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Toshiba Semiconductor and Storage TCK22922G,LF
- Part No.:
- TCK22922G,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 6-UFBGA, WLCSP
- Datasheet:
-
TCK22922G,LF.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 WCSP6E
- Quantity:
- Payment:
- Shipping:
Inventory:4,990
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Product details
Overview
TCK22922G,LF from Toshiba Electronic Devices & Storage Corporation is a 2 A, 25 mΩ load switch IC with slew rate control and output auto-discharge, designed for power management in space-constrained portable systems. It operates from 1.1 V to 5.5 V input, delivers 666 μs controlled VOUT rise time, and integrates reverse current blocking when VIN = 0 V - enabling safe rail sequencing in battery-powered mobile devices.
For engineers reviewing the TCK22922G,LF datasheet, TCK22922G,LF pinout, TCK22922G,LF application, or TCK22922G,LF equivalent, key selection criteria include confirmed slew-rate programmability (666 μs), integrated discharge path, ultra-small WCSP6E package (0.8 mm × 1.2 mm), and guaranteed 2 A DC output capability under 5.5 V input.
Technical Context
The TCK22922G,LF implements a p-channel MOSFET pass switch with integrated slew rate control driver and n-channel discharge FET. Its active-high control logic includes internal pull-down, ensuring default OFF state without external biasing. Reverse current blocking activates automatically when VIN = 0 V, isolating VOUT from backfeed paths.
Electrical behavior is characterized across 1.1–5.5 V input range: ON-resistance varies from 136 mΩ at 1.1 V to 25 mΩ at 5.0 V (−0.5 A), while quiescent current remains ≤1.4 μA in ON state and ≤0.4 μA in OFF state. Rise time is fixed at 666 μs (VIN = 5.0 V, RL = 5 Ω, CL = 1.0 μF), with 10 μs fall time and 380 μs turn-on delay.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 1.1 V to 5.5 V - supports single-cell Li-ion, USB, and multi-rail PMIC outputs without level-shifting. |
| Max Continuous Output Current | 2.0 A DC - enables direct powering of moderate-load subsystems (e.g., camera modules, RF front-ends). |
| ON Resistance (RON) | 25 mΩ typ. at VIN = 5.0 V, IOUT = −0.5 A - limits conduction loss to <6.25 mW at 0.5 A, reducing thermal stress. |
| VOUT Rise Time (tr) | 666 μs - mitigates inrush current during hot-swap events and prevents supply rail collapse on capacitive loads. |
| Output Auto-Discharge | Built-in - discharges VOUT via 100 Ω internal path when disabled, eliminating residual voltage that could interfere with downstream logic. |
| Reverse Current Blocking | Active when VIN = 0 V - prevents backflow from powered VOUT to unpowered VIN rail, critical for battery isolation. |
| Quiescent Current (IQ) | 1.4 μA max at VIN = 5.5 V, ON state - minimizes standby power draw in always-on subsystems. |
Pinout & Package
Package: WCSP6E (0.8 mm × 1.2 mm, thickness 0.55 mm), ultra-compact wafer-level chip-scale package with 0.4 mm pitch, optimized for high-density mobile PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1, B1 | VOUT | Switched output node - connects to load; dual pins reduce IR drop and improve current handling. |
| C1 | GND | Power ground reference - shared return path for switch and control circuitry; must be low-impedance. |
| A2, B2 | VIN | Input power rail - accepts 1.1–5.5 V supply; dual pins lower parasitic resistance and enhance thermal dissipation. |
| C2 | Control | Active-high enable input - internal ~few-MΩ pull-down ensures OFF state if left floating; Schmitt trigger improves noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Slew Rate Control | Fixed 666 μs VOUT rise time - eliminates need for external RC networks while guaranteeing inrush current <750 mA into 1 μF load. |
| Output Auto-Discharge | Integrated 100 Ω discharge path - clears VOUT to GND within ~10 ms after disable, preventing latch-up in cascaded regulators. |
| Reverse Current Blocking | Automatic activation at VIN = 0 V - removes requirement for external back-to-back MOSFETs in battery backup paths. |
| Ultra-Small WCSP6E Package | 0.8 mm × 1.2 mm footprint - saves >60% board area vs. comparable SOT-23-6 switches, enabling thinner smartphone bezels. |
| Low Quiescent Current | ≤1.4 μA in ON state - extends battery life in always-on sensor hubs and wearable sleep-mode circuits. |
Applications
| Smartphone Power Rail Sequencing | Wireless Earbud Battery Management |
|---|---|
Use Scenario: Controlled power-up of camera module and display backlight in multi-rail smartphone architecture. IC Role / Device Role / Timing Role: Load switch with slew-controlled turn-on and auto-discharge, managing VOUT ramp timing and residual voltage clearance between rail transitions. Use Value: Prevents supply droop during simultaneous capacitor charging and avoids logic glitches caused by lingering VOUT voltage after rail shutdown. |
Use Scenario: Isolating charging circuitry from main battery during wireless charging cycles in true wireless stereo (TWS) earbuds. IC Role / Device Role / Timing Role: Bidirectional isolation switch with reverse current blocking and fast discharge, enabling safe hot-swap between battery and Qi receiver. Use Value: Eliminates risk of backfeed from charged battery into low-efficiency charging IC, improving thermal safety and charge efficiency. |
| Portable Medical Sensor Hub | IoT Edge Node Subsystem Enable |
Use Scenario: Enabling/disabling ECG analog front-end and Bluetooth LE radio independently to meet FDA low-power diagnostic requirements. IC Role / Device Role / Timing Role: Low-IQ load switch providing precise power gating with sub-μA standby draw and controlled wake-up slew rate. Use Value: Extends single-charge operation beyond 72 hours while meeting strict electromagnetic compatibility (EMC) limits on transient currents. |
