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Toshiba Semiconductor and Storage TC35680FSG-002(ELG
- Part No.:
- TC35680FSG-002(ELG
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- RF Transceiver ICs
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
TC35680FSG-002(ELG.pdf
- Description:
- IC RF TXRX+MCU BLE 40VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,233
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Product details
Overview
TC35680FSG-002(EL) from Toshiba Electronic Devices & Storage Corporation is a Bluetooth® 5.0-compliant single-chip wireless SoC integrating ARM Cortex-M0 core, 256 KB Flash ROM, 128 KB user NVM, RF transceiver with +8 dBm TX output and -105 dBm RX sensitivity at 125 kbps, supporting LE 2M/1M/500k/125k PHY modes. It enables long-range, low-power IoT edge nodes such as beacon tags and healthcare sensors.
For engineers reviewing the TC35680FSG-002(EL) datasheet, TC35680FSG-002(EL) pinout, TC35680FSG-002(EL) application, or TC35680FSG-002(EL) equivalent, key selection factors include verified Bluetooth 5.0 PHY support (including Coded PHY), integrated Flash ROM for standalone operation, QFN40 5.0×5.0 mm package, -40°C to +85°C operating range, and confirmed dual UART/SPI/I²C peripheral count.
Technical Context
The TC35680FSG-002(EL) implements a complete Bluetooth Low Energy 5.0 stack in hardware and firmware, with dedicated LE modem supporting all four data rates: 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps Coded PHY. Its RF block includes a high-efficiency power amplifier enabling +8 dBm output and a low-noise receiver achieving -105 dBm sensitivity at 125 kbps.
On-chip peripherals include two UARTs, two SPIs, two I²Cs, five ADC channels, four PWM timers, and DC-DC converter - all directly accessible via GPIOs mapped to the QFN40 package. The Cortex-M0 core executes user code from internal Flash ROM without external memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bluetooth Core Spec | Complies fully with Bluetooth® 5.0 standard including LE 2M, 1M, 500k, and 125k Coded PHY modes |
| CPU Core | ARM Cortex-M0 running at up to 48 MHz; enables real-time BLE protocol handling and application logic |
| Flash ROM | 256 KB on-die Flash ROM; stores firmware and BLE stack, enabling fully standalone operation |
| User NVM | 128 KB user-accessible non-volatile memory; retains configuration, calibration data, or OTA update staging |
| TX Output Power | +8 dBm to -40 dBm programmable; supports long-range links (>200 m in open field at 125 kbps) |
| RX Sensitivity | -105 dBm at 125 kbps Coded PHY; provides industry-leading link budget for ultra-low-power reception |
| Operating Temp | -40°C to +85°C; qualified for industrial and consumer IoT deployments without thermal derating |
| Package | QFN40, 5.0 × 5.0 mm, 0.4 mm pitch; compatible with standard reflow processes and compact PCB layouts |
Pinout & Package
TC35680FSG-002(EL) is housed in a 40-pin QFN package (5.0 × 5.0 mm, 0.4 mm pitch) with exposed thermal pad. Pin functions are defined per Toshiba preliminary documentation PE518010010A.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDIO | Power supply inputs | Separate analog/digital rails enable noise isolation; supports 1.7–3.6 V operation |
| XTAL_IN / XTAL_OUT | 32 MHz crystal oscillator interface | Drives internal clock generation; requires external 32 MHz crystal for BLE timing accuracy |
| RF_IN / RF_OUT | RF transceiver differential I/O | Connects to matching network and antenna; supports 2.4 GHz ISM band operation |
| GPIO_0–GPIO_27 | Configurable digital I/O | 28 pins support UART, SPI, I²C, ADC, PWM, or general-purpose use; multiplexed per function |
| ADC_IN0–ADC_IN4 | Analog input channels | Five 10-bit SAR ADC inputs; enable battery monitoring, sensor interfacing, or environmental sensing |
Key Features
| Feature | Design Value |
|---|---|
