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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Distribution Switches, Load Drivers

Toshiba Semiconductor and Storage TCK1024G,LF

Name: TCK1024G,LF
Brand: Toshiba Semiconductor and Storage
SKU: TCK1024G,LF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TCK1024G,LF

Manufacturer:: Toshiba Semiconductor and Storage

Category:: Power Distribution Switches, Load Drivers

Package:: 6-UFBGA, WLCSP

Datasheet:: TCK1024G,LF.pdf

Description:: IC PWR SWITCH P-CHAN 1:1 WCSP6E

Quantity:: RFQ Add To RFQ list

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Product details

Overview

TCK1024G,LF from Toshiba Electronic Devices & Storage Corporation is a load switch IC for power management with integrated overcurrent limiting, thermal shutdown, and output auto-discharge functions. It delivers 1540 mA output current limit, 31 mΩ typical ON resistance at 5.0 V input, and ultra-low 25 μA quiescent current-ideal for space-constrained portable devices like smartphones requiring high-density board assembly.

For engineers reviewing the TCK1024G,LF datasheet, TCK1024G,LF pinout, TCK1024G,LF application, or TCK1024G,LF equivalent, this page provides verified functional specifications, WCSP6E package layout, real-world use scenarios in battery-powered systems, and validated alternative parts for supply continuity and design flexibility.

Technical Context

The TCK1024G,LF integrates a low-R_ON N-channel MOSFET power switch with fold-back overcurrent protection, active-high control logic, and true reverse current blocking. Its internal thermal shutdown activates at ~170°C junction temperature with 20°C hysteresis, and UVLO (0.82 V rising threshold) prevents operation under insufficient input voltage.

It features Schmitt-triggered CONTROL input with internal pull-down, enabling safe default-OFF behavior when unconnected. The device supports input voltages from 1.4 V to 5.5 V and maintains stable switching performance across −40°C to +85°C ambient, with rise/fall times under 50 μs into 0.1 μF load capacitance.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Current Limit	1540 mA - sets maximum safe load current before fold-back limiting engages
ON Resistance (R_ON)	31 mΩ (typ.) at VIN = 5.0 V - minimizes conduction loss and voltage drop in high-current paths
Quiescent Current (I_Q)	25 μA (typ.) at VIN = 5.5 V - enables ultra-low standby power in always-on subsystems
Input Voltage Range	1.4 V to 5.5 V - supports Li-ion, Li-poly, and multi-cell battery rails without external regulation
Thermal Shutdown Threshold	~170°C (typ.) with 20°C hysteresis - autonomously protects against sustained overload or poor PCB thermal design
Reverse Blocking Voltage	35 mV threshold - blocks reverse current flow from VOUT to VIN even when switch is OFF
Control Logic Polarity	Active High - simplifies interface with standard GPIOs without level-shifting or inversion

Pinout & Package

Package: WCSP6E (0.8 mm × 1.2 mm, thickness 0.55 mm), ultra-compact wafer-level chip-scale package with solder bumps for high-density SMT assembly.

Pin/Terminal	Circuit Role	Design Meaning
VOUT (A1, B1)	Switch Output Terminal	Power output node connected to load; dual-pin configuration reduces trace resistance and improves current handling
VIN (A2, B2)	Switch Input Terminal	Primary power input; dual-pin layout lowers parasitic inductance and enhances transient response
GND (C1)	Ground Reference	System ground return path; critical for accurate current sensing and thermal dissipation
CONTROL (C2)	Enable/Disable Input	Active-high digital control signal with internal pull-down; ensures fail-safe OFF state during MCU boot or reset

Key Features

Feature	Design Value
True Reverse Current Blocking	Blocks reverse current from VOUT to VIN regardless of switch state-enables safe hot-swap and battery backup isolation
Output Auto-Discharge	Activates internal discharge FET on turn-off to rapidly drain output capacitance-prevents floating voltage and improves system sequencing
Inrush Current Reduction	Soft-start behavior via controlled slew rate limits peak input current during power-up-reduces stress on upstream regulators and capacitors
Under Voltage Lockout (UVLO)	Disables output below 0.82 V input-prevents erratic operation during brown-out or weak battery conditions
Thermal Shutdown with Hysteresis	Shuts down at ~170°C and re-enables only after cooling to ~150°C-avoids oscillation and enables self-recovery in moderate overload

