Toshiba Semiconductor and Storage TCK22910G,LF
- Part No.:
- TCK22910G,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 6-UFBGA, WLCSP
- Datasheet:
-
TCK22910G,LF.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 WCSP6E
- Quantity:
- Payment:

- Shipping:

Inventory:3,281
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Product details
Overview
TCK22910G,LF from Toshiba Electronic Devices & Storage Corporation is a 2 A load switch IC with true reverse current blocking, active-low control, and thermal shutdown-designed for power rail sequencing in space-constrained portable electronics. It delivers 31 mΩ typical RON at 5.0 V input, 11 μA quiescent current in ON state, and operates across 1.1–5.5 V input range.
For engineers reviewing the TCK22910G,LF datasheet, TCK22910G,LF pinout, TCK22910G,LF application, or TCK22910G,LF equivalent, key selection criteria include its ultra-low standby current (0.6 μA), built-in UVLO with 0.82 V rising threshold, absence of output auto-discharge, and WCSP6E package compatibility with high-density PCB layouts.
Technical Context
The TCK22910G,LF integrates a low-RON N-channel MOSFET power switch with true reverse current blocking (TRCB) circuitry that actively blocks reverse conduction regardless of switch state. Its active-low control logic enables direct interfacing with open-drain or push-pull microcontroller GPIOs without external pull-down resistors.
Thermal shutdown activates at ~170°C junction temperature with 20°C hysteresis, while under-voltage lockout (UVLO) disables the switch when VIN falls below 0.82 V (rising) or 0.77 V (falling). The device lacks output auto-discharge and internal control-to-GND pull-down-distinguishing it from TCK22911G/TCK22913G variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Output Current | 2.0 A DC continuous-supports USB-powered peripherals and PMIC secondary rails. |
| RON @ 5.0 V | 31 mΩ typ.-minimizes voltage drop and power loss at full load (62 mW dissipation). |
| IQ (ON) | 11 μA typ. @ 5.5 V-enables always-on system monitoring without battery drain penalty. |
| IQ(OFF) | 0.6 μA typ.-critical for long-term storage or sleep-mode power budgeting in IoT endpoints. |
| Input Voltage Range | 1.1–5.5 V-covers single-cell Li-ion (3.0–4.2 V), coin cell (1.5–3.0 V), and 3.3/5.0 V logic rails. |
| UVLO Threshold | 0.82 V (rising), 0.77 V (falling)-prevents erratic switching during brown-out or battery depletion. |
| Reverse Blocking Voltage | 35 mV threshold-ensures robust blocking even with small VOUT–VIN differentials. |
Pinout & Package
Supplied in ultra-compact WCSP6E package (0.8 mm × 1.2 mm, 0.55 mm height, 1 mg weight) with 0.4 mm pitch-optimized for smartphone camera modules and wearable sensor hubs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1, B1 | VOUT | Switched output node-tied together internally; must connect to load capacitance and decoupling. |
| C1 | GND | Power ground reference-requires low-inductance connection to PCB ground plane. |
| A2, B2 | VIN | Input power rail-accepts 1.1–5.5 V; requires ≥1.0 μF ceramic capacitor near pins. |
| C2 | Control | Active-low enable-driven low to turn on switch; floats to OFF due to no internal pull-down. |
Key Features
| Feature | Design Value |
|---|---|
| True Reverse Current Blocking | Active at all times-even during switch OFF or transient overvoltage-eliminates need for external back-to-back FETs. |
| Thermal Shutdown with Hysteresis | Triggers at ~170°C and releases at ~150°C-prevents thermal runaway in sealed enclosures without external sensors. |
| Ultra-Low Standby Current | 0.6 μA max OFF-state leakage-extends shelf life of battery-powered medical patches and asset trackers. |
| Low RON Across Input Range | 141 mΩ @ 1.2 V ensures usable efficiency down to near-dead battery voltages in wearables. |
| UVLO with Built-in Hysteresis | 50 mV hysteresis prevents oscillation during slow VIN ramp-up-critical for linear charger outputs. |
Applications
| Smartphone Camera Module Power | Wireless Earbud Charging Case |
|---|---|
|
Use Scenario: Sequencing power to CMOS image sensor and ISP after system wake-up. IC Role / Device Role / Timing Role: Load switch enabling clean, slew-controlled VDDIO rail activation with reverse current isolation. Use Value: Prevents backfeed from sensor's internal LDO into main PMIC during hot-plug events-avoids system reset. |
Use Scenario: Isolating charging circuitry from battery during case lid closure. IC Role / Device Role / Timing Role: Low-leakage power gate between battery and Qi receiver coil driver. Use Value: 0.6 μA OFF-state current extends idle time by >12 months-meets UL2054 shelf-life requirements. |
| Portable ECG Patch | BLE Beacon Sensor Node |
|
Use Scenario: Enabling analog front-end only during measurement bursts to conserve battery. IC Role / Device Role / Timing Role: Precision power switch with sub-100 μA total quiescent overhead. Use Value: 11 μA ON-state IQ allows 10-second sampling every 60 seconds without degrading 2-year battery life. |
Use Scenario: Power gating environmental sensors (temp/humidity) between BLE advertising intervals. IC Role / Device Role / Timing Role: High-efficiency rail switch with fast 5 μs turn-off delay to minimize leakage. Use Value: 5 μs tOFF reduces sensor bias time by 92% vs. discrete FET solutions-cuts average current by 18 μA. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS22916BYFPR | Active-high control, 37 mΩ RON, includes auto-discharge, 0.5 μA IQ(OFF). | Requires inverted control signal; auto-discharge may cause unwanted VOUT collapse in systems needing hold-up caps. | Select when active-high logic simplifies MCU GPIO routing and output discharge is required for safety compliance. |
| AP22653AW5-7 | Active-low control, 42 mΩ RON, no UVLO, 1.2 μA IQ(OFF), no TRCB. | Lacks true reverse blocking-requires external diode for backfeed protection in multi-rail systems. | Select for cost-sensitive consumer audio where reverse current risk is mitigated by system architecture. |
Compared with TCK22910G,LF, the TPS22916BYFPR offers lower standby current but mandates control inversion and adds discharge timing complexity, while the AP22653AW5-7 sacrifices reverse blocking and UVLO for lower unit cost-making TCK22910G,LF optimal for compact, safety-critical portable power domains.
