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Toshiba Semiconductor and Storage TC74VCX541FTEL
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- Part No.:
- TC74VCX541FTEL
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
TC74VCX541FTEL.pdf
- Description:
- IC BUF NON-INVERT 3.6V 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,758
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Product details
Overview
TC74VCX541FTEL from Toshiba Electronic Devices & Storage Corporation is a low-voltage octal non-inverting 3-state bus buffer with dual active-low output enables (OE1, OE2), operating from 1.2 V to 3.6 V supply, delivering 3.5 ns max propagation delay at 3.3 V and ±24 mA output drive, used in memory address driver and mixed-voltage system interfacing applications.
For engineers reviewing the TC74VCX541FTEL datasheet, TC74VCX541FTEL pinout, TC74VCX541FTEL application, or TC74VCX541FTEL equivalent, this page provides verified electrical specs, TSSOP20 package details, temperature-rated performance (-40°C to +125°C for post-April 2020 lots), 3.6 V tolerant I/O behavior, and real-world selection guidance against comparable octal buffers.
Technical Context
The TC74VCX541FTEL implements a CMOS-based non-inverting buffer architecture with two independent active-low output enable controls, allowing selective tri-state control of eight parallel data paths. Its design supports voltage translation across 1.2 V–3.3 V domains while maintaining rail-to-rail input and output compatibility up to 3.6 V.
It features overvoltage-tolerant inputs/outputs, static discharge protection on all pins, and guaranteed operation across -40°C to +125°C ambient for units manufactured after April 2020. Propagation delay scales predictably with VCC: 42.0 ns at 1.2 V, 8.4 ns at 1.8 V, and 3.5 ns at 3.3 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.2 V to 3.6 V - Enables direct interface with 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic systems without level shifters. |
| Propagation Delay (max) | 3.5 ns at VCC = 3.3 V - Supports high-speed address/data buffering in DDR memory subsystems and FPGA I/O expansion. |
| Output Drive Strength | ±24 mA at VCC = 3.0 V - Sufficient to drive multiple loads or longer PCB traces in industrial backplane applications. |
| I/O Voltage Tolerance | Up to 3.6 V - Allows safe connection to higher-voltage peripherals (e.g., 3.3 V I²C or GPIO) even when VCC = 1.8 V. |
| Operating Temperature | -40°C to +125°C (for units manufactured after April 2020) - Qualified for under-hood automotive and industrial control environments. |
| Input Leakage Current | ±5 µA max at Ta = -40 to 85°C - Minimizes power loss in battery-backed or ultra-low-power standby modes. |
| Quiescent Supply Current | 750 µA max at VCC = 3.6 V - Enables use in always-on monitoring circuits without significant static power penalty. |
Pinout & Package
TSSOP20 (Thin Shrink Small Outline Package, 20-pin, 0.65 mm pitch, 6.5 mm × 4.4 mm footprint, 0.08 g typical weight).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 19 | OE1, OE2 (Active-Low Output Enables) | Independent control of output states: either high-impedance when asserted; both must be low for functional output drive. |
| 2–9 | A1–A8 (Inputs) | Octal buffered inputs accepting 3.6 V tolerant signals regardless of VCC level. |
| 11–18 | Y1–Y8 (Outputs) | Non-inverting buffered outputs with ±24 mA drive capability and 3.6 V tolerance. |
| 10 | GND | Ground reference for all internal circuitry and I/O structures. |
| 20 | VCC | Primary power supply (1.2–3.6 V); powers internal logic and output drivers. |
Key Features
| Feature | Design Value |
|---|---|
| Wide VCC range (1.2–3.6 V) | Eliminates need for separate voltage regulators in multi-rail embedded systems with mixed-core logic. |
| Dual active-low output enables | Enables flexible bus arbitration schemes-e.g., one enable for CPU-side access, another for DMA controller access. |
| 3.6 V tolerant I/O | Permits interoperability between legacy 3.3 V peripherals and newer low-voltage SoCs without external clamping diodes. |
| High-speed propagation (3.5 ns @ 3.3 V) | Meets timing closure requirements for 100+ MHz address/data buses in microcontroller-based industrial controllers. |
| ESD-protected inputs | Integrated protection meets HBM ≥2 kV, reducing need for external TVS components in cost-sensitive consumer designs. |
Applications
| Industrial PLC Backplane Interface | Automotive Body Control Module (BCM) |
|---|---|
|
Use Scenario: Interfacing a 1.8 V microcontroller to legacy 3.3 V sensor hub and CAN transceiver logic on a shared backplane. IC Role / Device Role / Timing Role: Level-translating octal buffer isolating MCU I/O from higher-voltage subsystems while preserving signal integrity and timing margins. Use Value: Eliminates discrete level shifters and reduces BOM count by enabling direct 1.8 V ↔ 3.3 V communication with 3.5 ns delay overhead. |
Use Scenario: Driving multiplexed LED indicators and relay control lines from a 2.5 V automotive MCU in a body control module. IC Role / Device Role / Timing Role: Non-inverting bus buffer providing robust current drive (±18 mA @ 2.5 V) and thermal resilience (-40°C to +125°C). Use Value: Ensures reliable indicator activation across full vehicle temperature range without derating or external drivers. |
| FPGA I/O Expansion Bridge | Low-Power Memory Address Driver |
|
Use Scenario: Expanding FPGA GPIO banks to control external ADCs, DACs, and serial EEPROMs operating at different supply voltages. IC Role / Device Role / Timing Role: Voltage-flexible octal buffer acting as bidirectional I/O bridge with configurable tri-state control per group. Use Value: Enables single FPGA design to support multiple board variants (1.2 V, 1.8 V, 3.3 V) via software-configurable OE pins. |