Applications

Smartphone Power Rail Switching	Wearable Sensor Subsystem Enable
Use Scenario: Enabling/disabling camera module or RF transceiver power rail during sleep/wake cycles in LTE/5G handsets. IC Role / Device Role / Timing Role: Load switch controlling isolated 3.3 V or 1.8 V domain with precise current limiting and fast turn-on (<40 μs). Use Value: Prevents inrush-induced voltage droop on shared PMIC outputs and eliminates need for discrete discharge resistors.	Use Scenario: Power gating inertial measurement unit (IMU) and environmental sensors in fitness trackers during inactive periods. IC Role / Device Role / Timing Role: Low-quiescent-current (25 μA) enable switch with auto-discharge for clean power-down sequencing. Use Value: Extends battery life by eliminating leakage through sensor bias networks while ensuring rapid wake-up readiness.
USB-C Peripheral Power Management	Industrial IoT Edge Node Power Control
Use Scenario: Controlling power delivery to USB-C accessory ports with overcurrent protection and reverse-blocking capability. IC Role / Device Role / Timing Role: Load switch with true reverse current blocking (35 mV threshold) and 1540 mA ICL for robust port protection. Use Value: Prevents backfeed from powered peripherals into host system during cable insertion/removal or fault events.	Use Scenario: Isolating cellular modem or LoRa radio power domain in battery-operated remote monitoring nodes. IC Role / Device Role / Timing Role: Thermally robust (−40°C to +85°C) load switch with built-in thermal shutdown for unattended outdoor deployments. Use Value: Eliminates need for external thermal monitoring circuitry while maintaining reliable operation under variable ambient loads.

Smartphone Power Rail Switching

Wearable Sensor Subsystem Enable

Use Scenario: Enabling/disabling camera module or RF transceiver power rail during sleep/wake cycles in LTE/5G handsets.

IC Role / Device Role / Timing Role: Load switch controlling isolated 3.3 V or 1.8 V domain with precise current limiting and fast turn-on (<40 μs).

Use Value: Prevents inrush-induced voltage droop on shared PMIC outputs and eliminates need for discrete discharge resistors.

Use Scenario: Power gating inertial measurement unit (IMU) and environmental sensors in fitness trackers during inactive periods.

IC Role / Device Role / Timing Role: Low-quiescent-current (25 μA) enable switch with auto-discharge for clean power-down sequencing.

Use Value: Extends battery life by eliminating leakage through sensor bias networks while ensuring rapid wake-up readiness.

USB-C Peripheral Power Management

Industrial IoT Edge Node Power Control

Use Scenario: Controlling power delivery to USB-C accessory ports with overcurrent protection and reverse-blocking capability.

IC Role / Device Role / Timing Role: Load switch with true reverse current blocking (35 mV threshold) and 1540 mA ICL for robust port protection.

Use Value: Prevents backfeed from powered peripherals into host system during cable insertion/removal or fault events.

Use Scenario: Isolating cellular modem or LoRa radio power domain in battery-operated remote monitoring nodes.

IC Role / Device Role / Timing Role: Thermally robust (−40°C to +85°C) load switch with built-in thermal shutdown for unattended outdoor deployments.

Use Value: Eliminates need for external thermal monitoring circuitry while maintaining reliable operation under variable ambient loads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar load switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TCK2065G	1110 mA output current limit; otherwise identical feature set and pinout	Suitable where lower current rating suffices and margin for thermal derating is acceptable	Select when system peak load remains below 1.1 A and board layout allows same WCSP6E footprint
TPS22916BYFPR	TI part: 2-A limit, 27-mΩ R_ON, but no true reverse current blocking or UVLO; different pinout (DSBGA6)	Lacks full-time reverse blocking and UVLO-requires external protection for hot-swap or brown-out resilience	Choose only if higher current and lower R_ON outweigh need for integrated reverse blocking and UVLO

Compared with TCK2065G and TPS22916BYFPR, the TCK1024G,LF offers the highest current rating (1540 mA) within its family while retaining full protection integration-including true reverse blocking and UVLO-enabling simpler, more robust power domain control in compact portable designs.

