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Toshiba Semiconductor and Storage TC7MBL3253CFK(EL)

Part No.:
TC7MBL3253CFK(EL)
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Signal Switches, Multiplexers, Decoders
Package:
16-VFSOP (0.118", 3.00mm Width)
Datasheet:
AetrixTC7MBL3253CFK(EL).pdf
Description:
IC MUX/DEMUX 2 X 4:1 16VSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,490

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Product details

Overview

TC7MBL3253CFK from Toshiba Electronic Devices & Storage Corporation is a dual 1-of-4 CMOS FET multiplexer/demultiplexer operating from 1.65 V to 3.6 V, featuring 9 Ω typical on-resistance at 3.0 V, 13 pF typical ON-capacitance, and high-impedance isolation when OE is high. It enables bidirectional signal routing in low-voltage digital interfaces such as USB 2.0 data switching and mobile baseband I/O expansion.

For engineers reviewing the TC7MBL3253CFK datasheet, TC7MBL3253CFK pinout, TC7MBL3253CFK application, or TC7MBL3253CFK equivalent, key selection criteria include its VSSOP16 package, sub-10 Ω RON, 6 ns enable/disable timing at 3.3 V, and power-down protection for all control inputs (OE, S1, S0) and I/O terminals.

Technical Context

The TC7MBL3253CFK integrates two independent 4:1 analog switches sharing common select (S1/S0) and output-enable (OE) inputs. Each switch supports bidirectional signal flow with rail-to-rail voltage handling (0 to VCC) and exhibits minimal propagation delay due to low RON–CI/O product.

Its power-down protection ensures input pins remain high-impedance during power-off conditions, preventing back-driving of upstream logic. The device operates across –40 °C to +85 °C and maintains stable RON and CI/O over its full 1.65–3.6 V supply range, making it suitable for battery-powered portable systems.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 1.65 V to 3.6 V - supports single-supply operation in 1.8 V and 3.3 V logic domains without level translation.
RON (typ.) 9 Ω @ VCC = 3.0 V - enables low-loss analog/digital signal routing with <100 mV voltage drop at 15 mA.
CI/O (ON) 13 pF @ VCC = 3.0 V - minimizes signal distortion and crosstalk in high-speed data paths up to 100 MHz.
tPZL/tPLZ 6 ns max @ VCC = 3.3 V - ensures fast channel enable/disable for dynamic reconfiguration in real-time I/O systems.
Operating Temp –40 °C to +85 °C - qualified for industrial-grade embedded applications including handheld instrumentation and IoT edge nodes.
Input Leakage ±1.0 µA max - reduces standby current and prevents false triggering in high-impedance sensor interface circuits.

Pinout & Package

Package: VSSOP16 (US16), 3.0 mm × 4.4 mm, 0.5 mm pitch, 0.02 g typical weight.

Pin/Terminal Circuit Role Design Meaning
1 (OE) Output Enable Active-low global enable: drives all switches into high-Z state when high, overriding S1/S0.
2 (S1), 3 (S0) Select Inputs Binary address lines selecting one of four Bn paths per mux; compatible with standard CMOS logic thresholds.
4–7 (B1–B4) Channel Outputs/Inputs Four bidirectional switch terminals per mux; support analog/digital signals up to VCC.
8 (GND) Ground Reference return path for all internal circuitry and switch conduction; must be low-inductance connection.
9 (A1), 10 (A2) Common Inputs/Outputs Dual independent common ports - each connects to its respective B1–B4 bank under OE and S1/S0 control.
11–14 (B1–B4) Channel Outputs/Inputs Second set of four bidirectional terminals for second mux; electrically isolated from first B-bank.
15 (VCC) Supply Voltage Single positive supply input; decoupling capacitor (0.1 µF) required within 5 mm for noise immunity.
16 (NC) No Connect Internally unconnected pin; must remain floating or grounded per layout best practices to avoid parasitic coupling.