Availability
TCK22910G,LF is available at Aetrix Electronics and suitable for smartphone camera modules, wireless earbud charging cases, portable ECG patches, BLE beacon sensor nodes, and other high-density portable electronics requiring stable component supply with guaranteed long-term availability.
Supply support for TCK22910G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor components for automotive, industrial, and consumer applications-with emphasis on power efficiency, miniaturization, and functional safety.
The TCK2291xG series targets ultra-compact portable electronics requiring precise power rail control, true reverse current isolation, and minimal quiescent consumption-addressing design constraints in smartphones, wearables, and medical patches.
FAQ
What is the control logic polarity of the TCK22910G,LF?
The TCK22910G,LF uses active-low control logic: the internal power switch turns ON when the Control pin voltage is below 0.4 V (VIL), and turns OFF when above 1.0 V (VIH). Unlike TCK22912G/TCK22913G, it has no internal pull-down resistor-so the Control pin must be actively driven or externally pulled low to ensure reliable OFF-state behavior. This characteristic is explicitly confirmed in the Function Table for TCK22910G,LF.
Does the TCK22910G,LF provide output auto-discharge functionality?
No, the TCK22910G,LF does not include output auto-discharge. Per the Function Table, "Output auto-discharge" is marked "N/A" for TCK22910G,LF-distinguishing it from TCK22911G and TCK22913G variants. When the switch turns OFF, VOUT remains floating unless an external discharge path (e.g., resistor or FET) is added. This omission simplifies timing control in applications requiring hold-up voltage retention, such as memory backup rails.
What is the maximum continuous output current rating for the TCK22910G,LF?
The TCK22910G,LF supports 2.0 A DC continuous output current, as specified in the Absolute Maximum Ratings table under "Output current (DC)". This rating assumes proper PCB thermal design per Toshiba's recommended glass-epoxy board layout (40 mm × 40 mm, 50% copper coverage). Pulse current up to 3.0 A is allowed for ≤100 μs at 2% duty cycle-suitable for short-duration motor or flash LED loads.
How does the true reverse current blocking (TRCB) function operate in the TCK22910G,LF?
The TCK22910G,LF implements true reverse current blocking via dedicated circuitry that actively monitors VOUT–VIN differential voltage. When VOUT exceeds VIN by more than 35 mV (VRB threshold), the TRCB circuit engages-blocking conduction regardless of the main switch's ON/OFF state. This full-time protection eliminates reliance on body diode behavior and prevents backfeed in multi-source systems, such as USB OTG configurations where VOUT may be powered externally while VIN is inactive.
What package type and dimensions does the TCK22910G,LF use?
The TCK22910G,LF is housed in the WCSP6E wafer-level chip-scale package: 0.8 mm × 1.2 mm footprint, 0.55 mm height, and 0.4 mm pin pitch. Its land pattern and mechanical drawings are documented in Toshiba's Package Dimension drawing (TCK2291xG, page 13–14). This ultra-small form factor enables placement beneath camera modules or within <5 mm² wearable PCB areas-verified by Toshiba's stated target application: cellular phone high-density assembly.
TCK22910G,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 6-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 1.1V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2A
- Rds On (Typ):
- 31mOhm
- Input Type:
- Non-Inverting
- Features:
- -
- Fault Protection:
- Over Temperature, Reverse Current, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WCSPE (0.80x1.2)
TCK22910G,LF FAQ
1.How can I place an order for TCK22910G,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCK22910G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCK22910G,LF reliable?
The price and inventory of TCK22910G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK22910G,LF is usually 5 days.
3.What payment methods are accepted for TCK22910G,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK22910G,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCK22910G,LF?
TCK22910G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCK22910G,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCK22910G,LF?
For technical support, including TCK22910G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK22910G,LF requirements.
6.How does Aetrix verify that TCK22910G,LF is sourced from the original manufacturer or authorized distributors?
All TCK22910G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK22910G,LF meets industry standards.
7.What is the process for return or replacement of TCK22910G,LF?
All TCK22910G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK22910G,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCK22910G,LF part is unused and in its original packaging.
Return procedure for TCK22910G,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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