Use Scenario: Driving 8-bit address lines to SRAM or flash memory in portable medical devices requiring ultra-low quiescent current. IC Role / Device Role / Timing Role: Low-power address buffer minimizing ICC (750 µA max) while meeting 10 ns timing budget at 1.5 V operation. Use Value: Extends battery life in handheld diagnostics equipment by cutting static power vs. standard 3.3 V buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal non-inverting buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC541APWR | Same 20-pin TSSOP package; 1.65–3.6 V VCC range; 3.9 ns max tPD at 3.3 V; ±24 mA drive; no 1.2 V operation. | Limited to ≥1.65 V systems; unsuitable for sub-1.5 V SoC interfaces where TC74VCX541FTEL supports 1.2 V operation. | Select SN74LVC541APWR only if design operates exclusively above 1.65 V and requires TI's qualification pedigree. |
| 74ALVC541PW,118 | NXP part in TSSOP20; 1.65–3.6 V VCC; 3.2 ns max tPD at 3.3 V; ±24 mA drive; no 1.2 V support; slightly lower ICC (600 µA). | Not rated for -40°C to +125°C; max Topr = +85°C - excludes under-hood or extended-temperature industrial use cases. | Choose 74ALVC541PW,118 for commercial-grade, space-constrained applications needing marginally faster speed but no extended temperature requirement. |
Compared with SN74LVC541APWR and 74ALVC541PW,118, the TC74VCX541FTEL uniquely supports 1.2 V operation and full -40°C to +125°C functionality in a drop-in TSSOP20 footprint, making it the only option for next-gen ultra-low-voltage automotive and industrial edge nodes requiring extended thermal compliance.
Availability
TC74VCX541FTEL is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and portable medical device designs requiring stable component supply, long-term lifecycle assurance, and guaranteed extended-temperature performance.
Supply support for TC74VCX541FTEL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor solutions for industrial, automotive, and computing applications, with emphasis on low-power, mixed-signal, and interface ICs.
The TC74VCX541FTEL belongs to Toshiba's VCX-series ultra-low-voltage CMOS logic family, engineered specifically for seamless voltage-domain bridging in energy-efficient embedded systems where supply rails continue to scale downward.
FAQ
What is the minimum supply voltage supported by the TC74VCX541FTEL?
The TC74VCX541FTEL operates down to 1.2 V, enabling direct integration with advanced ultra-low-power microcontrollers and SoCs that use sub-1.5 V core logic. This specification is confirmed in Section 10 (Operating Ranges) of the official Toshiba datasheet Rev. 2.0.A, with full DC and AC characterization validated at 1.2 V, including 42.0 ns max propagation delay and ±2 mA output drive.
Does the TC74VCX541FTEL support operation at 125°C ambient temperature?
Yes - the TC74VCX541FTEL is rated for -40°C to +125°C operation, but only for units manufactured after April 2020, as explicitly stated in Notes 1 and 7 of Sections 3 and 10 of the Toshiba datasheet. Units produced prior to that date are qualified only to +85°C ambient.
How many output enable inputs does the TC74VCX541FTEL have, and what is their logic polarity?
The TC74VCX541FTEL has two active-low output enable inputs: OE1 (Pin 1) and OE2 (Pin 19). When either is high, the corresponding Y1–Y8 outputs enter high-impedance state. Both must be low for normal non-inverting buffer operation - a feature documented in Section 1 (Functional Description) and Section 8 (Truth Table) of the datasheet.
Is the TC74VCX541FTEL pin-compatible with standard 74-series octal buffers like the 74HC541?
No - the TC74VCX541FTEL uses a unique pin assignment optimized for its dual-OE architecture and 3.6 V tolerant I/O. While both are 20-pin TSSOP devices, the pinout differs significantly from 74HC541 (which has single OE and different terminal ordering). Direct replacement requires PCB layout revision; refer to Section 5 (Pin Assignment) in the Toshiba datasheet for exact mapping.
What is the maximum output current the TC74VCX541FTEL can source or sink at 1.8 V supply?
At VCC = 1.8 V, the TC74VCX541FTEL guarantees ±6 mA output current (IOH/IOL), as specified in Section 3, Feature (4) of the datasheet. This value is measured under standard test conditions with VOH/VOL defined per DC characteristics tables, ensuring reliable drive into moderate capacitive loads in portable electronics.
TC74VCX541FTEL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TC74VCX
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
TC74VCX541FTEL FAQ
1.How can I place an order for TC74VCX541FTEL through Aetrix?
Please submit a Request for Quotation (RFQ) for TC74VCX541FTEL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC74VCX541FTEL reliable?
The price and inventory of TC74VCX541FTEL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC74VCX541FTEL is usually 5 days.
3.What payment methods are accepted for TC74VCX541FTEL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC74VCX541FTEL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC74VCX541FTEL?
TC74VCX541FTEL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC74VCX541FTEL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC74VCX541FTEL?
For technical support, including TC74VCX541FTEL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC74VCX541FTEL requirements.
6.How does Aetrix verify that TC74VCX541FTEL is sourced from the original manufacturer or authorized distributors?
All TC74VCX541FTEL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC74VCX541FTEL meets industry standards.
7.What is the process for return or replacement of TC74VCX541FTEL?
All TC74VCX541FTEL units undergo pre-shipment inspection (PSI). If there is an issue with TC74VCX541FTEL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC74VCX541FTEL part is unused and in its original packaging.
Return procedure for TC74VCX541FTEL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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