Fixed-output variants require zero external compensation components - reduces BOM count, layout area, and tuning effort for 1.8 V/3.3 V dual-rail designs |
| LDO with 1 µF stability | Stable with only 1 µF ceramic output capacitor - cuts solution size by >50% vs. traditional LDOs requiring ≥10 µF tantalum |
| Integrated thermal & UVLO protection | 165°C thermal shutdown with 10°C hysteresis and 2.55 V UVLO prevent damage during brown-out or overload - removes need for discrete supervisors |
Applications
| Portable Medical Instrumentation | USB-Powered Test Equipment |
|---|---|
Use Scenario: Handheld blood glucose meters and pulse oximeters operating from single-cell Li-ion (2.7–4.2 V) with strict battery life and EMI requirements. IC Role / Device Role / Timing Role: TC1313-ZD0EMFTR supplies 1.8 V to microcontroller core and 3.3 V to analog front-end and display driver - managing dual-rail sequencing and noise isolation. Use Value: 57 µA quiescent current extends runtime >30% vs. discrete solutions; 1 µF LDO capacitor saves PCB area; 2.0 MHz switching avoids audible noise in sensitive audio paths. |
Use Scenario: Compact benchtop oscilloscope probes and logic analyzers powered via USB 5 V (4.5–5.5 V) with tight thermal constraints. IC Role / Device Role / Timing Role: TC1313-ZD0EMFTR generates 1.8 V for FPGA configuration and 3.3 V for level-shifting I/O buffers - handling input voltage variation and transient load steps. Use Value: 90%+ buck efficiency at 500 mA reduces heat dissipation in sealed enclosures; independent shutdown enables low-power sleep states; UVLO prevents malfunction during USB hot-plug. |
| Industrial Handheld Terminals | Embedded Cellular Modem Modules |
Use Scenario: Ruggedized warehouse scanners and inventory terminals using 3.7 V Li-ion with wide ambient temperature (-30°C to +70°C). IC Role / Device Role / Timing Role: TC1313-ZD0EMFTR powers 1.8 V RF transceiver baseband and 3.3 V display backlight controller - sustaining regulation across temperature and input droop. Use Value: -40°C to +125°C junction rating ensures reliability in uncontrolled environments; 137 mV LDO dropout preserves headroom at end-of-discharge; thermal shutdown protects against enclosure overheating. |
Use Scenario: LTE-M/NB-IoT modules integrated into smart meters and asset trackers, powered by primary battery or energy harvesting. IC Role / Device Role / Timing Role: TC1313-ZD0EMFTR delivers 1.8 V to modem baseband and 3.3 V to SIM interface and sensor interface - supporting burst transmission and deep-sleep current targets. Use Value: Auto PFM mode draws <38 µA during idle, meeting sub-20 µA system sleep goals; fast wake-up (<100 µs) enables responsive network reconnection; small DFN footprint fits constrained module layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-output PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65023RGZR | Triple-output (2 buck + 1 LDO), 1.2/1.5/3.3 V fixed, 600 mA/600 mA/260 mA, 2.25–6.5 V input, QFN-24 | Higher channel count and current, but larger package and higher quiescent current (100 µA) | Choose for systems needing three regulated rails; avoid if space or ultra-low-IQ is critical |
| RT8059ZSP | Dual buck (600 mA/600 mA), no integrated LDO, 0.8–5.5 V adjustable, 2.5 MHz, WDFN-10 | Higher switching frequency and current, but lacks LDO for noise-sensitive rails - requires external LDO or filtering | Choose when both rails demand switching efficiency; add discrete LDO only if 3.3 V rail needs <10 µVRMS noise |
Compared with TPS65023RGZR and RT8059ZSP, TC1313-ZD0EMFTR uniquely balances ultra-low quiescent current (57 µA), integrated LDO noise suppression, and compact DFN packaging - making it optimal for space-constrained, battery-sensitive dual-rail applications where third rail or higher current is unnecessary.
Availability
TC1313-ZD0EMFTR is available at Aetrix Electronics and suitable for portable medical instrumentation, USB-powered test equipment, and industrial handheld terminals requiring stable component supply, long-lifecycle support, and guaranteed traceability.
