Microchip Technology TC1313-ZI0EMF

Overview

TC1313-ZI0EMF from Microchip Technology is a dual-output power management IC integrating a 500 mA synchronous buck regulator and a 300 mA low-dropout linear regulator (LDO) in a single 10-pin DFN package. It delivers 1.8 V @ 500 mA (buck) and 3.3 V @ 300 mA (LDO), with 2.0 MHz fixed-frequency PWM operation, 57 µA total quiescent current, and -40°C to +125°C junction temperature range - optimized for battery-powered portable electronics requiring tightly regulated dual-rail supplies.

For engineers reviewing the TC1313-ZI0EMF datasheet, TC1313-ZI0EMF pinout, TC1313-ZI0EMF application, or TC1313-ZI0EMF equivalent, this page provides verified functional partitioning (independent SHDN1/SHDN2 control), confirmed thermal performance (θJA = 41°C/W for DFN), validated LDO dropout (137 mV @ 200 mA), and exact pin mapping for layout-critical signals including LX, PGND, and AGND separation.

Technical Context

The TC1313-ZI0EMF implements a current-mode synchronous buck regulator with automatic PWM-to-PFM mode transition - operating at 2.0 MHz (±0.4 MHz) under heavy load (>80 mA) and dropping to ultra-low-quiescent PFM mode (<38 µA) below ~30 mA. Its integrated N- and P-channel MOSFETs feature R_DS(on) of 450 mΩ each, enabling >90% efficiency at 500 mA output with minimal external components.

The companion LDO uses a PMOS pass device with 137 mV typical dropout at 200 mA and supports only fixed outputs (1.5 V, 1.8 V, 2.5 V, 3.3 V); it requires only a single 1 µF ceramic output capacitor and achieves 62 dB PSRR at 100 Hz. Both regulators share independent shutdown inputs (SHDN1/SHDN2), undervoltage lockout (2.55 V threshold), and thermal shutdown (165°C).

Key Specifications

Pinout & Package

TC1313-ZI0EMF is housed in a 10-pin 3×3 mm DFN package with exposed thermal pad (EP), designed for high thermal efficiency on 4-layer PCBs with internal ground plane and ≥2 vias to AGND. Pin numbering follows standard DFN orientation (pin 1 marked).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output regulator applications.

Compared with TPS65023BRSBT and RT8070ZSP, TC1313-ZI0EMF uniquely integrates a 300 mA LDO with 137 mV dropout in a 3×3 mm DFN, eliminating external components needed for noise-sensitive analog rails while maintaining ultra-low 57 µA system quiescent current - making it optimal for space- and battery-life-constrained portable designs.

Availability

TC1313-ZI0EMF is available at Aetrix Electronics and suitable for cellular phones, USB-powered devices, and handheld medical instruments requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TC1313-ZI0EMF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a leading provider of microcontrollers, analog components, and power management ICs, headquartered in Chandler, Arizona, with global design and manufacturing operations.

TC1313-ZI0EMF belongs to Microchip's TC13xx dual-output regulator family, engineered specifically for portable electronics demanding high integration, low quiescent current, and robust thermal performance in minimal PCB area.

FAQ

What input voltage range does the TC1313-ZI0EMF support?

The TC1313-ZI0EMF supports an input voltage range of 2.7 V to 5.5 V on both VIN1 and VIN2 pins. This range accommodates single-cell Li-ion (2.7–4.2 V) and USB 5 V sources. The device incorporates undervoltage lockout (UVLO) that disables regulation below 2.55 V (typical) to prevent erratic operation during brownout conditions. Input voltage must exceed the selected output voltage plus dropout margin - e.g., ≥3.0 V for 1.8 V buck output.

How does the TC1313-ZI0EMF handle light-load efficiency?

The TC1313-ZI0EMF automatically transitions its buck regulator from fixed-frequency PWM mode to pulse-frequency modulation (PFM) mode below ~30 mA load, reducing total quiescent current to 57 µA (typical). In PFM mode, the IC skips switching cycles to maintain output regulation while minimizing battery drain - critical for standby operation in cellular phones and PDAs. The LDO remains active with 44 µA IQ when enabled.

Can the TC1313-ZI0EMF generate adjustable buck output voltages?

Yes, the TC1313-ZI0EMF supports adjustable buck output voltages from 0.8 V to 4.5 V using an external resistor divider connected to the VFB1/VOUT1 pin. The internal reference voltage is 0.8 V (±2.5%), allowing precise setting of non-standard rails like 1.35 V or 2.8 V. Fixed-output versions (e.g., 1.8 V, 3.3 V) connect VFB1/VOUT1 directly to VOUT1, eliminating external resistors.

What thermal management is required for the TC1313-ZI0EMF in a DFN package?

The TC1313-ZI0EMF in its 10-pin DFN package requires connection of the exposed thermal pad (EP) to AGND via ≥2 thermal vias to an internal ground plane. This achieves θ_JA = 41°C/W on a typical 4-layer board. Without proper EP grounding, junction temperature rise exceeds safe limits under 500 mA buck load. Layout must separate AGND (analog reference) and PGND (power return), joining them at a single point near the IC.

Does the TC1313-ZI0EMF provide independent control of its two outputs?

Yes, the TC1313-ZI0EMF features fully independent shutdown inputs: SHDN1 controls the 500 mA buck regulator, and SHDN2 controls the 300 mA LDO. Each accepts active-high logic (VIH ≥ 45% VIN) and draws only ±0.01 µA leakage. This enables flexible power sequencing - e.g., powering the LDO first to initialize analog circuitry before enabling the buck regulator for digital core voltage.