Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Toshiba Semiconductor and Storage TCK22921G,LF

Part No.:
TCK22921G,LF
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Power Distribution Switches, Load Drivers
Package:
6-UFBGA, WLCSP
Datasheet:
AetrixTCK22921G,LF.pdf
Description:
IC PWR SWITCH P-CHAN 1:1 WCSP6E
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,785

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TCK22921G,LF from Toshiba Electronic Devices & Storage Corporation is a 2 A, 25 mΩ low-RON load switch IC with slew rate control and integrated output auto-discharge, designed for power sequencing in portable electronics. It operates across 1.1–5.5 V input, delivers 4.5 μs VOUT rise time at 5 V, and features reverse current blocking when VIN = 0 V - ideal for USB-powered mobile device subsystems.

For engineers reviewing the TCK22921G,LF datasheet, TCK22921G,LF pinout, TCK22921G,LF application, or TCK22921G,LF equivalent, key selection criteria include confirmed 25 mΩ RON at 5 V/−0.5 A, ultra-small WCSP6E package (0.8 mm × 1.2 mm), active-high control with internal pull-down, and guaranteed output auto-discharge functionality.

Technical Context

The TCK22921G,LF integrates a p-channel MOSFET pass switch with a dedicated slew rate control driver and a parallel n-channel discharge FET. Its control logic enables precise turn-on timing (3 μs tON) and fast VOUT ramp-up (4.5 μs tr) while maintaining reverse current blocking when VIN = 0 V.

It supports wide-input operation (1.1–5.5 V), exhibits ultra-low quiescent current (0.1 μA typ. in ON state at 1.8–5.5 V), and includes Schmitt-triggered control input with built-in pull-down - ensuring defined OFF-state behavior without external biasing.

Key Specifications

Parameter Value and Actual Design Meaning
Max Output Current 2.0 A DC - supports high-current peripherals like camera modules or USB Type-C sink paths.
ON Resistance 25 mΩ typ. at VIN = 5.0 V, IOUT = −0.5 A - minimizes voltage drop and power loss in battery-fed rails.
VOUT Rise Time 4.5 μs at VIN = 5 V, RL = 5 Ω, CL = 1.0 μF - enables controlled power-up to prevent inrush-induced rail collapse.
Quiescent Current 0.1 μA typ. in ON state (VIN = 1.8–5.5 V) - preserves battery life during standby in always-on subsystems.
Input Voltage Range 1.1 V to 5.5 V - compatible with Li-ion, Li-poly, and regulated 1.2/1.8/3.3/5.0 V supply domains.
Reverse Blocking Active when VIN = 0 V - prevents backfeed from powered outputs into unpowered inputs (e.g., dead battery scenarios).
Output Auto-Discharge Built-in - actively discharges VOUT via internal 100 Ω discharge path upon shutdown, eliminating residual voltage hold-up.

Pinout & Package

Package: WCSP6E (0.8 mm × 1.2 mm, thickness 0.55 mm, 0.4 mm pitch, 1 mg typical weight). Ultra-compact wafer-level chip-scale package optimized for high-density mobile PCB layouts.

Pin/Terminal Circuit Role Design Meaning
A1, B1 VOUT Switched output node - connects to load; internally tied together for current sharing and low-inductance routing.
C1 GND Power ground reference - must be connected to system ground plane for thermal and noise integrity.
A2, B2 VIN Input power supply - accepts 1.1–5.5 V; dual pins reduce IR drop and improve thermal dissipation.
C2 Control Active-high enable input with Schmitt trigger and internal pull-down - ensures safe default-OFF state; no external resistor required.

Key Features

Feature Design Value
Slew Rate Control Driver Guarantees 4.5 μs VOUT rise time - eliminates inrush current spikes that destabilize shared input rails.
Integrated Output Auto-Discharge 100 Ω internal discharge path - clears VOUT within milliseconds after disable, preventing unintended wake-up or latch-up.
Reverse Current Blocking Functional at VIN = 0 V - blocks backflow from VOUT to VIN, critical for multi-rail systems with independent power domains.
Ultra-Low Quiescent Current 0.1 μA typ. in ON state - enables >10-year battery shelf life in always-connected IoT sensors or wearables.
Internal Pull-Down on Control Ensures defined OFF state with open-control condition - removes need for external biasing and reduces BOM count.