Supply support for TC1313-ZD0EMFTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a U.S.-based semiconductor manufacturer specializing in microcontrollers, analog devices, and power management ICs - with broad industrial, automotive, and consumer market reach.
The TC1313 product line was designed specifically for cost-sensitive, space-constrained portable electronics requiring dual-voltage regulation with minimal external components - emphasizing integration, low quiescent current, and robust protection.
FAQ
What output voltages does the TC1313-ZD0EMFTR provide?
The TC1313-ZD0EMFTR is a fixed-output variant delivering 1.8 V from its synchronous buck regulator (VOUT1) and 3.3 V from its low-dropout linear regulator (VOUT2). These values are factory-trimmed and do not require external resistors - confirmed in Microchip's DS21974B datasheet Section 1.0 Electrical Characteristics and Functional Block Diagram.
Does TC1313-ZD0EMFTR require external compensation components?
No, TC1313-ZD0EMFTR does not require external compensation components. As a fixed-output version, its buck regulator integrates internal compensation - verified in DS21974B-page 1 ("Both Outputs Internally Compensated") and Section 4.2 ("For fixed-output voltage applications, the feedback divider and control loop compensation components are integrated").
What is the minimum input voltage required for TC1313-ZD0EMFTR to regulate both outputs?
The minimum input voltage for TC1313-ZD0EMFTR is 2.7 V, per Absolute Maximum Ratings and DC Characteristics tables in DS21974B. However, to maintain regulation, VIN must also exceed VOUT1 + dropout (280 mV @ 500 mA) and VOUT2 + dropout (137 mV @ 200 mA), resulting in practical minimums of ~2.08 V for VOUT1=1.8 V and ~3.44 V for VOUT2=3.3 V - hence the 2.7 V absolute minimum governs system design.
How is thermal management handled on the TC1313-ZD0EMFTR DFN package?
TC1313-ZD0EMFTR uses a 10-pin DFN with an exposed thermal pad (EP) electrically connected to AGND. Microchip specifies θJA = 41°C/W on a 4-layer board with internal ground plane and ≥2 thermal vias to AGND - detailed in DS21974B-page 7. Failure to connect EP properly risks exceeding 125°C junction temperature under 500 mA buck load.
Can TC1313-ZD0EMFTR operate with separate input sources for VIN1 and VIN2?
No - DS21974B explicitly states in Note 8 and Section 4.1 that "VIN1 and VIN2 are supplied by the same input source" and recommends connecting them "with board traces as short as possible." Using separate inputs violates the device's internal UVLO and protection architecture and is not characterized or supported.
TC1313-ZD0EMFTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 10-VFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Topology:
- Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
- Number of Outputs:
- 2
- Frequency - Switching:
- 2MHz
- Voltage/Current - Output 1:
- Adj, 500mA
- Voltage/Current - Output 2:
- 3V, 300mA
- Voltage/Current - Output 3:
- -
- w/LED Driver:
- No
- w/Supervisor:
- No
- w/Sequencer:
- No
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-DFN (3x3)
TC1313-ZD0EMFTR FAQ
1.How can I place an order for TC1313-ZD0EMFTR through Aetrix?
Please submit a Request for Quotation (RFQ) for TC1313-ZD0EMFTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC1313-ZD0EMFTR reliable?
The price and inventory of TC1313-ZD0EMFTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC1313-ZD0EMFTR is usually 5 days.
3.What payment methods are accepted for TC1313-ZD0EMFTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC1313-ZD0EMFTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC1313-ZD0EMFTR?
TC1313-ZD0EMFTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC1313-ZD0EMFTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC1313-ZD0EMFTR?
For technical support, including TC1313-ZD0EMFTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC1313-ZD0EMFTR requirements.
6.How does Aetrix verify that TC1313-ZD0EMFTR is sourced from the original manufacturer or authorized distributors?
All TC1313-ZD0EMFTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC1313-ZD0EMFTR meets industry standards.
7.What is the process for return or replacement of TC1313-ZD0EMFTR?
All TC1313-ZD0EMFTR units undergo pre-shipment inspection (PSI). If there is an issue with TC1313-ZD0EMFTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC1313-ZD0EMFTR part is unused and in its original packaging.
Return procedure for TC1313-ZD0EMFTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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