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Toshiba Semiconductor and Storage TCK206G,LF

Part No.:
TCK206G,LF
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Power Distribution Switches, Load Drivers
Package:
4-XFBGA, CSPBGA
Datasheet:
AetrixTCK206G,LF.pdf
Description:
IC PWR SWITCH N-CHAN 1:1 4WCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,489

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Product details

Overview

TCK206G,LF from Toshiba Electronic Devices & Storage Corporation is a 0.75 V ultra-low-voltage load switch IC with reverse current blocking, 18.4 mΩ typical ON resistance at 0.75 V/−1.5 A, 2.0 A DC output capability, and slew rate control-designed for power management in space-constrained portable electronics such as smartphones.

For engineers reviewing the TCK206G,LF datasheet, TCK206G,LF pinout, TCK206G,LF application, or TCK206G,LF equivalent, key selection considerations include its active-high control with internal pull-down, absence of auto-discharge function, ultra-small WCSP4C package (0.9 mm × 0.9 mm), and guaranteed operation down to 0.75 V input.

Technical Context

The TCK206G,LF integrates a single N-channel MOSFET pass switch with built-in reverse current blocking activated during OFF state, eliminating external back-to-back FETs. Its slew rate control driver limits inrush current by shaping VOUT rise time to 180 μs (typ.) at VIN = 0.75 V with 500 Ω/0.1 μF load.

Unlike TCK207G and TCK208G, TCK206G,LF lacks output auto-discharge and uses an active-high CONTROL pin with internal pull-down to GND-ensuring default OFF state when un-driven. It supports input voltages from 0.75 V to 3.6 V and operates across −40 °C to +85 °C.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range0.75 V to 3.6 V - enables direct integration into sub-1V core rails and multi-rail PMIC outputs.
ON Resistance18.4 mΩ (typ.) at 0.75 V/−1.5 A - minimizes conduction loss and thermal rise under low-VIN, high-current conditions.
Output Current2.0 A DC - supports high-current peripherals like camera modules or RF front-ends without external current limiting.
VOUT Rise Time180 μs (typ.) at VIN = 0.75 V - controlled inrush prevents supply rail collapse during hot-plug events.
Reverse Blocking Current≤10 μA max at VOUT = 3.6 V/VIN = 0 V - blocks leakage from downstream circuits back into powered-off domains.
Quiescent Current22 μA (typ.) in ON state - negligible bias consumption for always-on subsystems.
Standby Current5 μA max in OFF state - preserves battery life in standby modes of portable devices.

Pinout & Package

Package: WCSP4C (0.9 mm × 0.9 mm, 0.5 mm pitch, 0.5 mm height, 0.9 mg typical weight) - optimized for ultra-dense mobile PCB layouts with minimal board area footprint.

Pin/TerminalCircuit RoleDesign Meaning
CONTROL (B2)Active-high logic input with internal ~MΩ pull-downDrives internal pass FET; defaults to OFF if left floating; compatible with 0.75–3.6 V logic levels.
GND (B1)Power ground referenceReturn path for both control circuitry and power switch; must be low-impedance connection to system ground plane.
VIN (A2)Main power inputAccepts 0.75–3.6 V supply; requires ≥1.0 μF ceramic capacitor placed adjacent to minimize input ripple and transient droop.
VOUT (A1)Switched outputDelivers regulated load current up to 2.0 A; reverse current blocking active when CONTROL = LOW.

Key Features

FeatureDesign Value
Ultra-low 0.75 V minimum input voltageEnables direct switching of advanced low-power SoC I/O or memory rails without level-shifting or boost conversion.
Integrated reverse current blockingEliminates need for external back-to-back FETs or diodes, reducing BOM count and layout complexity in battery-isolated domains.
Slew rate–controlled turn-onPrevents large inrush currents that could destabilize shared power rails or trigger overcurrent protection in upstream supplies.
Internal pull-down on CONTROL pinGuarantees safe default-OFF behavior during power-up, reset, or MCU GPIO initialization-no external resistor required.
WCSP4C ultra-small packageReduces occupied PCB area to <1 mm², critical for antenna clearance zones and stacked-die module designs in modern smartphones.

Applications

Smartphone Camera Module PowerWearable Sensor Subsystem

Use Scenario: Powering image sensor and ISP during capture bursts while isolating from main SoC rail.

IC Role / Device Role / Timing Role: Load switch controlling 1.2 V or 1.8 V sensor domain with reverse blocking to prevent backfeed during sleep.

Use Value: 18.4 mΩ RON ensures <22 mV drop at 1.2 A, preserving sensor analog performance; 180 μs soft-start avoids disrupting RF transceiver operation.

Use Scenario: Enabling/disabling BLE radio and inertial measurement unit (IMU) in hearables or smart bands.

IC Role / Device Role / Timing Role: Low-voltage (0.8–1.2 V) power gate with guaranteed 0.75 V start-up for energy-harvesting or coin-cell–powered subsystems.

Use Value: 22 μA quiescent current extends battery life beyond 6 months in intermittent-sensing applications; WCSP4C fits within 2.5 mm × 2.5 mm module footprints.

USB-C Port Power ManagementPortable Medical Diagnostic Device

Use Scenario: Isolating VBUS-powered accessories (e.g., USB audio DACs) from host device during enumeration or fault conditions.

IC Role / Device Role / Timing Role: Reverse-current–blocking switch on 3.3 V auxiliary rail with fast 8 μs turn-off delay to meet USB PD fault response timing.

Use Value: ≤10 μA reverse leakage prevents battery drain when accessory is disconnected; active-high CONTROL synchronizes cleanly with USB controller GPIOs.

Use Scenario: Sequencing power to ECG front-end amplifier and ADC in handheld patient monitors.

IC Role / Device Role / Timing Role: Precision-controlled 1.5 V rail switch ensuring no undershoot/overshoot during activation of sensitive analog signal chains.

Use Value: Slew rate control limits dV/dt to <2 V/ms, avoiding latch-up in op-amps; −40 °C to +85 °C rating supports clinical environment operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar load switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TCK207G,LFIncludes output auto-discharge and same WCSP4C package; otherwise identical electrical specs and pinout.Required where rapid VOUT discharge (<50 μs fall time) is needed after shutdown to meet system-level reset timing.Select TCK207G,LF only if auto-discharge is mandatory; TCK206G,LF saves cost and avoids unnecessary discharge current in static loads.
TPS22916BYFPRTI part in DSBGA4 (0.9 mm × 0.9 mm); 17 mΩ RON at 1.2 V but minimum VIN = 1.0 V; no reverse blocking.Lacks reverse current blocking-requires external diode or dual-FET solution for backfeed prevention.Choose TCK206G,LF over TPS22916BYFPR when reverse blocking is essential and sub-1V operation is required.

Compared with TCK207G,LF and TPS22916BYFPR, the TCK206G,LF uniquely delivers guaranteed 0.75 V operation with integrated reverse blocking in the same ultra-small WCSP4C footprint-making it optimal for lowest-voltage, highest-density battery-powered systems where auto-discharge is not needed.

Availability

TCK206G,LF is available at Aetrix Electronics and suitable for smartphone camera modules, wearable sensor subsystems, USB-C port power management, and portable medical diagnostic devices requiring stable component supply across long-lifecycle consumer electronics programs.

Supply support for TCK206G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures high-efficiency, miniaturized semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on power management and analog integration.

The TCK206G,LF belongs to Toshiba's ultra-low-voltage load switch IC family, engineered specifically for space- and power-constrained portable electronics requiring robust reverse-current protection and seamless integration into sub-1V power domains.

FAQ

What is the minimum input voltage supported by the TCK206G,LF?

The TCK206G,LF supports a minimum input voltage of 0.75 V, enabling direct use with emerging ultra-low-voltage rails such as 0.8 V GPU cores or energy-harvesting sources. This specification is guaranteed across the full operating temperature range of −40 °C to +85 °C and is validated per Toshiba's Electrical Characteristics table.

Does the TCK206G,LF provide reverse current blocking, and how is it implemented?

Yes, the TCK206G,LF provides reverse current blocking in the SW OFF state, with maximum leakage of 10 μA at VOUT = 3.6 V and VIN = 0 V. This function is implemented via internal circuitry that disables the body diode path of the integrated N-channel MOSFET, eliminating need for external back-to-back FETs. The feature is active whenever the CONTROL pin is low.

Is the TCK206G,LF pin-compatible with TCK207G,LF or TCK208G,LF?

Yes, the TCK206G,LF shares identical WCSP4C package dimensions, pin assignment, and pinout with TCK207G,LF and TCK208G,LF-including CONTROL (B2), GND (B1), VIN (A2), and VOUT (A1). However, functional differences exist: TCK206G,LF has no auto-discharge and uses active-high control with internal pull-down, unlike TCK207G,LF (auto-discharge, active-high) and TCK208G,LF (auto-discharge, active-low).

What is the typical ON resistance of the TCK206G,LF at 0.75 V input?

The typical ON resistance of the TCK206G,LF is 18.4 mΩ at VIN = 0.75 V and IOUT = −1.5 A, as specified in Toshiba's Electrical Characteristics table. This value is measured under standard test conditions and reflects low conduction loss critical for maintaining voltage regulation in low-VIN, high-current applications.

Does the TCK206G,LF require an external pull-down resistor on the CONTROL pin?

No, the TCK206G,LF includes an internal pull-down resistor (equivalent to several MΩ) between CONTROL and GND, ensuring the device remains in the OFF state when the CONTROL pin is left unconnected or floating. This eliminates the need for an external resistor and simplifies design for systems with limited GPIO drive capability.

TCK206G,LF Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Package/Case:
4-XFBGA, CSPBGA
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Switch Type:
General Purpose
Number of Outputs:
1
Ratio - Input:Output:
1:1
Output Configuration:
High Side
Output Type:
N-Channel
Interface:
On/Off
Voltage - Load:
0.75V ~ 3.6V
Voltage - Supply (Vcc/Vdd):
Not Required
Current - Output (Max):
2A
Rds On (Typ):
18.1mOhm
Input Type:
Non-Inverting
Features:
Slew Rate Controlled
Fault Protection:
Reverse Current
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
4-WCSP (0.90x0.90)

TCK206G,LF FAQ

1.How can I place an order for TCK206G,LF through Aetrix?

Please submit a Request for Quotation (RFQ) for TCK206G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCK206G,LF reliable?

The price and inventory of TCK206G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK206G,LF is usually 5 days.

3.What payment methods are accepted for TCK206G,LF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK206G,LF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCK206G,LF?

TCK206G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCK206G,LF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCK206G,LF?

For technical support, including TCK206G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK206G,LF requirements.

6.How does Aetrix verify that TCK206G,LF is sourced from the original manufacturer or authorized distributors?

All TCK206G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK206G,LF meets industry standards.

7.What is the process for return or replacement of TCK206G,LF?

All TCK206G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK206G,LF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCK206G,LF part is unused and in its original packaging.

Return procedure for TCK206G,LF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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