Availability

TCK1024G,LF is available at Aetrix Electronics and suitable for smartphone power rail switching, wearable sensor subsystem enable, and USB-C peripheral power management requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for TCK1024G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on power efficiency and miniaturization.

The TCK series load switches are engineered specifically for portable electronics power management-delivering ultra-low IQ, small WCSP packages, and comprehensive protection features to meet stringent space and battery-life requirements.

FAQ

What is the maximum continuous output current supported by the TCK1024G,LF?

The TCK1024G,LF supports a guaranteed output current limit of 1540 mA under typical operating conditions (VIN = 5.5 V). This fold-back current limit activates to protect both the IC and downstream circuitry during overload or short-circuit events. Actual sustainable current depends on PCB thermal design, ambient temperature, and input voltage-derating is recommended per Toshiba's reliability guidelines.

Does the TCK1024G,LF include true reverse current blocking, and how does it function?

Yes, the TCK1024G,LF includes built-in true reverse current blocking (TRCB) that actively prevents current flow from VOUT to VIN regardless of the switch state. It triggers when VOUT exceeds VIN by >35 mV and releases when the differential falls below −15 mV. This feature is confirmed in Toshiba's Function Table and Electrical Characteristics (Note 2), making TCK1024G,LF suitable for applications requiring hot-swap safety and battery backup isolation.

What is the control pin behavior when left unconnected on the TCK1024G,LF?

When the CONTROL pin of the TCK1024G,LF is left unconnected (open), the internal pull-down resistor (a few MΩ) ensures the pin defaults to logic LOW, placing the device in the OFF state. This fail-safe behavior is explicitly documented in Toshiba's Application Note and eliminates risk of unintended power-up during system initialization or MCU reset sequences.

What package type and dimensions does the TCK1024G,LF use?

The TCK1024G,LF uses the WCSP6E wafer-level chip-scale package measuring 0.8 mm × 1.2 mm with 0.55 mm thickness and 0.4 mm pitch. Its six-bump layout (VOUT/VIN/GND/VIN/VOUT/CONTROL) is optimized for minimal PCB area and high-density routing. Land pattern dimensions and solder mask recommendations are provided in Toshiba's Package Drawing (Document Page 12).

How does the thermal shutdown function operate in the TCK1024G,LF?

The TCK1024G,LF incorporates an internal thermal shutdown circuit that disables the power switch when junction temperature exceeds ~170°C (typical). Once triggered, the device remains off until junction temperature cools to ~150°C due to built-in hysteresis-preventing oscillatory behavior. This protection is active across the full operating range and is independent of control signal state, ensuring robustness under sustained overload or poor thermal design.

TCK1024G,LF Specifications

Product attributes: Attribute value

Manufacturer:: Toshiba Semiconductor and Storage

Package/Case:: 6-UFBGA, WLCSP

Series:: -

Packaging:: Tape & Reel (TR)

Product Status:: Active

Switch Type:: General Purpose

Number of Outputs:: 1

Ratio - Input:Output:: 1:1

Output Configuration:: High Side

Output Type:: P-Channel

Interface:: On/Off

Voltage - Load:: 1.4V ~ 5.5V

Voltage - Supply (Vcc/Vdd):: -

Current - Output (Max):: 1.54A

Rds On (Typ):: 31mOhm

Input Type:: Non-Inverting

Features:: Load Discharge

Fault Protection:: Current Limiting (Fixed), Over Temperature, Reverse Current

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 6-WCSPE (0.80x1.2)

TCK1024G,LF FAQ

1.How can I place an order for TCK1024G,LF through Aetrix?

Please submit a Request for Quotation (RFQ) for TCK1024G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCK1024G,LF reliable?

The price and inventory of TCK1024G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK1024G,LF is usually 5 days.

3.What payment methods are accepted for TCK1024G,LF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK1024G,LF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCK1024G,LF?

TCK1024G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCK1024G,LF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCK1024G,LF?

For technical support, including TCK1024G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK1024G,LF requirements.

6.How does Aetrix verify that TCK1024G,LF is sourced from the original manufacturer or authorized distributors?

All TCK1024G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK1024G,LF meets industry standards.

7.What is the process for return or replacement of TCK1024G,LF?

All TCK1024G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK1024G,LF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCK1024G,LF part is unused and in its original packaging.

Return procedure for TCK1024G,LF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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