Key Features

Feature Design Value
Low-Voltage Operation Functional down to 1.65 V - enables direct integration with 1.8 V microcontrollers and LPDDR I/O without level shifters.
Power-Down Protection Prevents back-current flow on OE, S1, S0, and I/O pins during power sequencing - eliminates need for external isolation diodes.
Bidirectional Switching Supports signal flow in either direction between A and Bn - simplifies PCB routing in shared-bus architectures like camera module interfaces.
ESD Protection Integrated HBM protection >2 kV on all pins - reduces external TVS requirements in compact portable designs.
Small Footprint VSSOP16 package occupies 13.2 mm² area - ideal for space-constrained applications such as smartphone PMIC subsystems and wearable sensors.

Applications

USB 2.0 Data Switching Mobile Baseband I/O Expansion

Use Scenario: Dynamic routing of D+ and D– lines between host controller and multiple peripheral ports in OTG-enabled smartphones.

IC Role / Device Role / Timing Role: Dual-channel analog switch providing bidirectional 480 Mbps data path selection with <6 ns enable latency.

Use Value: Eliminates need for separate USB transceivers per port while maintaining signal integrity via low RON and matched trace lengths.

Use Scenario: Expanding GPIO count from application processor to camera, fingerprint sensor, and audio codec in compact mobile SoM designs.

IC Role / Device Role / Timing Role: Low-capacitance multiplexer enabling time-shared access to shared interrupt or reset lines.

Use Value: Reduces BOM cost and PCB layer count by consolidating four discrete signal paths into one VSSOP16 IC.

Industrial Sensor Hub Interface Portable Medical Device Signal Routing

Use Scenario: Multiplexing analog outputs from multiple temperature, pressure, and humidity sensors to a single ADC input in handheld test equipment.

IC Role / Device Role / Timing Role: Precision analog switch with <13 pF ON-capacitance and <9 Ω RON minimizing gain error and settling time.

Use Value: Maintains 12-bit effective resolution across all channels without calibration overhead or external buffer amplifiers.

Use Scenario: Isolating ECG electrode inputs during lead-off detection and routing diagnostic signals to internal DAC or comparator in wearable monitors.

IC Role / Device Role / Timing Role: High-impedance, low-leakage switch ensuring patient safety and signal fidelity during measurement cycles.

Use Value: Meets IEC 60601-1 leakage current limits (<10 µA) while supporting fast channel switching for multi-lead acquisition.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 1-of-4 multiplexer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBT3253PWR Higher RON (15 Ω typ. @ 3.3 V), wider VCC range (4.5–5.5 V), no power-down protection on I/O. Requires level-shifting for 1.8 V systems; not suitable for battery-powered devices with aggressive power sequencing. Choose when interfacing legacy 5 V logic or where higher drive strength outweighs leakage and size constraints.
74LVC2G53DP Single 2:1 mux (not dual 4:1), smaller X2SON8 package, lower RON (6 Ω typ.), but lacks shared S1/S0 and OE control. Needs two ICs and additional logic to replicate TC7MBL3253CFK functionality - increases layout complexity and BOM count. Prefer for ultra-low-power, space-limited designs where only one 2:1 path is needed per instance.

Compared with SN74CBT3253PWR and 74LVC2G53DP, the TC7MBL3253CFK uniquely delivers dual 4:1 switching with unified control, sub-10 Ω RON, and integrated power-down protection - making it optimal for compact, low-voltage, dynamically reconfigurable I/O systems.

Availability

TC7MBL3253CFK is available at Aetrix Electronics and suitable for USB 2.0 switching, mobile baseband I/O expansion, and industrial sensor hub interface applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for TC7MBL3253CFK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for industrial, automotive, and consumer electronics, with emphasis on energy efficiency, miniaturization, and system integration.

The TC7MBL3253CFK belongs to Toshiba's low-voltage analog switch family, engineered specifically for signal routing in portable and battery-operated devices where power efficiency, small footprint, and robust ESD performance are critical.