Applications

Smartphone Power Sequencing USB-C Peripheral Switching

Use Scenario: Enabling/disabling camera or display submodules during sleep/wake transitions in smartphones.

IC Role / Device Role / Timing Role: Load switch controlling 3.3 V or 5 V auxiliary rail with precise slew-controlled turn-on to avoid brownout.

Use Value: Prevents system reset caused by inrush current; auto-discharge eliminates ghost power on disconnected modules.

Use Scenario: Isolating USB-C data/power paths during hot-plug detection or port negotiation.

IC Role / Device Role / Timing Role: Bidirectional isolation switch with reverse-blocking and fast 4.5 μs enable for protocol-compliant power delivery handshaking.

Use Value: Ensures clean VBUS ramp-up per USB PD spec; blocks backfeed when upstream port is unpowered.

Wearable Sensor Hub Power Gating Bluetooth Earbud Battery Management

Use Scenario: Gating power to MEMS accelerometers or environmental sensors during firmware idle cycles.

IC Role / Device Role / Timing Role: Low-leakage (0.02 μA OFF-state) power gate with sub-μA quiescent draw to extend sensor node battery life.

Use Value: Reduces average system current by >95% during sleep; auto-discharge prevents sensor output latching.

Use Scenario: Managing charging circuitry and audio codec power domains in true wireless stereo earbuds.

IC Role / Device Role / Timing Role: Dual-rail switch (VIN = 4.2 V battery, VOUT = 3.3 V LDO input) with 25 mΩ RON to minimize voltage sag.

Use Value: Maintains stable codec supply under dynamic load; reverse blocking protects battery during case-charging events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar load switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
TCK22922G,LF Rise time = 666 μs (vs. 4.5 μs); same RON, package, and auto-discharge. Slower turn-on suits non-critical rails where inrush control is less stringent (e.g., backlight vs. processor core). Select when slower slew avoids EMI concerns but same footprint and discharge function are required.
TPS22916BYFPR 2.2 A max, 27 mΩ RON, 1.8–5.5 V range, no auto-discharge, 0.5 μA IQ (ON), DSBGA6 package (0.9 mm × 1.2 mm). Lacks output discharge; requires external circuitry for VOUT clearing; larger footprint than WCSP6E. Choose if auto-discharge is unnecessary and board space allows 0.1 mm larger package; verify layout compatibility.

Compared with TCK22921G,LF, TCK22922G,LF trades speed for EMI reduction while retaining identical form factor and discharge capability, whereas TPS22916BYFPR offers comparable current rating but omits auto-discharge and uses a slightly larger package - impacting high-density portable designs.

Availability

TCK22921G,LF is available at Aetrix Electronics and suitable for smartphone power sequencing, USB-C peripheral switching, and wearable sensor hub power gating requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for TCK22921G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power management, logic, and analog ICs for consumer, industrial, and automotive markets.

The TCK2292xG series targets ultra-compact, low-power load switching in space-constrained portable electronics - emphasizing slew control, auto-discharge, and minimal quiescent current for battery longevity.

FAQ

What is the maximum continuous output current rating for the TCK22921G,LF?

The TCK22921G,LF is rated for 2.0 A DC continuous output current under specified thermal conditions. This rating assumes proper PCB layout with adequate copper area for heat dissipation, as defined in Toshiba's absolute maximum ratings (Ta ≤ 85°C, PD ≤ 800 mW on FR4 board). Pulse current up to 3.0 A is allowed for short durations (100 μs, 2% duty cycle).

Does the TCK22921G,LF include output auto-discharge, and how does it function?

Yes, the TCK22921G,LF includes built-in output auto-discharge. When the Control pin is driven low, the internal n-channel discharge FET activates, pulling VOUT to GND through a 100 Ω path. This ensures rapid discharge of output capacitance - critical for preventing residual voltage from causing unintended wake-up or latch-up in downstream circuits.

What is the typical ON resistance of the TCK22921G,LF, and at what conditions is it specified?

