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Texas Instruments TC281-30

Part No.:
TC281-30
Manufacturer:
Texas Instruments
Category:
Image Sensors, Camera
Package:
22-CDIP (0.690", 17.53mm) Window
Datasheet:
AetrixTC281-30.pdf
Description:
TC281-30
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,673

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Product details

Overview

TC281-30 from Texas Instruments is a frame-transfer CCD image sensor with 1000 × 1000 active pixels, 8-µm square pixel pitch, and up to 30 fps readout capability. It features a 11.3-mm diagonal image area, advanced lateral overflow drain (ALOD) for antiblooming, and nondestructive bulk charge detection (BCD) node enabling high dynamic range (>60 dB) and low-noise imaging in robotic vision and medical X-ray analysis systems.

For engineers reviewing the TC281-30 datasheet, TC281-30 pinout, TC281-30 application, or TC281-30 equivalent, key selection considerations include its frame-transfer architecture, single-pulse image-area clear function, 40-MHz serial register clocking, -10°C to +45°C operating range, and dual-in-line ceramic package with glass window for optical coupling.

Technical Context

The TC281-30 implements a true frame-transfer architecture: photocharge generated in the 1000 × 1000 image area transfers fully into a shielded 1010 × 1036 storage area in <110 µs. Its BCD node enables nondestructive charge sensing without reset noise, eliminating need for correlated double sampling (CDS) circuitry.

Timing control relies on five critical clocks-TRG, IAG, SAG, SRG, and RST-with voltage ranges from –10.5 V to +8 V and frequencies up to 40 MHz. Antiblooming is managed via ODB bias (5–6 V dc or 10-V pulse), while dark reference is derived from 10 masked rows and 36 edge pixels per line.

Key Specifications

ParameterValue and Actual Design Meaning
Resolution1000 (H) × 1000 (V) active pixels; supports full-frame capture without interpolation or binning loss.
Frame RateUp to 30 fps at full resolution; enabled by 40-MHz serial register clock and 1036-pixel output register.
Dynamic Range>62 dB typical; determined by saturation signal (320 mV) and noise-equivalent signal (12–25 electrons).
Pixel Size8 µm × 8 µm square; defines spatial sampling limit and contributes to 11.3-mm image diagonal.
Charge Transfer Efficiency0.99990–0.99995; ensures <0.01% signal loss per transfer in serial register, critical for low smear.
Operating Temperature–10°C to +45°C; validated for industrial metrology and medical imaging environments.
Quantum EfficiencyPeak >80% at 600 nm; extends usable response into near-IR (up to 1100 nm) and blue spectrum.

Pinout & Package

Dual-in-line ceramic package with 22 leads, glass optical window, and 2.54-mm lead pitch. Sealed with epoxy; index dot denotes Pin 1. Package dimensions: 27.66 mm × 17.40 mm × 9.21 mm (L×W×H).

Pin/TerminalCircuit RoleDesign Meaning
SUB (1,4,7,17,18,19,22)Substrate returnCommon ground reference for all clock and bias networks; must be tied to system ground.
ODB (2)Overflow drain biasControls antiblooming threshold; accepts 5–6 V dc or 10-V pulse for full image-area clear.
IAG (3,20)Image area gateVertical shift control during integration; driven with –10.5 V to +2.5 V clocks.
SAG (5,6)Storage area gateEnables parallel transfer from image to storage; same voltage swing as IAG.
OUT (8)Analog video outputBCD-node buffered signal; requires AC coupling to remove DC offset and inter-sensor variation.
RST (12)Reset gateClears BCD node after readout; 0–8 V logic-compatible input.
SRG (15)Serial register gateShifts pixel data out of serial register; 40-MHz max clock rate defines frame timing.
TRG (14)Transfer gateInitiates vertical charge transfer from storage to serial register; synchronized with SRG.
VSOURCE (13)BCD source bias12 V supply for BCD node source; sets output amplifier operating point.
VGATE (11)BCD gate bias0 V reference for BCD threshold modulation; critical for charge-to-voltage linearity.
ADB (9)Amplifier drain bias12 V supply for output source-follower; determines gain and output impedance (~400 Ω).
CDB (10)Clearing drain biasBias for clearing drain below serial register; enables fast partial-line or full-storage clear.

Key Features

FeatureDesign Value
Nondestructive BCD readoutEliminates reset noise and removes need for CDS circuitry, simplifying analog front-end design.
Single-pulse image-area clear10-V, ≥1-µs ODB pulse fully clears integration charge-enabling precise electronic shutter control down to 1/1000 sec.
Advanced lateral overflow drain (ALOD)Provides 1000:1 blooming suppression ratio while allowing adjustable well capacity via ODB bias tuning.
High near-IR and blue quantum efficiencyPeak QE >80% at 600 nm and usable response to 1100 nm enable multispectral imaging without external filters.
Low dark current0.3 nA/cm² at 21°C; reduces thermal noise in long-exposure applications like X-ray fluoroscopy.

Applications

Robotic Vision GuidanceMedical X-Ray Imaging

Use Scenario: Real-time position tracking of surgical tools under fluoroscopic X-ray illumination.

IC Role / Device Role / Timing Role: Frame-transfer CCD capturing 30 fps high-contrast images with minimal lag or smear during rapid motion.

Use Value: 1000 × 1000 resolution and 62+ dB dynamic range resolve fine tool edges against variable X-ray intensity backgrounds.

Use Scenario: Digital radiography detector for dental or portable X-ray units requiring compact, high-SNR sensors.

IC Role / Device Role / Timing Role: Primary image acquisition device converting X-ray phosphor light into calibrated analog video signals.

Use Value: High blue/near-IR sensitivity matches common scintillator emission spectra; low dark current ensures clean low-dose exposures.

