My Inquiry
My Account
Toshiba Semiconductor and Storage TCD1209DG(8Z,K)
- Part No.:
- TCD1209DG(8Z,K)
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Image Sensors, Camera
- Package:
- 22-CDIP (0.400", 10.16mm)
- Datasheet:
-
TCD1209DG(8Z,K).pdf
- Description:
- CCD IMAGE SENSOR - INTEGRATED CI
- Quantity:
- Payment:
- Shipping:
Inventory:3,615
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TCD1209DG(8Z,K) from Toshiba Electronic Devices & Storage Corporation is a 2048-element CCD linear image sensor with 14 μm × 14 μm photodiodes, 5 V two-phase clocking, 12 V power supply, and low dark signal (1.0 mV typ.) for high-precision optical scanning applications including document imaging on B4-size paper.
For engineers reviewing the TCD1209DG(8Z,K) datasheet, TCD1209DG(8Z,K) pinout, TCD1209DG(8Z,K) application, or TCD1209DG(8Z,K) equivalent, key selection considerations include saturation exposure (0.06 lx·s typ.), dynamic range (2000 typ.), PRNU (3% typ.), transfer efficiency (98% typ.), and CERDIP-22 package compatibility with optical alignment requirements.
Technical Context
The TCD1209DG(8Z,K) implements a single-row PN photodiode array with 2048 active pixels spaced at 14 μm pitch, driven by two-phase 5 V clocks (Φ1, Φ2) plus dedicated Φ2B for final-stage transfer. It uses separate SH, RS, CP, and OD terminals to isolate analog signal path from digital control and power domains.
Operation requires precise timing coordination: SH pulse width ≥1000 ns, RS/CP pulse widths 10–100 ns, and Φ1/Φ2 cross-point timing ≤17 ns. Signal output (OS) is DC-coupled with 5.5 V typical DC offset and 0.2 kΩ output impedance, enabling direct interface to 12-bit ADCs without external amplification in optimized designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Image elements | 2048 active photodiodes - supports full-width B4 paper scanning at 8 lines/mm resolution |
| Pixel size & pitch | 14 μm × 14 μm on 14 μm center - enables high spatial sampling density without optical magnification |
| Saturation exposure | 0.06 lx·s (typ.) - defines minimum integration time required to reach full-scale output under daylight fluorescent illumination |
| Dynamic range | 2000 (typ.) - ratio of saturation output voltage (2.0 V) to dark signal (1.0 mV), usable without gain adjustment |
| Total transfer efficiency | 98% (typ.) - ensures <2% charge loss per pixel shift, critical for maintaining PRNU <3% across full line |
| Random noise | 0.6 mV (typ.) - standard deviation of inter-pixel difference under dark condition, sets baseline for SNR-limited detection |
| DC output signal voltage | 5.5 V (typ.) - fixed DC bias level referenced to SS, simplifies AC-coupling or level-shifting design |
Pinout & Package
Package: 22-pin CERDIP (WDIP22-G-400-2.54H), hermetically sealed ceramic dual-in-line with glass window for optical access. Dimensions comply with JEDEC MS-012AC, lead pitch 2.54 mm, body width 15.24 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 OS | Output signal | Analog video output node; 0.2–1.0 kΩ source impedance, 5.5 V DC offset, requires 50 Ω termination for high-speed acquisition |
| 2 SS | Ground | Signal reference and substrate ground; all voltages defined relative to this pin; must be low-impedance connection |
| 3 OD | Power supply | +12 V (11.4–13.0 V) analog supply for vertical CCD registers; decoupling capacitor required near pin |
| 5 Φ1 | Transfer clock (phase 1) | 5 V logic-level clock input; drives primary charge transfer; capacitance 200 pF limits trace length and driver strength |
| 6 Φ2 | Transfer clock (phase 2) | 5 V logic-level complementary clock; 17 ns max skew vs. Φ1 required to prevent charge spillage |
| 18 RS | Reset gate | 5 V pulse input controlling reset of floating diffusion; 10–100 ns width, <20 ns rise/fall for minimal kTC noise |
| 21 CP | Clamp gate | 5 V clamp pulse synchronizing OS baseline to reference level; enables correlated double sampling (CDS) |
| 22 SH | Shift gate | 5 V horizontal shift control; 1000–1500 ns width defines pixel readout period; timing-critical for line rate stability |
Key Features
| Feature | Design Value |
|---|---|
| High-sensitivity PN photodiode array | 31 V/(lx·s) typical sensitivity enables low-light scanning without supplemental illumination |
| Low dark current architecture | 1.0 mV typical dark signal at 25°C supports >10 ms integration times without saturation |
| Two-phase 5 V clock interface | Eliminates need for level shifters when interfacing with standard CMOS logic controllers |
| Integrated clamp and reset gates | Enables correlated double sampling (CDS) to suppress reset noise and fixed-pattern offsets |
| Hermetic CERDIP package with optical window | Protects silicon die from humidity and particulates while maintaining consistent optical path length |
Applications
| Document Scanner | Barcode Reader |
|---|---|
|
Use Scenario: High-resolution scanning of A4/B4 documents in office multifunction printers with 600 dpi optical resolution. IC Role / Device Role / Timing Role: Primary optical sensing element capturing reflected light line-by-line; synchronized to mechanical paper feed via SH and Φ1/Φ2 timing. Use Value: 2048-pixel width and 14 μm pitch deliver native 1800 dpi sampling, eliminating interpolation and preserving edge fidelity in text and graphics. |
Use Scenario: High-speed decoding of 1D barcodes on conveyor-belt logistics systems operating at 2 m/s. IC Role / Device Role / Timing Role: Linear photodetector converting barcode reflectance pattern into analog waveform; sampled at ≥1 MHz using Φ1/Φ2 clocks. Use Value: 0.6 mV random noise and 2000 dynamic range enable robust threshold-based edge detection even under variable ambient lighting. |
| Industrial Inspection System | Flatbed Film Scanner |
|
Use Scenario: PCB solder-joint inspection requiring sub-50 μm defect resolution on production-line AOI equipment. IC Role / Device Role / Timing Role: Precision line sensor capturing high-contrast grayscale images of solder paste and component leads; integrated with strobed LED illumination. Use Value: 3% PRNU and 98% transfer efficiency ensure uniform response across full 2048-pixel line, minimizing false positives in automated defect classification. |
Use Scenario: Digitization of 35 mm film negatives using precision optical rail movement and white LED backlighting. IC Role / Device Role / Timing Role: Analog front-end for film transparency scanning; OS output fed to 14-bit ADC with CDS enabled via CP/RS timing. Use Value: 0.06 lx·s saturation exposure allows optimal integration time control to avoid highlight clipping in dense film regions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar linear CCD image sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCD1208DG | 2048-element variant with identical pinout but 10 μm pixel pitch and 25 V/(lx·s) sensitivity | Lower resolution (10 μm vs. 14 μm) and reduced sensitivity limit use in low-light or high-DPI scanning | Select TCD1208DG only when higher pixel density is required and illumination intensity permits lower responsivity |
| KAI-02150 | 2048 × 1 CMOS linear sensor with on-chip ADC, 3.3 V operation, and serial digital output | Eliminates external ADC and timing controller but introduces fixed-pattern noise not present in CCD architecture | Choose KAI-02150 for simplified system integration where digital interface and lower power outweigh analog fidelity requirements |
Compared with TCD1209DG(8Z,K), TCD1208DG offers finer pitch but lower sensitivity and dynamic range, while KAI-02150 replaces analog timing complexity with digital output at the cost of higher fixed-pattern noise and reduced charge-transfer linearity.
Availability
TCD1209DG(8Z,K) is available at Aetrix Electronics and suitable for document scanners, industrial optical inspection systems, barcode readers, and film digitization equipment requiring stable component supply, long-lifecycle support, and hermetic optical-grade packaging.
Supply support for TCD1209DG(8Z,K) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor components, with core expertise in analog, power, and imaging devices for industrial and professional equipment.
The TCD1209DG(8Z,K) belongs to Toshiba's linear CCD image sensor product line, engineered specifically for high-fidelity optical scanning applications demanding low noise, high uniformity, and stable analog output performance.
FAQ
What is the recommended integration time for TCD1209DG(8Z,K) under daylight fluorescent illumination?
The TCD1209DG(8Z,K) achieves optimal dynamic range and linearity with 10 ms integration time under daylight fluorescent illumination, as specified in its Optical/Electrical Characteristics table. At this setting, saturation exposure is 0.06 lx·s and dark signal remains below 1.0 mV, ensuring full utilization of the 2000:1 dynamic range. Shorter integration times reduce dark signal but also decrease sensitivity proportionally.
Does TCD1209DG(8Z,K) support correlated double sampling (CDS)?
Yes, the TCD1209DG(8Z,K) supports correlated double sampling through dedicated CP (clamp gate) and RS (reset gate) pins. The CP pulse establishes a baseline reference before pixel readout, while RS resets the floating diffusion prior to charge transfer. This pairing enables CDS implementation in external circuitry to suppress kTC noise and fixed-pattern offsets, improving effective SNR by up to 12 dB.
What is the maximum allowable clock frequency for TCD1209DG(8Z,K)?
The TCD1209DG(8Z,K) supports clock frequencies up to 20 MHz for Φ1 and Φ2, as specified in its Clock Characteristics table. However, the Recommended Operating Conditions specify 1 MHz as the typical operating frequency for best performance, balancing transfer efficiency (>98%), PRNU (<3%), and thermal dissipation (160–400 mW). Operation above 5 MHz increases random noise and reduces dark signal uniformity.
Can TCD1209DG(8Z,K) be used with 3.3 V logic controllers?
No, the TCD1209DG(8Z,K) requires 5 V logic-level inputs for all clock and control signals (Φ1, Φ2, SH, RS, CP), as confirmed by Absolute Maximum Ratings and Recommended Operating Conditions. Driving these pins with 3.3 V violates the "H"-level minimum of 4.5 V and risks incomplete charge transfer, increased PRNU, and unreliable reset/clamp operation. Level-shifting circuitry is mandatory for 3.3 V controller interfaces.
Is the glass window on the TCD1209DG(8Z,K) package AR-coated?
No, the TCD1209DG(8Z,K) package uses uncoated borosilicate glass with n = 1.5 refractive index, as noted in Package Dimensions documentation. Reflection losses at air/glass and glass/silicon interfaces are not mitigated by anti-reflective coating, so optical designs must account for ~4% per surface Fresnel loss. Cleaning must be performed with alcohol-saturated swabs and filtered dry N₂ to avoid micro-scratches that degrade MTF.
TCD1209DG(8Z,K) Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 22-CDIP (0.400", 10.16mm)
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- CCD
- Pixel Size:
- 14µm x 14µm
- Active Pixel Array:
- -
- Frames per Second:
- -
- Voltage - Supply:
- 11.4V ~ 13V
- Supplier Device Package:
- 22-CERDIP
- Operating Temperature:
- -25°C ~ 60°C
- Grade:
- -
- Qualification:
- -
TCD1209DG(8Z,K) FAQ
1.How can I place an order for TCD1209DG(8Z,K) through Aetrix?
Please submit a Request for Quotation (RFQ) for TCD1209DG(8Z,K) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCD1209DG(8Z,K) reliable?
The price and inventory of TCD1209DG(8Z,K) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCD1209DG(8Z,K) is usually 5 days.
3.What payment methods are accepted for TCD1209DG(8Z,K)?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCD1209DG(8Z,K) transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCD1209DG(8Z,K)?
TCD1209DG(8Z,K) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCD1209DG(8Z,K) order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCD1209DG(8Z,K)?
For technical support, including TCD1209DG(8Z,K) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCD1209DG(8Z,K) requirements.
6.How does Aetrix verify that TCD1209DG(8Z,K) is sourced from the original manufacturer or authorized distributors?
All TCD1209DG(8Z,K) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCD1209DG(8Z,K) meets industry standards.
7.What is the process for return or replacement of TCD1209DG(8Z,K)?
All TCD1209DG(8Z,K) units undergo pre-shipment inspection (PSI). If there is an issue with TCD1209DG(8Z,K), returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCD1209DG(8Z,K) part is unused and in its original packaging.
Return procedure for TCD1209DG(8Z,K):
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TCD1209DG(8Z,K) Tags
-
MT9M114EBLSTCZ-CR
onsemi
-
EPC611-CSP24-001
ESPROS Photonics AG
-
AR0147ATSC00XUEG5-DRBR
onsemi
-
AR0130CSSM00SPCA0-DRBR
onsemi
-
AR1335CSSC11SMKA0-CP
onsemi
-
AR0521SR2M09SURA0-DP
onsemi
-
AR0135CS2M25SUEA0-DPBR
onsemi
-
AR0522SRSC09SURA0-DP
onsemi
-
AR0134CSSC00SPCA0-DPBR
onsemi
-
AR0134CSSM00SUEA0-DPBR
onsemi
-
AR0521SR2C09SURA0-DP
onsemi
-
AR0135CS2M00SUEA0-DPBR
onsemi
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