The TCK22921G,LF has a typical ON resistance of 25 mΩ, measured at VIN = 5.0 V and IOUT = −0.5 A. This value increases at lower input voltages: 31 mΩ at 3.3 V, 52 mΩ at 1.8 V, and 104 mΩ at 1.2 V. The RON specification directly impacts voltage drop and conduction loss in the switched rail.

How does the reverse current blocking feature operate in the TCK22921G,LF?

The TCK22921G,LF provides reverse current blocking when VIN = 0 V - meaning it prevents current flow from VOUT back into the VIN node. This function is enabled by an internal circuit that isolates the p-channel pass FET's body diode path. It is essential in multi-rail systems where one domain may remain powered while another is shut down (e.g., battery-dead scenario).

What package type and dimensions does the TCK22921G,LF use, and why is it suited for portable designs?

The TCK22921G,LF uses the WCSP6E package: 0.8 mm × 1.2 mm, 0.55 mm thick, with 0.4 mm pitch and 1 mg typical weight. Its wafer-level chip-scale construction eliminates leads and minimizes footprint - enabling placement in tight spaces such as smartphone camera modules or Bluetooth earbud PCBs where board area is at a premium.

TCK22921G,LF Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Package/Case:
6-UFBGA, WLCSP
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Switch Type:
General Purpose
Number of Outputs:
1
Ratio - Input:Output:
1:1
Output Configuration:
High Side
Output Type:
P-Channel
Interface:
On/Off
Voltage - Load:
1.1V ~ 5.5V
Voltage - Supply (Vcc/Vdd):
Not Required
Current - Output (Max):
2A
Rds On (Typ):
25mOhm
Input Type:
Non-Inverting
Features:
Load Discharge, Slew Rate Controlled
Fault Protection:
Reverse Current
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-WCSPE (0.80x1.2)

TCK22921G,LF FAQ

1.How can I place an order for TCK22921G,LF through Aetrix?

Please submit a Request for Quotation (RFQ) for TCK22921G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCK22921G,LF reliable?

The price and inventory of TCK22921G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK22921G,LF is usually 5 days.

3.What payment methods are accepted for TCK22921G,LF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK22921G,LF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCK22921G,LF?

TCK22921G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCK22921G,LF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCK22921G,LF?

For technical support, including TCK22921G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK22921G,LF requirements.

6.How does Aetrix verify that TCK22921G,LF is sourced from the original manufacturer or authorized distributors?

All TCK22921G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK22921G,LF meets industry standards.

7.What is the process for return or replacement of TCK22921G,LF?

All TCK22921G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK22921G,LF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCK22921G,LF part is unused and in its original packaging.

Return procedure for TCK22921G,LF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TCK22921G,LF Tags

  • TCK22921G,LF
  • TCK22921G,LF PDF
  • TCK22921G,LF Datasheet
  • TCK22921G,LF Specifications
  • TCK22921G,LF Images
  • Toshiba Semiconductor and Storage
  • Toshiba Semiconductor and Storage TCK22921G,LF
  • Buy TCK22921G,LF
  • TCK22921G,LF Price
  • TCK22921G,LF Distributor
  • TCK22921G,LF Supplier
  • TCK22921G,LF Wholesale
Related Products
TPS22919DCKR
TPS22919DCKR

Texas Instruments

MIC2091-1YM5-TR
MIC2091-1YM5-TR

Microchip Technology

MIC2090-1YM5-TR
MIC2090-1YM5-TR

Microchip Technology

TPS22995RZFR
TPS22995RZFR

Texas Instruments

TPS22975DSGR
TPS22975DSGR

Texas Instruments

SIP32510DT-T1-GE3
SIP32510DT-T1-GE3

Vishay Siliconix

ULN2003D1013TR
ULN2003D1013TR

STMicroelectronics

MIC2005A-1YM5-TR
MIC2005A-1YM5-TR

Microchip Technology

MIC2005A-1YM6-TR
MIC2005A-1YM6-TR

Microchip Technology

TPS22916BYFPR
TPS22916BYFPR

Texas Instruments

TPS22917DBVR
TPS22917DBVR

Texas Instruments

ULN2003APWR
ULN2003APWR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER