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Toshiba Semiconductor and Storage TCK208G,LF

Part No.:
TCK208G,LF
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Power Distribution Switches, Load Drivers
Package:
4-UFBGA, WLCSP
Datasheet:
AetrixTCK208G,LF.pdf
Description:
IC PWR SWITCH N-CHAN 1:1 4WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,765

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Product details

Overview

TCK208G,LF from Toshiba Electronic Devices & Storage Corporation is an ultra-low-voltage 0.75 V load switch IC with reverse current blocking, active-low control logic, and integrated output auto-discharge. It delivers 2.0 A DC output current, 18.4 mΩ typical ON resistance at 0.75 V/−1.5 A, and operates across 0.75–3.6 V input range-designed for power rail sequencing in space-constrained portable electronics.

For engineers reviewing the TCK208G,LF datasheet, TCK208G,LF pinout, TCK208G,LF application, or TCK208G,LF equivalent, key selection criteria include its active-low CONTROL interface, WCSP4C package footprint, slew-rate-controlled turn-on/off timing, and guaranteed reverse current blocking in SW OFF state-critical for battery-powered subsystem isolation and voltage rail management.

Technical Context

The TCK208G,LF integrates a single N-channel MOSFET pass switch with charge-pump gate drive enabling reliable operation down to 0.75 V VIN. Its active-low CONTROL pin (VIH = 0.9 V min at VIN ≥ 0.9 V; VIL ≤ 0.4 V) directly interfaces with low-voltage logic without level shifting. Unlike TCK206G/TCK207G, it lacks internal pull-down, requiring external logic assertion for defined startup behavior.

It features dual-MOSFET architecture: Q1 handles main power path conduction and reverse blocking, while Q2 enables controlled VOUT discharge during turn-off. Discharge on-resistance is 380 Ω (typ.), ensuring rapid VOUT decay (<50 μs fall time at 1.2 V) without external components-essential for preventing back-powering of downstream circuits during power-down sequences.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range0.75 V to 3.6 V - supports direct connection to sub-1 V rails (e.g., LPDDR4 I/O, core logic) without boost conversion
Max Output Current (DC)2.0 A - sustains full-rated load under worst-case thermal conditions on standard FR4 PCB
ON Resistance (RON)18.4 mΩ (typ.) at 0.75 V/−1.5 A - limits voltage drop to <28 mV, minimizing power loss in low-VIN applications
Control LogicActive Low - CONTROL high disables output; low enables output and activates auto-discharge
Reverse Current BlockingEnabled in SW OFF state - blocks >99.9% of reverse current (IRB ≤ 10 μA max) when VIN = 0 V, VOUT = 3.6 V
VOUT Fall Time50 μs (typ.) at VIN = 1.2 V, RL = 500 Ω, CL = 0.1 μF - ensures fast, controlled discharge to prevent latch-up or data corruption
Standby Current5 μA max (IQ(OFF)) - minimizes quiescent drain on battery during system sleep modes

Pinout & Package

Package: WCSP4C (0.9 mm × 0.9 mm, 0.5 mm pitch, 0.5 mm height, 0.9 mg typical weight) - ultra-compact wafer-level chip-scale package optimized for high-density mobile PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
CONTROL (B2)Active-low enable inputDrives internal gate driver; no internal pull-down - requires externally driven logic low to activate switch and discharge
GND (B1)Power ground referenceCommon return path for VIN, VOUT, and CONTROL; must be low-impedance connection to minimize noise coupling
VIN (A2)Main power inputAccepts 0.75–3.6 V supply; requires ≥1.0 μF ceramic capacitor placed adjacent to pin for stability
VOUT (A1)Switched outputDelivers regulated load current; auto-discharged via internal 380 Ω path when CONTROL is high

Key Features

FeatureDesign Value
Ultra-low-voltage operationFunctional down to 0.75 V VIN - enables direct integration with advanced SoC core rails and energy-harvesting sources
Slew-rate controlled switchingProgrammable rise/fall times (e.g., 180 μs tr at 0.75 V) - suppresses inrush current and EMI during hot-swap events
Integrated reverse current blockingHardware-enforced isolation when disabled - eliminates need for external back-to-back FETs or diodes in battery backup paths
Output auto-dischargeOn-chip 380 Ω discharge path - clears residual VOUT charge within 50 μs, preventing unintended wake-up or bus contention
Logic-tolerant CONTROL pinAccepts control signals up to 4.0 V regardless of VIN - simplifies interface with higher-voltage GPIOs without level shifters

Applications

Smartphone Subsystem Power GatingWearable Sensor Hub Management

Use Scenario: Isolating camera module or RF transceiver during deep sleep to reduce system standby current.

IC Role / Device Role / Timing Role: Load switch controlling VDD_IO rail; activated only during active imaging or transmission phases.

Use Value: Reduces leakage by blocking reverse current and discharging VOUT to <100 mV within 50 μs-preventing sensor bias drift and false triggers.

Use Scenario: Sequencing power to MEMS accelerometer and BLE radio based on motion detection interrupt.

IC Role / Device Role / Timing Role: Active-low controlled rail switch enabling deterministic wake-up timing and zero-crossing discharge.

Use Value: Eliminates need for discrete discharge resistor; guarantees VOUT settles before next ADC sampling cycle, improving measurement repeatability.

USB-C Port Power Delivery NegotiationLPDDR4 Memory I/O Rail Control

Use Scenario: Enabling VCONN or auxiliary power rails only after successful USB PD contract negotiation.

IC Role / Device Role / Timing Role: Logic-gated power switch with reverse-blocking protection during cable insertion/removal.

Use Value: Prevents back-feeding into source port during hot-plug; 10 μA max IRB ensures compliance with USB PD 3.0 reverse-current limits.

Use Scenario: Gating memory I/O supply during SoC suspend-to-RAM to eliminate standby leakage.

IC Role / Device Role / Timing Role: Ultra-low-VIN load switch synchronized with memory controller's self-refresh exit signal.

Use Value: Operates at 0.75 V matching LPDDR4 I/O spec; 18.4 mΩ RON avoids violating setup/hold timing margins during rail ramp-up.

Equivalent & Alternatives

The following parts are listed as comparable options for similar load switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TCK207G,LFActive-high CONTROL with internal pull-down; identical RON, IRB, and auto-discharge specsRequires inverted control signal; suitable where host MCU GPIO defaults high or open-drainSelect TCK207G,LF if system uses active-high enable logic and benefits from guaranteed SW OFF on floating CONTROL
TPS22916BYFPR0.65 V min VIN, 17 mΩ RON, active-low, but no integrated auto-discharge; requires external RC networkLacks built-in discharge path - increases BOM count and layout area; slower VOUT decay without tuningChoose TPS22916BYFPR only if lower RON at sub-0.75 V or TI ecosystem alignment outweighs added design complexity

Compared with TCK207G,LF and TPS22916BYFPR, the TCK208G,LF uniquely combines active-low control, guaranteed reverse blocking, and monolithic auto-discharge in a 0.9 mm² WCSP - reducing total solution size and eliminating external discharge components required by alternatives.

Availability

TCK208G,LF is available at Aetrix Electronics and suitable for smartphone subsystem power gating, wearable sensor hub management, USB-C port power delivery negotiation, and LPDDR4 memory I/O rail control requiring stable component supply across high-volume consumer electronics production.

Supply support for TCK208G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures high-efficiency, miniaturized semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on power management and analog signal conditioning.

The TCK208G,LF belongs to Toshiba's ultra-low-voltage load switch IC product line, engineered specifically for power rail isolation and sequencing in space-constrained, battery-operated portable devices operating below 1.0 V.

FAQ

What is the minimum input voltage supported by the TCK208G,LF?

The TCK208G,LF supports a minimum input voltage of 0.75 V, verified across −40°C to 85°C ambient temperature. This enables direct use with sub-1 V processor I/O rails and energy-harvesting sources. Operation below 0.75 V is not guaranteed per Toshiba's absolute maximum ratings and electrical characteristics tables. The TCK208G,LF maintains specified RON, IQ(OFF), and reverse blocking performance down to this threshold.

Does the TCK208G,LF require an external pull-down resistor on the CONTROL pin?

No, the TCK208G,LF does not integrate an internal pull-down resistor on the CONTROL pin-unlike TCK206G and TCK207G. Its CONTROL pin is open-drain compatible and logic-tolerant (up to 4.0 V), but requires active driving to defined high or low states. Leaving CONTROL floating results in undefined output behavior. The TCK208G,LF relies on external circuitry to assert the active-low signal reliably.

How does the reverse current blocking function operate in the TCK208G,LF?

The TCK208G,LF implements hardware-based reverse current blocking by disabling the internal N-channel pass MOSFET (Q1) when the CONTROL pin is high (SW OFF state). This prevents current flow from VOUT to VIN, limiting reverse leakage to ≤10 μA maximum at VOUT = 3.6 V and VIN = 0 V. The function is intrinsic to the device architecture and requires no external components. It is active independently of auto-discharge and remains effective across the full operating temperature range.

What is the purpose of the auto-discharge feature in the TCK208G,LF?

The auto-discharge feature in the TCK208G,LF activates an internal 380 Ω discharge path between VOUT and GND when the CONTROL pin is high (SW OFF state), rapidly draining residual charge from downstream capacitance. This prevents back-powering of upstream sources, avoids false wake-up events, and ensures clean power-down sequencing. Measured VOUT fall time is 50 μs (typ.) under 1.2 V/500 Ω/0.1 μF conditions. The TCK208G,LF integrates this function without requiring external resistors or timers.

Can the TCK208G,LF be used with input voltages above 3.6 V?

No-the TCK208G,LF has an absolute maximum input voltage rating of 4.0 V, but its guaranteed operational range is strictly 0.75 V to 3.6 V per Toshiba's DC characteristics table. Exceeding 3.6 V may cause parametric degradation or reliability risk, even if below the 4.0 V absolute limit. The TCK208G,LF is not rated for 5 V systems. For higher-voltage applications, alternative load switches such as Toshiba's TCK107AG or TI's TPS22975 should be evaluated.

TCK208G,LF Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Package/Case:
4-UFBGA, WLCSP
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Switch Type:
General Purpose
Number of Outputs:
1
Ratio - Input:Output:
1:1
Output Configuration:
High Side
Output Type:
N-Channel
Interface:
On/Off
Voltage - Load:
0.75V ~ 3.6V
Voltage - Supply (Vcc/Vdd):
Not Required
Current - Output (Max):
2A
Rds On (Typ):
18.1mOhm
Input Type:
Non-Inverting
Features:
Load Discharge, Slew Rate Controlled
Fault Protection:
Reverse Current
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
4-WLCSP (0.90x0.90)

TCK208G,LF FAQ

1.How can I place an order for TCK208G,LF through Aetrix?

Please submit a Request for Quotation (RFQ) for TCK208G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCK208G,LF reliable?

The price and inventory of TCK208G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK208G,LF is usually 5 days.

3.What payment methods are accepted for TCK208G,LF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK208G,LF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCK208G,LF?

TCK208G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCK208G,LF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCK208G,LF?

For technical support, including TCK208G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK208G,LF requirements.

6.How does Aetrix verify that TCK208G,LF is sourced from the original manufacturer or authorized distributors?

All TCK208G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK208G,LF meets industry standards.

7.What is the process for return or replacement of TCK208G,LF?

All TCK208G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK208G,LF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCK208G,LF part is unused and in its original packaging.

Return procedure for TCK208G,LF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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