Industrial MetrologyScientific Spectroscopy

Use Scenario: Sub-micron dimensional measurement of semiconductor wafers using structured lighting and edge detection.

IC Role / Device Role / Timing Role: Precision frame-capture sensor synchronized to laser strobes for motion-free imaging.

Use Value: Single-pulse clear eliminates integration smear; 8-µm pixels provide native 1 µm spatial resolution at 1:1 magnification.

Use Scenario: Low-light spectral line analysis in astronomy or Raman spectroscopy where photon efficiency is critical.

IC Role / Device Role / Timing Role: Light-integrating detector with programmable exposure and nondestructive readout for multi-sample averaging.

Use Value: Nondestructive BCD readout allows repeated sampling of same charge packet-reducing read noise impact on weak signal detection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar frame-transfer CCD imaging applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
KAI-1003Interline transfer architecture; 1024 × 1024 resolution; no frame-transfer smear immunity.Lacks true electronic shutter; unsuitable for high-speed moving objects without mechanical shutter.Choose when global shutter is not required and higher frame rates (>60 fps) are prioritized over smear-free capture.
ICX428AQProgressive scan CCD; 1360 × 1024 resolution; 12-bit ADC interface; no ALOD antiblooming.Requires external CDS and blooming mitigation; higher power consumption and larger footprint.Prefer when integrated ADC and progressive scan timing simplify system-level design despite lower quantum efficiency.

Compared with KAI-1003 and ICX428AQ, the TC281-30 delivers unique frame-transfer smear immunity, single-pulse clear for precise exposure control, and TI's proprietary BCD node for zero-reset-noise operation-making it irreplaceable in high-accuracy, low-smear scientific and medical imaging where charge integrity is paramount.

Availability

TC281-30 is available at Aetrix Electronics and suitable for robotic vision guidance, medical X-ray imaging, and industrial metrology requiring stable component supply across extended production lifecycles.

Supply support for TC281-30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a U.S.-based semiconductor innovator founded in 1930, specializing in analog, embedded processing, and imaging technologies with broad industrial and medical design heritage.

The TC281-30 belongs to TI's legacy high-performance CCD image sensor family, engineered specifically for precision scientific, medical, and metrology applications demanding global shutter, low smear, and high quantum efficiency.

FAQ

What is the maximum frame rate achievable with the TC281-30 under full-resolution operation?

The TC281-30 achieves up to 30 frames per second at its native 1000 × 1000 resolution. This performance is enabled by a 40-MHz serial register clock driving a 1036-pixel output register, with timing verified across the –10°C to +45°C operating range. The TC281-30 datasheet confirms this frame rate assumes standard parallel transfer and serial readout sequences without binning or subsampling.

Does the TC281-30 support true electronic shutter functionality, and how is it implemented?

Yes, the TC281-30 supports precise electronic shutter control via its single-pulse image-area clear capability. Applying a 10-V, ≥1-µs pulse to the ODB pin fully clears accumulated charge before integration begins-enabling exposure times from 1/1000 sec to several seconds. This mechanism eliminates mechanical shutter requirements and prevents smear in the TC281-30 during high-speed object capture.

How does the bulk charge detection (BCD) node in the TC281-30 differ from conventional floating diffusion amplifiers?

The TC281-30 uses TI's patented BCD node, where charge modulates the threshold voltage of a p-channel MOS transistor rather than being converted on a floating diffusion. This enables nondestructive readout-no reset noise is generated, and CDS circuitry is unnecessary. In contrast, conventional CCDs require destructive readout and post-processing to suppress reset noise, making the TC281-30 uniquely suited for low-noise, high-fidelity applications.

What are the recommended bias voltages for the TC281-30's ODB and RST pins during normal operation?

For standard antiblooming, the ODB pin requires a dc bias of 5.0–6.0 V. For electronic shutter operation, a 10-V pulse ≥1 µs duration is applied. The RST pin operates with a 0–0.5 V low state and 5–8 V high state, with 5 V nominal recommended for reliable BCD node reset. These values are specified in the TC281-30's recommended operating conditions table and validated across temperature.

Can the TC281-30 be used without AC coupling on its OUT pin, and what are the consequences?

No-TI explicitly recommends AC coupling the TC281-30's OUT pin to eliminate dc output level variations between units and ensure stability. Direct DC coupling introduces baseline drift and inter-sensor offset mismatches that degrade measurement repeatability. The TC281-30 application circuits (Figures 11–15) all show AC coupling, and the datasheet states ac coupling "eliminates problems with the sensor output dc stability"-a requirement for precision imaging systems using the TC281-30.

TC281-30 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
22-CDIP (0.690", 17.53mm) Window
Packaging:
Box
Product Status:
Obsolete
Type:
CCD
Pixel Size:
8µm x 8µm
Active Pixel Array:
1036H x 1010V
Frames per Second:
-
Voltage - Supply:
12V
Supplier Device Package:
22-CDIP, Window
Operating Temperature:
-10°C ~ 45°C
Grade:
-
Qualification:
-

TC281-30 FAQ

1.How can I place an order for TC281-30 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC281-30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC281-30 reliable?

The price and inventory of TC281-30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC281-30 is usually 5 days.

3.What payment methods are accepted for TC281-30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC281-30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC281-30?

TC281-30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC281-30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC281-30?

For technical support, including TC281-30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC281-30 requirements.

6.How does Aetrix verify that TC281-30 is sourced from the original manufacturer or authorized distributors?

All TC281-30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC281-30 meets industry standards.

7.What is the process for return or replacement of TC281-30?

All TC281-30 units undergo pre-shipment inspection (PSI). If there is an issue with TC281-30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC281-30 part is unused and in its original packaging.

Return procedure for TC281-30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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