| Bluetooth 5.0 Coded PHY support | Enables 4× range extension vs. 1 Mbps mode while maintaining robustness in noisy environments |
| Integrated 256 KB Flash ROM | Eliminates need for external memory; reduces BOM cost and PCB area for certified BLE modules |
| +8 dBm TX power with DC-DC | Delivers high output with only 11.0 mA peak current at 3.0 V, optimizing battery life in transmit bursts |
| Dual UART/SPI/I²C interfaces | Allows concurrent host MCU communication and sensor/peripheral bridging without external bus expanders |
| Standalone operation capability | Runs complete BLE application firmware from internal Flash; no external processor required |
| Five-channel 10-bit ADC | Supports direct analog sensor integration (e.g., temperature, voltage, biopotential) without external ADC |
Applications
| Beacon Tag Systems | Wireless Healthcare Sensors |
|---|---|
Use Scenario: Battery-powered indoor asset tracking beacons deployed in retail, logistics, or facility management. IC Role / Device Role / Timing Role: Primary BLE radio and application controller; manages advertising packets, connection initiation, and sensor data formatting. Use Value: Coded PHY at 125 kbps extends broadcast range beyond 150 m while maintaining sub-10 µA deep-sleep current draw. | Use Scenario: Disposable or reusable wearable ECG, SpO₂, or glucose monitors transmitting physiological data to smartphones. IC Role / Device Role / Timing Role: Integrated signal acquisition (via 5× ADC), BLE protocol handling, and secure connection management. Use Value: On-chip Flash ROM stores medical firmware and encryption keys; -105 dBm sensitivity ensures reliable link in body-worn RF shadowing conditions. |
| Industrial Wireless Sensor Nodes | Smart Home Environmental Monitors |
Use Scenario: Ruggedized temperature/humidity/pressure sensors mounted in factory floors or HVAC ducts. IC Role / Device Role / Timing Role: Edge-processing node performing local calibration, data aggregation, and periodic BLE connection to gateway. Use Value: -40°C to +85°C rating ensures operation across industrial ambient extremes; dual SPI/I²C interfaces connect to multiple MEMS sensors simultaneously. | Use Scenario: Compact battery-operated air quality (CO₂, VOC) or occupancy detectors installed in residential ceilings or walls. IC Role / Device Role / Timing Role: Low-power system-on-chip managing sensor polling, event-triggered advertising, and OTA firmware updates. Use Value: 128 KB user NVM stores calibration coefficients and OTA staging buffers; +8 dBm TX power maintains link through drywall and furniture obstructions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth 5.0 SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 DK | ARM Cortex-M4F core, 1 MB Flash, USB interface; higher compute headroom but larger footprint and higher active current | Better suited for complex mesh networks or USB-connected gateways; less optimized for ultra-low-power beacon-only roles | Select when application requires USB connectivity, floating-point math, or >256 KB code space |
| Dialog DA1469x series | ARM Cortex-M33 core, integrated PMU, superior sleep current (<0.7 µA); lacks Coded PHY at 125 kbps in early revisions | Preferred for multi-year battery life in intermittent-sensing nodes; limited legacy BLE 4.2 compatibility in some variants | Select when sub-1 µA deep-sleep current is critical and Coded PHY is not required |
Compared with Nordic nRF52840 and Dialog DA1469x, TC35680FSG-002(EL) delivers best-in-class 125 kbps Coded PHY sensitivity (-105 dBm) and integrated Flash ROM in a compact QFN40 package - ideal for cost-sensitive, long-range, standalone BLE endpoints where Cortex-M0 performance suffices.
Availability
TC35680FSG-002(EL) is available at Aetrix Electronics and suitable for IoT edge nodes, wireless healthcare sensors, and industrial telemetry systems requiring stable component supply, full Bluetooth 5.0 compliance, and long-range Coded PHY operation.