Use Scenario: Powering GPS/GNSS receiver and LoRa transceiver only during scheduled data upload windows in battery-operated environmental sensors. IC Role / Device Role / Timing Role: High-reliability enable switch with guaranteed 2 A delivery and thermal derating support up to 85°C ambient. Use Value: Ensures full transmit power delivery without voltage sag, maintaining link budget integrity in remote rural deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCK22921G,LF | Rise time = 4.5 μs (vs. 666 μs); same package, auto-discharge, and RON specs. | Suitable where fast turn-on is required (e.g., processor core rails), not for inrush-sensitive peripherals. | Select TCK22921G,LF only when system-level inrush tolerance allows sub-5 μs rise; otherwise TCK22922G,LF provides safer margin. |
| TCK22972G,LF | No output auto-discharge; identical rise time (666 μs), RON, and package; shares same control interface. | Preferred in cost-sensitive designs where external discharge circuitry already exists or is unnecessary. | Choose TCK22972G,LF when VOUT discharge is handled externally or omitted entirely; TCK22922G,LF reduces BOM count by integrating discharge. |
Compared with TCK22921G,LF and TCK22972G,LF, the TCK22922G,LF uniquely balances controlled inrush suppression (666 μs) with autonomous VOUT discharge - making it optimal for subsystems requiring both hot-swap safety and automatic rail cleanup without added components.
Availability
TCK22922G,LF is available at Aetrix Electronics and suitable for smartphone power sequencing, wireless earbud battery isolation, portable medical sensor hubs, and IoT edge node subsystem enable requiring stable component supply, long-lifecycle assurance, and RoHS-compliant packaging.
Supply support for TCK22922G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-efficiency, miniaturized semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on power management and analog integration.
The TCK2292xG series targets ultra-compact portable electronics requiring reliable, low-standby-power load switching - specifically engineered to replace discrete MOSFET + RC solutions in space- and thermal-constrained mobile platforms.
FAQ
What is the maximum continuous output current rating for TCK22922G,LF?
The TCK22922G,LF is rated for 2.0 A DC continuous output current under specified thermal conditions (Ta ≤ 85°C, mounted on FR4 board per datasheet test setup). Pulse current capability reaches 3.0 A for 100 μs pulses at 2% duty cycle. Exceeding these limits risks thermal shutdown or permanent damage.
Does TCK22922G,LF require an external pull-down resistor on the Control pin?
No. The TCK22922G,LF includes an internal pull-down resistor (~few MΩ) on the Control pin, ensuring a defined LOW state and default OFF operation when the pin is left unconnected. This eliminates the need for external biasing components in most implementations.
How does the output auto-discharge function operate in TCK22922G,LF?
When the Control pin is driven LOW, the TCK22922G,LF activates an internal n-channel MOSFET with ~100 Ω on-resistance between VOUT and GND. This discharges attached capacitance - clearing residual voltage from downstream circuits within milliseconds, preventing unintended wake-up or logic contention.
What is the typical ON-resistance of TCK22922G,LF at 3.3 V input?
At VIN = 3.3 V and IOUT = −0.5 A, the TCK22922G,LF exhibits a typical ON-resistance of 31 mΩ, with a maximum of 53 mΩ over temperature (−40°C to 85°C). This value directly determines conduction loss (P = I²R) and junction temperature rise under load.
Can TCK22922G,LF block reverse current when VIN is disconnected?
Yes. The TCK22922G,LF incorporates a dedicated reverse current blocking circuit that activates automatically when VIN = 0 V. This prevents current flow from a powered VOUT rail back into the VIN node - essential for battery-backed or multi-source power architectures.
TCK22922G,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 6-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 1.1V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2A
- Rds On (Typ):
- 25mOhm
- Input Type:
- Non-Inverting
- Features:
- Load Discharge, Slew Rate Controlled
- Fault Protection:
- Reverse Current
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WCSPE (0.80x1.2)
TCK22922G,LF FAQ
1.How can I place an order for TCK22922G,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCK22922G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCK22922G,LF reliable?
The price and inventory of TCK22922G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK22922G,LF is usually 5 days.
3.What payment methods are accepted for TCK22922G,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK22922G,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCK22922G,LF?
TCK22922G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCK22922G,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCK22922G,LF?
For technical support, including TCK22922G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK22922G,LF requirements.
6.How does Aetrix verify that TCK22922G,LF is sourced from the original manufacturer or authorized distributors?
All TCK22922G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK22922G,LF meets industry standards.
7.What is the process for return or replacement of TCK22922G,LF?
All TCK22922G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK22922G,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCK22922G,LF part is unused and in its original packaging.
Return procedure for TCK22922G,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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