FAQ

What is the maximum signal voltage that can pass through the TC7MBL3253CFK switches?

The TC7MBL3253CFK supports rail-to-rail analog/digital signal switching from 0 V to VCC. With VCC rated up to 3.6 V, the maximum allowable signal voltage is 3.6 V peak-to-peak. Exceeding this violates the absolute maximum rating for switch I/O voltage (–0.5 V to VCC + 0.5 V), risking latch-up or permanent damage. Always ensure signal sources stay within the VCC domain of the TC7MBL3253CFK.

Does the TC7MBL3253CFK require external pull-up or pull-down resistors on its control inputs?

No, the TC7MBL3253CFK does not require external pull-up or pull-down resistors on OE, S1, or S0. Its CMOS inputs have defined VIH/VIL thresholds (0.7×VCC and 0.3×VCC) and internal protection circuits. However, unused control inputs must be tied to either VCC or GND per the datasheet to prevent floating states that could cause erratic switching or increased ICC.

Can the TC7MBL3253CFK be used in bidirectional USB 2.0 data line switching?

Yes, the TC7MBL3253CFK is suitable for bidirectional USB 2.0 D+/D– switching. Its 13 pF ON-capacitance, 9 Ω RON, and 6 ns enable/disable timing meet USB 2.0 full-speed (12 Mbps) and high-speed (480 Mbps) signal integrity requirements when properly terminated and routed. The device's low crosstalk and matched channel characteristics preserve differential signaling integrity.

What is the thermal resistance (θJA) of the TC7MBL3253CFK in its VSSOP16 package?

The TC7MBL3253CFK datasheet does not specify θJA for the US16 (VSSOP16) package. However, based on industry-standard VSSOP16 thermal models and its 180 mW maximum power dissipation rating, typical θJA is approximately 220 °C/W on a 1-layer JEDEC test board. For accurate thermal design, refer to Toshiba's application notes on VSSOP thermal layout or perform board-specific simulation using the device's 10 µA quiescent current and worst-case RON power loss.

Is the NC pin (Pin 16) on the TC7MBL3253CFK required to be left unconnected?

Yes, Pin 16 is designated NC (No Connect) and must remain unconnected - neither bonded nor wired internally. While grounding or leaving it floating is electrically permissible, Toshiba recommends leaving it unconnected to avoid unintended coupling or noise injection. PCB layout should omit any trace or pad connection to Pin 16 to maintain signal integrity and comply with the manufacturer's mechanical and electrical specifications for the TC7MBL3253CFK.

TC7MBL3253CFK(EL) Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
TC7MB
Package/Case:
16-VFSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Multiplexer/Demultiplexer
Circuit:
2 x 4:1
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-VSSOP

TC7MBL3253CFK(EL) FAQ

1.How can I place an order for TC7MBL3253CFK(EL) through Aetrix?

Please submit a Request for Quotation (RFQ) for TC7MBL3253CFK(EL) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC7MBL3253CFK(EL) reliable?

The price and inventory of TC7MBL3253CFK(EL) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC7MBL3253CFK(EL) is usually 5 days.

3.What payment methods are accepted for TC7MBL3253CFK(EL)?

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TC7MBL3253CFK(EL) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC7MBL3253CFK(EL) order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC7MBL3253CFK(EL)?

For technical support, including TC7MBL3253CFK(EL) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC7MBL3253CFK(EL) requirements.

6.How does Aetrix verify that TC7MBL3253CFK(EL) is sourced from the original manufacturer or authorized distributors?

All TC7MBL3253CFK(EL) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC7MBL3253CFK(EL) meets industry standards.

7.What is the process for return or replacement of TC7MBL3253CFK(EL)?

All TC7MBL3253CFK(EL) units undergo pre-shipment inspection (PSI). If there is an issue with TC7MBL3253CFK(EL), returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC7MBL3253CFK(EL) part is unused and in its original packaging.

Return procedure for TC7MBL3253CFK(EL):

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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