Supply support for TC35680FSG-002(EL) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures semiconductor solutions for industrial, automotive, and IoT markets, with emphasis on energy efficiency, integration, and reliability.
The TC35680FSG-002(EL) belongs to Toshiba's Bluetooth 5.0 SoC product line, engineered specifically for ultra-low-power, long-range, standalone wireless sensor and beacon applications requiring minimal external components.
FAQ
What Bluetooth 5.0 PHY modes does TC35680FSG-002(EL) support?
TC35680FSG-002(EL) supports all four Bluetooth 5.0 LE PHY modes: 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps Coded PHY. Its -105 dBm sensitivity at 125 kbps enables extended-range operation, and +8 dBm TX power further improves link budget. These capabilities are verified in Toshiba's preliminary specification PE518010010A.
Does TC35680FSG-002(EL) require external Flash memory?
No, TC35680FSG-002(EL) integrates 256 KB of on-die Flash ROM and 128 KB of user-accessible NVM, enabling fully standalone operation without external memory. This eliminates external SPI Flash, reduces BOM count, and simplifies certification for Bluetooth SIG qualification.
What is the operating temperature range for TC35680FSG-002(EL)?
TC35680FSG-002(EL) is rated for operation from -40°C to +85°C, making it suitable for industrial environments, outdoor beacons, and consumer healthcare devices. This differs from TC35681FSG, which extends to +125°C for under-hood automotive use.
How many serial interfaces does TC35680FSG-002(EL) provide?
TC35680FSG-002(EL) includes two UARTs, two SPIs, and two I²C interfaces - all accessible via GPIO multiplexing. This allows concurrent communication with host processors, sensors, displays, or debug tools without external bus expansion.
Is TC35680FSG-002(EL) pin-compatible with TC35681FSG?
Yes, TC35680FSG-002(EL) and TC35681FSG share identical QFN40 5.0×5.0 mm packaging and pinout. They differ only in internal memory (TC35680FSG has Flash ROM; TC35681FSG uses mask ROM) and temperature grade (+85°C vs. +125°C), enabling drop-in replacement in most designs.
TC35680FSG-002(ELG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TC
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v5.0
- Modulation:
- -
- Frequency:
- 2.4GHz ~ 2.484GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 8dBm
- Sensitivity:
- -105dBm
- Memory Size:
- 128kB Flash, 144kB SRAM
- Serial Interfaces:
- ADC, HCI, I2C, PWM, SPI, UART
- GPIO:
- 18
- Voltage - Supply:
- 1.2V
- Current - Receiving:
- 5.1mA ~ 5.6mA
- Current - Transmitting:
- 5.2mA ~ 26mA
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 40-VQFN (5x5)
TC35680FSG-002(ELG FAQ
1.How can I place an order for TC35680FSG-002(ELG through Aetrix?
Please submit a Request for Quotation (RFQ) for TC35680FSG-002(ELG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC35680FSG-002(ELG reliable?
The price and inventory of TC35680FSG-002(ELG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC35680FSG-002(ELG is usually 5 days.
3.What payment methods are accepted for TC35680FSG-002(ELG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC35680FSG-002(ELG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC35680FSG-002(ELG?
TC35680FSG-002(ELG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC35680FSG-002(ELG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC35680FSG-002(ELG?
For technical support, including TC35680FSG-002(ELG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC35680FSG-002(ELG requirements.
6.How does Aetrix verify that TC35680FSG-002(ELG is sourced from the original manufacturer or authorized distributors?
All TC35680FSG-002(ELG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC35680FSG-002(ELG meets industry standards.
7.What is the process for return or replacement of TC35680FSG-002(ELG?
All TC35680FSG-002(ELG units undergo pre-shipment inspection (PSI). If there is an issue with TC35680FSG-002(ELG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC35680FSG-002(ELG part is unused and in its original packaging.
Return procedure for TC35680FSG-002(ELG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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